STM32F745VGH6 - 216MHz Cortex-M7 MCU, 1MB Flash | STMicroelectronics
부품 번호: STM32F745VGH6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $13.1131 | $13.11 |
| 10 | $13.1131 | $131.13 |
| 100 | $13.1131 | $1,311.31 |
| 500 | $13.1131 | $6,556.55 |
| 1,000 | $13.1131 | $13,113.10 |
STM32F745VGH6 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals into one component. In the embedded-device hierarchy, this MCU belongs to the STM32 family, uses the Arm Cortex-M7 processor architecture, and sits within the broader category of embedded semiconductors. Its 32-bit RISC core executes control, communications, signal-processing, and real-time workloads while consuming less power than many application processors.
The verified device data identifies the STM32F745VGH6 as part of the STM32F7 high-performance series. The STM32F745xx and STM32F746xx families are based on the Arm Cortex-M7 core and operate at up to 216 MHz. The H6 ordering suffix denotes the exact ordering variant, while the 100-TFBGA package provides 100 solderable BGA contacts in an 8 x 8 mm footprint.
Key engineering considerations include adequate PCB routing for the dense BGA land pattern, careful power and decoupling layout, boot configuration, clock stability, and firmware support for every peripheral used. Because the verified search results do not provide a complete pin-by-pin mapping, voltage limits, memory-map details, GPIO count, or peripheral inventory, those values must be confirmed in the manufacturer datasheet before schematic capture or PCB release.
Typical applications include industrial automation controllers, connected industrial equipment, high-speed human-interface systems, audio and digital signal-processing equipment, communications infrastructure, and embedded gateways. The 216 MHz Cortex-M7 performance is particularly useful for workloads combining real-time control with substantial data movement, although actual throughput depends on memory access, cache behavior, peripherals, and firmware optimization.
Design work should begin with the official STM32F745VG documentation and the exact package drawing. Verify every BGA ball, exposed pad connection, power domain, decoupling value, and pin-multiplex alternative before layout. Do not substitute an LQFP footprint or an MCU with fewer I/O resources without a controlled redesign and firmware review.
This page combines verified manufacturer and distributor information, commercial availability references, and engineering-oriented selection guidance. It is intended to support early sourcing decisions while clearly separating confirmed data from parameters that still require datasheet verification.
드롭인 대체품: STM32F745VGH6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청STM32F745VGH6 최대 정격 & 전기적 특성
| Product Type | 32-bit microcontroller IC |
| Processor Core | Arm Cortex-M7 |
| Instruction Architecture | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 1 MB (1M x 8) |
| 패키지 | 100-TFBGA (8 x 8 mm) |
| 핀 수 | 100 BGA contacts |
| 실장 유형 | Surface mount |
| Core Family | STM32F7 series |
| Device Family | STM32F745xx |
| Related High-Performance Family | STM32F746xx |
STM32F745VGH6 100-tfbga (8 x 8 mm) 핀 구성 가이드
STM32F745VGH6(100-tfbga (8 x 8 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F745VGH6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F745VGH6 적합 용도: 6 애플리케이션s: Industrial Automation Controller, High-Speed Communications Gateway, Digital Signal Processing System, Connected Audio and Interface Equipment, Human-Machine Interface Controller, Programmable Test and Measurement Equipment.
Industrial Automation Controller
The STM32F745VGH6 fits an industrial controller that must combine real-time control with communications, diagnostics, and data preparation. Its Arm Cortex-M7 core operates up to 216 MHz, providing substantial control-loop headroom, while 1 MB of flash can hold application firmware, communication stacks, and diagnostics. Place the 100-TFBGA device beside local sensors and power-control interfaces, then isolate analog and high-current paths on the PCB. Confirm exact I/O availability, supply rails, timer mappings, and operating-temperature limits in the manufacturer documentation before freezing the design.
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High-Speed Communications Gateway
The 216 MHz Cortex-M7 core and 1 MB flash configuration make STM32F745VGH6 suitable for an embedded communications gateway handling protocol processing and control traffic. The device can sit between physical-layer transceivers and a network processor, provided its exact Ethernet, USB, serial, and DMA resources are verified. Keep high-speed clocks, interfaces, and power supplies routed away from sensitive analog sections. Because the supplied evidence does not enumerate the peripheral set, firmware bring-up must begin with the exact reference manual and pin table rather than assumptions based on the STM32 family name.
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Digital Signal Processing System
STM32F745VGH6 is relevant for embedded DSP when the Cortex-M7's 216 MHz execution capability can support filtering, transforms, or waveform control while retaining local flash-based firmware. Its benefit is integration: control code, signal processing, and peripheral management can run in one microcontroller instead of requiring a separate processor. Validate cache behavior, memory bandwidth, timer synchronization, and peripheral DMA paths in the exact device documentation. The 100-TFBGA footprint also demands fine-pitch assembly capability, so prototype fabrication and inspection should be planned alongside software bring-up.
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Connected Audio and Interface Equipment
The STM32F745VGH6 can serve as the control processor in connected audio equipment, instrument panels, or multimedia interfaces where a fast 32-bit core and 1 MB flash support application logic and real-time control. Pair it with an audio codec or DAC through verified digital interfaces and keep analog audio routing separate from switching and clock-distribution circuitry. Exact I/O mapping, audio clock support, DMA behavior, and peripheral availability are not established by the supplied search snippets, so the engineer must select audio interfaces only after reviewing the official pin table and electrical characteristics.
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Human-Machine Interface Controller
STM32F745VGH6 is suitable for a graphical or touch-based human-machine interface when the design benefits from a 216 MHz Cortex-M7 and consolidated firmware storage. It can coordinate display updates, touch or keypad input, communications, and application logic in one package. The 8 x 8 mm 100-TFBGA outline supports compact products but requires careful escape routing and a reliable assembly process. Verify LCD or display-interface availability, external memory requirements, operating-temperature range, and pin multiplexing in the exact STM32F745VGH6 documentation before selecting companion display components.
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Programmable Test and Measurement Equipment
The 216 MHz Cortex-M7 performance can help the STM32F745VGH6 coordinate acquisition, control, calibration, and communications in programmable instrumentation. Its 1 MB flash provides space for control code and test sequences, while the MCU consolidates functions that might otherwise require several processors. The dense BGA package should be paired with a short, controlled analog layout and solid reference-clock design. Verify ADC performance, DAC availability, comparators, timer channels, external-memory interfaces, and calibrated measurement paths directly from the manufacturer documentation before assigning analog functions.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F745VGH6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
주요 차별점
- High verified CPU operating point (vs STM32G474VEH6)
- Large embedded flash configuration (vs STM32H750XBH6)
- Compact verified BGA package (vs STM32F746xx devices)
설계 노트
Treat the 100-TFBGA footprint as a fine-pitch assembly constraint rather than a simple 8 x 8 mm land pattern. Obtain the exact package drawing and land pattern from STMicroelectronics before schematic and PCB release. Verify ball size, ball pitch, solder-mask definition, paste apertures, component orientation, and any exposed thermal or ground connection. Prototype assembly should include suitable inspection because hidden BGA joints are not visually inspectable after reflow.
Power planning must begin with the exact voltage domains, regulator ratings, decoupling values, and sequencing requirements in the STM32F745VGH6 documentation; those values are not present in the supplied verified snippets. Place required bulk and local decoupling at the device-side supply and ground connections, preserve the recommended return paths, and isolate noisy switching converters from sensitive references. Do not select inductors, capacitors, or power switches until the datasheet supply limits and transient requirements are confirmed.
Do not assume that another STM32F7 or STM32H7 device is pin-compatible merely because it uses a similar microcontroller family or BGA size. The supplied cross-reference results identify comparison candidates but do not verify a shared 100-ball map, memory organization, voltage architecture, boot configuration, or peripheral assignment. Any substitution requires a formal ball-by-ball review, PCB comparison, clock and power review, peripheral remapping plan, and firmware regression test.
Reserve clean routing for high-speed clock, high-speed serial, and memory-related signals only after the actual pin assignments and external components are known. Keep sensitive analog inputs away from switching nodes and digital return-current discontinuities, and maintain continuous ground references beneath signal routes where the package and stack-up allow. Because the supplied evidence does not include the full pinout or stack-up guidance, use the official package, board-design, and reference-manual documents before releasing layout constraints.
규정 준수 정보
The supplied verified web data does not state compliance status for this exact ordering code. Compliance claims must be confirmed from the manufacturer product documentation and current distributor records.
