STM32F767NIH7 - 216MHz Cortex-M7 2MB MCU | STMicroelectronics
부품 번호: STM32F767NIH7 ✓ 활성STM32F767NIH7 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and communication interfaces on one device. In the embedded-device hierarchy, the STM32F767NIH7 belongs to the 32-bit Arm Cortex-M7 microcontroller class, combining real-time control capability with high-throughput digital signal processing. Its 2 MB Flash stores firmware and constants, while its SRAM supports working data, stack operations, DMA buffers, graphics data, and communication frames.
Key features include operation up to 216 MHz, a 462 DMIPS processing rating, and a dedicated floating-point unit for mathematically intensive control and signal-processing tasks. The Cortex-M7 core supports DSP instructions, zero-wait-state execution from embedded Flash through the stated cache architecture, and an MPU for memory protection. Verified sources also identify USB OTG high-speed and full-speed operation, up to 28 communication interfaces, LCD and DSI support, and a broad collection of analog and timer peripherals.
The device architecture combines a high-performance 32-bit RISC core with extensive connectivity. Its 16 KB instruction cache and 16 KB data cache help reduce memory-access penalties, while the ART Accelerator supports embedded-Flash execution according to the manufacturer datasheet. Total SRAM is listed as 512 KB, 16 KB, and 4 KB in separate memory regions, allowing firmware designers to partition code, data, and communications or display buffers without relying entirely on external memory.
Typical applications include industrial data-acquisition and factory-control equipment, connected embedded systems requiring USB, high-speed graphical or camera interfaces, and real-time signal-processing systems. The 216 MHz core and FPU benefit filtering, control algorithms, and protocol handling, while the 2 MB Flash accommodates larger firmware images and richer user interfaces. The 216-pin TFBGA also provides access to the family's extensive GPIO and peripheral set but requires careful escape routing and multilayer PCB design.
Designers should base the PCB footprint and pin assignments on the manufacturer package drawing rather than generic BGA conventions. The 13 mm by 13 mm TFBGA requires a dense, controlled fanout, thermal management appropriate for the selected power dissipation, and verification of signal integrity on high-speed interfaces. Firmware should also account for peripheral errata, clock-tree configuration, memory placement, and independent USB, Ethernet, display, and DMA requirements before production release.
This page consolidates the verified manufacturer specifications, distributor package information, comparison parameters, and application guidance for STM32F767NIH7. It also distinguishes directly compatible STM32F7 package options from cross-brand alternatives, helping engineering teams choose a replacement while preserving PCB, firmware, qualification, and procurement requirements.
드롭인 대체품: STM32F767NIH7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F767NIH7 (동일 폼 팩터 및 풋프린트) — 차이점: CPU Core, Instruction Set, Package, Product Type, USB Interfaces.
STM32F765NIH7
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32F769NIH7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F768NIH7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F767NIH6
✅ 드롭인 ⚠️ 사양 미검증✗ 재고 없음
$10.85 / 개
데이터시트 보기 →STM32F767NIY6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32F767NIH7 최대 정격 & 전기적 특성
| Product Type | 32-bit Arm Cortex-M7 microcontroller |
| CPU Core | Arm Cortex-M7 with floating-point unit |
| Maximum CPU Frequency | 216 MHz |
| Instruction Set | 32-bit RISC with DSP instructions |
| Peak Performance | 462 DMIPS |
| Performance per MHz | 2.14 DMIPS/MHz |
| Embedded Flash Memory | 2 MB |
| Flash Organization | 2M x 8 bits |
| Total Listed RAM | 512 KB + 16 KB + 4 KB |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Protection Unit | Present |
| USB Interfaces | USB OTG high-speed and full-speed |
| Communication Interfaces | Up to 28 communication interfaces |
| Display Support | LCD and DSI |
| 공급 전압 | 3.3 V |
| 패키지 | 216-pin TFBGA, 13 mm x 13 mm |
| 실장 유형 | Surface mount |
STM32F767NIH7 216-pin tfbga, 13 mm x 13 mm 핀 구성 가이드
STM32F767NIH7(216-pin tfbga, 13 mm x 13 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F767NIH7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F767NIH7 적합 용도: 6 애플리케이션s: Industrial Data Acquisition, USB-C Connected Embedded Control, High-Speed Industrial Networking, Real-Time Signal Processing, Graphical User Interface and Display, Medical and Instrumentation Control.
Industrial Data Acquisition
The STM32F767NIH7 fits industrial data-acquisition equipment because its Cortex-M7 core operates at up to 216 MHz and provides 462 DMIPS, while the FPU and DSP instructions accelerate numerical filtering and control operations. The 2 MB Flash and 532 KB of listed RAM allow acquisition firmware, calibration tables, and working buffers to remain local. Use the MCU beside sensors and analog front ends, placing high-rate transfers on DMA and preserving signal integrity through controlled-impedance routing. The main engineering trade-off is the dense 216-pin TFBGA, which demands multilayer escape routing and careful decoupling.
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USB-C Connected Embedded Control
The STM32F767NIH7 is suitable for USB-connected embedded controllers because the verified family information lists USB OTG high-speed and full-speed operation alongside a 216 MHz Cortex-M7 core. A host or device design can use local SRAM for packet staging and the 2 MB Flash for protocol and application firmware. USB routing requires a controlled-impedance board stack-up, short differential traces, suitable return-path continuity, and ESD protection. Compared with a lower-frequency MCU, the F767 provides more compute headroom for protocol handling, but it also requires a more demanding BGA layout and power-integrity design.
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High-Speed Industrial Networking
The STM32F767NIH7 can support gateway and communication equipment that must combine real-time control with multiple data paths. The verified manufacturer information identifies up to 28 communication interfaces, USB capability, and a 216 MHz core, while the 532 KB listed RAM supports protocol buffers and the 2 MB Flash accommodates larger networking stacks. An Ethernet-capable design should use the appropriate external PHY and isolated magnetic interface, with strict separation between digital, analog, and power domains. The TFBGA package reduces board area but increases assembly and signal-integrity complexity compared with a leaded package.
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Real-Time Signal Processing
The STM32F767NIH7 is appropriate for real-time DSP workloads because its Cortex-M7 core reaches 216 MHz and 462 DMIPS while including an FPU and DSP instructions. Those resources support filtering, modulation, control calculations, and mixed-signal processing without requiring a separate accelerator. The 16 KB instruction cache and 16 KB data cache can improve execution from embedded Flash, and the 2 MB Flash provides room for substantial lookup tables and firmware. Designers should align DMA buffers for efficient transfers, avoid cache coherency surprises, and benchmark the exact algorithm before committing to the MCU.
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Graphical User Interface and Display
The STM32F767NIH7 fits display-oriented embedded controllers because the verified family information lists LCD and DSI support alongside the 216 MHz Cortex-M7 core. Its 2 MB Flash can store display resources and application code, while the listed SRAM can accommodate framebuffer segments and interface queues. The implementation should use DMA for display transfers, maintain suitable cache management, and route DSI or LCD signals according to the selected panel and STMicroelectronics hardware guidance. Compared with a simpler MCU, it offers substantially more graphics and application headroom, but the 216-pin package requires careful power, routing, and assembly planning.
추천
Medical and Instrumentation Control
The STM32F767NIH7 can serve as the central controller in connected instrumentation and medical-device subsystems where deterministic control, communications, and local data processing are required. The 216 MHz Cortex-M7 core, FPU, and DSP instructions support control loops and numerical processing, while 2 MB Flash and 532 KB listed RAM reduce external-memory pressure. Safety and regulatory suitability cannot be inferred from performance alone: the exact device grade, isolation strategy, leakage behavior, calibration requirements, and applicable medical standards must be verified separately. Precision analog support should be isolated from switching and high-current sections of the board.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32F767NIH7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F765NIH7 | STM32F769NIH7 | STM32F768NIH7 | STM32F767NIH6 | STM32F767NIY6 |
|---|---|---|---|---|---|---|
| Package | 216-TFBGA (13x13) | 216-TFBGA (13x13) | 216-TFBGA (13x13) | 216-TFBGA (13x13) | 216-TFBGA (13x13) | 216-TFBGA (13x13) |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| CPU Core | Arm Cortex-M7 with FPU | Arm Cortex-M7 family | Arm Cortex-M7 family | Arm Cortex-M7 family | Arm Cortex-M7 with FPU | Arm Cortex-M7 family |
주요 차별점
- Verified 2 MB Flash capacity (vs STM32F767NGH6)
- High-performance Cortex-M7 processing (vs STM32F765NIH7)
- Broad verified connectivity (vs STM32F767NIH6)
- Single-vendor MCU ecosystem (vs STM32G491MET3)
설계 노트
Use the official STMicroelectronics 216-TFBGA land pattern and verify it with the selected PCB assembler. The 13 mm by 13 mm package has a dense escape-routing requirement, so define a multilayer stack-up that supports short power connections, continuous return planes, and the impedance needed by USB, display, and communication interfaces. Do not substitute a generic 216-BGA symbol without checking ball numbering, pad dimensions, solder-mask rules, and package-specific assembly allowances.
Partition the MCU supply rails according to the manufacturer power-supply schematic and place the specified input, output, and bypass capacitors close to their assigned pins. Keep high-current switching and external transceiver regions away from the MCU's analog and digital ground returns. Validate voltage at the ball with an oscilloscope under maximum processing and peripheral load; a nominal 3.3 V supply at the connector does not guarantee adequate local regulation at the TFBGA device.
Plan the 216-pin escape routing before placing supporting components. Reserve routing channels for USB, Ethernet or other high-speed interfaces, memory buses, and display signals, then place decoupling and test points where they remain accessible. The device operates at up to 216 MHz and supports 16 KB instruction and data caches, so correct trace geometry and return paths are important. Review the design with the fabricator for via-in-pad restrictions, solder fillets, and X-ray inspection requirements.
Do not treat another STM32F7 orderable code as interchangeable solely because it uses a 216-pin TFBGA. Compare the exact ordering table, Flash size, temperature grade, peripherals, errata, and lifecycle status, and recompile or retest firmware when the peripheral configuration changes. For example, the verified comparison listing shows that STM32F767NGH6 has 1 MB Flash rather than the STM32F767NIH7's 2 MB, demonstrating why suffix checks are essential.
규정 준수 정보
The supplied search results do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from the manufacturer or package.
