STM32F765IIK6 - 216MHz Cortex-M7 2MB MCU | STMicroelectronics
부품 번호: STM32F765IIK6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.3733 | $17.37 |
| 10 | $17.3733 | $173.73 |
| 100 | $17.3733 | $1,737.33 |
| 500 | $17.3733 | $8,686.65 |
| 1,000 | $17.3733 | $17,373.30 |
STM32F765IIK6 개요
An Arm Cortex-M7 microcontroller is a 32-bit embedded processor based on the Arm Cortex-M architecture. It combines real-time interrupt-driven control with higher-performance DSP and floating-point capabilities than typical entry-level microcontrollers. In the STM32 product hierarchy, the STM32F765 belongs to the STM32F7 family of high-performance microcontrollers, combining general-purpose control, memory acceleration, and extensive peripheral integration.
The verified product information identifies a maximum CPU frequency of 216 MHz, 2 MB of flash, a 176+25 UFBGA package, and a 10 mm by 10 mm package size. The manufacturer’s STM32F765 product family datasheet also identifies up to 2 MB flash, 462 DMIPS, SDRAM, DFSDM, and advanced signal-processing and connectivity features. These characteristics make the STM32F765IIK6 suitable for applications requiring more computation and memory than a basic Cortex-M microcontroller.
The Cortex-M7 architecture is designed to improve instruction throughput through its pipeline, cache mechanisms, DSP support, and ART Accelerator. The FPU supports floating-point workloads, while DSP instructions accelerate common filtering and signal-processing operations. An MPU can provide memory-protection capabilities for systems that require isolation between critical tasks or software components. These features are especially valuable in control systems, audio equipment, industrial controllers, and embedded human-machine interfaces.
Typical applications include industrial automation, motor and motion control, audio and DSP systems, communications equipment, test and measurement instruments, and connected embedded products. The STM32F765IIK6 is also identified by a distributor source as a supported flight-controller MCU target in the STM32F7X5 family. For flight-control designs, careful validation of motor control, sensor timing, power supplies, and firmware remains essential.
The 176+25 UFBGA package is a fine-pitch, high-density package that requires careful PCB layout, controlled escape routing, adequate power delivery, and reliable assembly capability. The 10 mm by 10 mm outline and 0.65 mm pitch place demands on via planning, solder mask, thermal management, and inspection. The package is not a direct substitute for parts using a leaded package or a different ball count.
This page consolidates verified distributor information, the manufacturer datasheet link, application context, comparison fields, and practical design considerations. Because the supplied web results do not expose a complete verified price table or a complete manufacturer pinout list, unavailable values are marked for validation rather than inferred.
The STM32F765IIK6 should be selected when a design specifically requires the STM32F765 device identity, 216 MHz Cortex-M7 performance, 2 MB flash, and the 176+25 UFBGA footprint. Confirm package pin assignments, voltage rails, memory configuration, peripheral availability, lifecycle status, and assembly capability against the official STM32F765 family datasheet before releasing a production PCB.
드롭인 대체품: STM32F765IIK6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청STM32F765IIK6 최대 정격 & 전기적 특성
| CPU | 32-bit Arm Cortex-M7 |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 2 MB |
| Flash Organization | 2M x 8 |
| 패키지 | 176+25 UFBGA |
| Package Size | 10 mm x 10 mm |
| Ball Pitch | 0.65 mm |
| Core Features | FPU, DSP instructions, MPU, ART Accelerator, L1 cache |
| L1 Cache | 16 KB instruction/data cache |
| DMIPS | 462 DMIPS at up to 216 MHz |
| Memory Features | SDRAM support identified in the manufacturer family datasheet |
| Digital Peripherals | DFSDM identified in the manufacturer family datasheet |
| Architecture | Arm Cortex-M with FPU and DSP instructions |
| 실장 유형 | Surface mount |
| Packing Type | Tape and reel |
| 동작 온도 | -40 °C to +85 °C |
| RoHS | Compliant, identified in the comparison data |
STM32F765IIK6 10 mm x 10 mm 핀 구성 가이드
STM32F765IIK6(10 mm x 10 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F765IIK6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F765IIK6 적합 용도: 6 애플리케이션s: Industrial Automation and Motion Control, Audio and Digital Signal Processing, Communications and Networked Embedded Equipment, Flight-Control Systems, Test and Measurement Instrumentation, Connected Consumer and Embedded IoT Products.
Industrial Automation and Motion Control
The STM32F765IIK6 fits industrial controllers that need a fast 216 MHz Arm Cortex-M7 core, DSP instructions, and an FPU for real-time control calculations. Its 2 MB flash provides room for control loops, communication stacks, diagnostics, and field-upgrade logic, while the 176+25 UFBGA package supports compact high-density boards. The device can combine motor-control peripherals, communications, and safety monitoring in one controller, subject to the exact peripheral mapping and electrical limits in the family datasheet. The principal design tradeoff is the fine-pitch 0.65 mm BGA assembly requirement, which needs controlled PCB fabrication, solder-mask design, component placement, and inspection.
추천
Audio and Digital Signal Processing
The Cortex-M7 DSP instructions, FPU, 216 MHz performance, and up to 462 DMIPS make STM32F765IIK6 a strong candidate for audio front ends, digital filters, and real-time signal processing. Its 2 MB flash can hold DSP algorithms, control firmware, and communication code, while the family datasheet identifies SDRAM-related capability that may assist with higher-volume data movement. A practical design would place the MCU close to converters and memory, use controlled impedance routing, and decouple each supply domain according to the manufacturer’s requirements. The BGA package reduces board footprint but increases assembly complexity compared with leaded packages.
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Communications and Networked Embedded Equipment
STM32F765IIK6 provides the processing headroom for communications equipment that combines protocol handling, buffering, control functions, and real-time monitoring. Its 216 MHz Cortex-M7 core can service interrupt-heavy workflows, while 2 MB flash supports layered firmware and communication tables. The manufacturer family source identifies SDRAM, which can be valuable when external memory is required for frame buffers or protocol data, although the exact supported interfaces, pin assignments, and timing must be checked for the selected package. Designers should budget for high-speed signal integrity, power sequencing, impedance-controlled routing, and robust decoupling around a high-density BGA.
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Flight-Control Systems
The verified UAVCHIP listing identifies STM32F765IIK6 as a supported STM32F7X5 flight-controller target. Its 216 MHz Cortex-M7 core and DSP/FPU capabilities suit sensor fusion, filtering, control loops, and telemetry handling, while 2 MB flash supports flight-control firmware, configuration, and logging features. A flight-control design must still validate sensor timing, motor-output behavior, failsafe states, vibration tolerance, power integrity, and thermal performance. The 176+25 UFBGA package and 0.65 mm pitch require an assembly process capable of handling the footprint reliably; software compatibility does not by itself prove electrical or mechanical drop-in compatibility.
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Test and Measurement Instrumentation
The STM32F765IIK6 is appropriate for high-speed measurement front ends where a 216 MHz core must acquire data, execute filtering, coordinate peripherals, and present results. DSP instructions and the FPU can reduce execution time for numerical algorithms, while 2 MB flash supports firmware, calibration tables, and instrument control code. The MCU should be paired with carefully selected analog front ends and memory, and the layout should separate sensitive measurement paths from switching and high-current power circuitry. Because the supplied results do not enumerate the exact ADC, DAC, and timing resources for this package, engineers must verify those functions in the official datasheet before selecting it for a precision instrument.
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Connected Consumer and Embedded IoT Products
The STM32F765IIK6 can serve as the central embedded controller in a connected product that needs more processing power and flash than a basic microcontroller. Its Cortex-M7 architecture, 2 MB flash, and family-identified SDRAM capability provide room for application firmware, protocol processing, user-interface logic, and data buffering. A practical product design must define the wireless or wired interface separately, enforce power budgets, and provide deterministic boot and update behavior. The fine-pitch UFBGA package helps reduce board area but requires careful escape routing and manufacturing controls. Firmware should be tested for watchdog recovery, peripheral brownout behavior, and memory access timing before deployment.
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추천 제품 요약
엔지니어링 참조 데이터: STM32F765IIK6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
Do not select STM32F745IEK6TR as a drop-in substitute without a package-level review. The supplied comparison identifies a 201-UFBGA package, so the pin count and ball arrangement may differ. For designs using another STM32F7 or STM32F4 device, check memory size, package, power rails, boot behavior, peripheral mapping, and firmware support. If the exact pinout, lifecycle status, or compliance declaration is unavailable, obtain the current official STMicroelectronics documentation before committing to production.
대체품과의 비교
| 파라미터 | 이 제품 | STM32F745IEK6TR |
|---|---|---|
| Package | 176+25 UFBGA (10 mm x 10 mm) | 201-UFBGA; different package |
| Brand | STMicroelectronics | STMicroelectronics |
| CPU | 32-bit Arm Cortex-M7 | Arm Cortex-M7 |
| Maximum Frequency | 216 MHz | 216 MHz identified in comparison data |
| Flash Memory | 2 MB | Up to 2 MB identified in family comparison |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C identified in comparison data |
| Packing Type | Tape and reel | Tape and reel |
주요 차별점
- Higher-performance STM32F7 positioning (vs STM32F745IEK6TR)
- High-density integrated footprint (vs STM32F745IEK6TR)
- DSP and floating-point capability (vs STM32F745IEK6TR)
설계 노트
Design the PCB for a 176+25 UFBGA package with a 0.65 mm pitch. Confirm pad geometry, solder-mask definition, component placement, escape routing, via strategy, and assembly capability against the official package drawing. A high-density BGA can reduce board area, but incorrect escape geometry or insufficient inspection access can create assembly defects that are difficult to diagnose after soldering.
Use the STM32F765 family datasheet to define every VDD and VSS connection, startup sequence, decoupling requirement, and operating limit. Do not infer the complete power architecture from the distributor listing. Place required bulk and high-frequency capacitors close to the associated package balls, provide a low-impedance return path, and verify voltage regulation at the MCU under the maximum intended CPU, peripheral, and I/O load.
For high-speed external-memory or communication paths, use the package pin assignments and recommended routing rules from the manufacturer documentation. Control impedance, minimize discontinuities, keep return paths continuous, and separate clocks or sensitive analog signals from noisy switching nodes as appropriate. Validate the final board with signal-integrity measurements when external SDRAM or other high-speed interfaces are populated.
Do not treat STM32F745IEK6TR as a drop-in replacement for STM32F765IIK6 solely because both are STM32F7 devices. The supplied comparison identifies different package descriptions, 176+25 UFBGA versus 201-UFBGA, and community results report additional or changed power connections in another STM32 replacement scenario. Verify every ball, rail, peripheral mapping, boot configuration, and firmware dependency before substitution.
Thermal analysis should include maximum clock, enabled peripherals, I/O activity, ambient temperature, and PCB copper rather than using CPU frequency alone. The supplied data does not provide a verified thermal resistance or maximum junction temperature for this exact orderable part. Obtain those values from the official datasheet, then provide adequate copper, via distribution, and airflow for the intended enclosure and operating environment.
규정 준수 정보
RoHS compliance and Ecopack2 are identified in the supplied comparison data. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status require confirmation for the exact orderable MPN and package.
