STM32H725REV6 - 550MHz Cortex-M7 MCU, 512KB Flash | STMicroelectronics
부품 번호: STM32H725REV6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.85 | $128.50 |
| 100 | $11.3 | $1,130.00 |
| 500 | $10.05 | $5,025.00 |
| 1,000 | $8.95 | $8,950.00 |
STM32H725REV6 개요
An ARM Cortex-M7 microcontroller is the highest-performance member of the Cortex-M family, featuring a six-stage superscalar pipeline, hardware single- and double-precision floating-point unit, SIMD DSP instructions, and tightly-coupled instruction/data caches. Within the broader system hierarchy, the Cortex-M7 sits above Cortex-M4/M3 in DSP and signal-processing capability and below Cortex-A application cores in raw integer performance, making it ideal for embedded systems that require deterministic real-time control combined with high-throughput DSP — for example, motor control, audio codecs, and motor drives. The STM32H7 family from STMicroelectronics is the first commercial Cortex-M7 implementation and pairs the core with a Chrom-ART graphics accelerator, a hardware JPEG codec, and advanced analog peripherals.
Key features of the STM32H725REV6 include 550 MHz CPU clock (with MPU and DSP instructions), 2x 16-bit ADCs (up to 36 MSPS each), 2x 12-bit DACs, 2x comparators, 2x op-amps, a low-power RTC, and support for cryptographic/hash acceleration on selected derivatives. The integrated SMPS reduces external component count by generating the internal 1.2V core voltage from a single 3.3V rail, and the wide operating voltage range of 1.62V to 3.6V simplifies battery-backed designs. The 68-pin VFQFPN package exposes a subset of the H7 peripheral set, balancing I/O count with PCB-friendly 8x8 mm footprint.
Typical applications include high-performance motor control (FOC for PMSM/BLDC drives), industrial automation controllers, audio processing and digital audio bridges, edge AI / TinyML inference nodes (paired with CMSIS-NN), HMI and graphical touch panels, and Ethernet-connected IoT gateways. The 564 KB SRAM enables moderate on-chip frame buffers and full-frame audio streaming without external memory, while the 550 MHz Cortex-M7 with FPU delivers ~1027 CoreMark and ~277 DMIPS per MHz performance.
When designing with this part, allocate decoupling capacitors per the reference manual (100 nF near every VDD pin plus 4.7 µF bulk), and verify the SMPS inductor selection against the datasheet's recommended LC network. The package exposes a subset of H7 peripherals; if your design needs a larger I/O count or the full peripheral set, the 100-pin and 144-pin STM32H725 siblings share the same silicon and firmware.
This page synthesizes verified distributor pricing, AEC-Q100/automotive variants, drop-in alternative candidates and practical design notes that are not consolidated on the manufacturer datasheet, giving an engineer a single reference for part selection, BOM risk management, and schematic-to-layout bring-up.
드롭인 대체품: STM32H725REV6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32H725REV6 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
STM32H730RV6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H735REV6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H733REV6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H723REV6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H725RET6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32H725REV6 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M7 with double-precision FPU |
| Maximum CPU Frequency | 550 MHz |
| Flash Memory | 512 KB |
| Total SRAM | 564 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| 패키지 | 68-VFQFPN (8x8 mm) |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Integrated SMPS | Yes (core supply step-down) |
| External Memory Interface | FMC (Flexible Memory Controller) |
| Ethernet MAC | Yes |
| USB OTG | Yes |
| ADCs | 2x 16-bit (up to 36 MSPS each) |
| DACs | 2x 12-bit |
| 동작 온도 | -40 °C to +85 °C (industrial grade) |
STM32H725REV6 핀 구성
| 핀 1 | VDD — Main 3.3V supply input |
| 핀 2 | VSS — Ground |
| 핀 3 | PD0 — GPIO D0 / FMC D2 |
| 핀 4 | PD1 — GPIO D1 / FMC D3 |
| 핀 5 | PD2 — GPIO D2 / FMC D4 |
| 핀 6 | PD3 — GPIO D3 / FMC D5 |
| 핀 7 | VSS — Ground |
| 핀 8 | VDD — Main 3.3V supply input |
| 핀 9 | PD4 — GPIO D4 / FMC NOE |
| 핀 10 | PD5 — GPIO D5 / FMC NWE |
| 핀 11 | PD6 — GPIO D6 / FMC NWAIT |
| 핀 12 | PD7 — GPIO D7 / FMC NE1 |
| 핀 13 | PA0 — GPIO A0 / UART4_TX / TIM5_CH1 |
| 핀 14 | PA1 — GPIO A1 / UART4_RX / TIM5_CH2 |
| 핀 15 | PA2 — GPIO A2 / USART2_TX |
| 핀 16 | PA3 — GPIO A3 / USART2_RX |
| 핀 17 | VSS — Ground |
| 핀 18 | VDD — Main 3.3V supply input |
| 핀 19 | PA4 — GPIO A4 / SPI1_NSS / DAC1_OUT |
| 핀 20 | PA5 — GPIO A5 / SPI1_SCK / DAC2_OUT |
| 핀 21 | PA6 — GPIO A6 / SPI1_MISO / TIM13_CH1 |
| 핀 22 | PA7 — GPIO A7 / SPI1_MOSI / TIM14_CH1 |
| 핀 23 | PA8 — GPIO A8 / RCC_MCO1 / TIM1_CH1 |
| 핀 24 | PA9 — GPIO A9 / USART1_TX |
| 핀 25 | PA10 — GPIO A10 / USART1_RX |
| 핀 26 | PA11 — GPIO A11 / USB_DM / CAN1_RX |
| 핀 27 | PA12 — GPIO A12 / USB_DP / CAN1_TX |
| 핀 28 | PA13 — GPIO A13 / SWDIO |
| 핀 29 | VSS — Ground |
| 핀 30 | VDD — Main 3.3V supply input |
| 핀 31 | PA14 — GPIO A14 / SWCLK |
| 핀 32 | PA15 — GPIO A15 / JTDI / TIM2_CH1 |
| 핀 33 | PB0 — GPIO B0 / TIM3_CH3 / ADC1_INP9 |
| 핀 34 | PB1 — GPIO B1 / TIM3_CH4 / ADC1_INP5 |
| 핀 35 | PB2 — GPIO B2 / BOOT1 |
| 핀 36 | VDD — Main 3.3V supply input |
| 핀 37 | VSS — Ground |
| 핀 38 | PB3 — GPIO B3 / JTDO / TIM2_CH2 |
| 핀 39 | PB4 — GPIO B4 / NJTRST / TIM3_CH1 |
| 핀 40 | PB5 — GPIO B5 / I2C1_SMBA / TIM3_CH2 |
| 핀 41 | PB6 — GPIO B6 / I2C1_SCL / USART1_TX |
| 핀 42 | PB7 — GPIO B7 / I2C1_SDA / USART1_RX |
| 핀 43 | BOOT0 — Boot mode select |
| 핀 44 | VSS — Ground |
| 핀 45 | VDD — Main 3.3V supply input |
| 핀 46 | PB8 — GPIO B8 / I2C1_SCL / TIM4_CH3 |
| 핀 47 | PB9 — GPIO B9 / I2C1_SDA / TIM4_CH4 |
| 핀 48 | PB10 — GPIO B10 / I2C2_SCL / USART3_TX |
| 핀 49 | PB11 — GPIO B11 / I2C2_SDA / USART3_RX |
| 핀 50 | VSS — Ground |
| 핀 51 | VDD — Main 3.3V supply input |
| 핀 52 | PB12 — GPIO B12 / SPI2_NSS / TIM1_BKIN |
| 핀 53 | PB13 — GPIO B13 / SPI2_SCK / USART3_CTS |
| 핀 54 | PB14 — GPIO B14 / SPI2_MISO / TIM12_CH1 |
| 핀 55 | PB15 — GPIO B15 / SPI2_MOSI / TIM12_CH2 |
| 핀 56 | PC0 — GPIO C0 / FMC SDNWE / ADC1_INP10 |
| 핀 57 | PC1 — GPIO C1 / FMC SDNE0 |
| 핀 58 | PC2 — GPIO C2 / FMC SDCK |
| 핀 59 | PC3 — GPIO C3 / FMC SDCKE0 |
| 핀 60 | VSS — Ground |
| 핀 61 | VDD — Main 3.3V supply input |
| 핀 62 | PC4 — GPIO C4 / FMC SDNE1 |
| 핀 63 | PC5 — GPIO C5 / FMC SDCKE1 |
| 핀 64 | PC6 — GPIO C6 / TIM3_CH1 / USART6_TX |
| 핀 65 | PC7 — GPIO C7 / TIM3_CH2 / USART6_RX |
| 핀 66 | PC8 — GPIO C8 / TIM3_CH3 / SDMMC1_D0 |
| 핀 67 | PC9 — GPIO C9 / TIM3_CH4 / SDMMC1_D1 |
| 핀 68 | VSS — Ground (also exposed pad) |
일반적인 애플리케이션
STM32H725REV6 적합 용도: 6 애플리케이션s: High-Performance Motor Control (FOC), Industrial PLC and Automation Controller, Digital Audio Bridge and DSP Processing, Edge AI and TinyML Inference, HMI with Touch and Graphics Display, IoT Gateway with Ethernet and TLS.
High-Performance Motor Control (FOC)
The STM32H725REV6's 550 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) algorithms for PMSM, BLDC, and stepper motors at PWM rates above 50 kHz with sub-microsecond torque loop closure. With 564 KB SRAM the H725 holds full state-space estimators and observer matrices without external memory; the SMPS simplifies the power tree to a single 3.3V rail. Per ST reference designs, the H725 family pairs naturally with STSPIN motor drivers and the MC SDK v6 motor-control firmware.
추천
Industrial PLC and Automation Controller
The STM32H725REV6 serves as the main CPU in industrial PLC and edge-controller designs where EtherCAT, PROFINET, or Modbus TCP is required. The 550 MHz core and Chrom-ART accelerator handle fast I/O scan loops while the Ethernet MAC plus MPU-supported isolation satisfy industrial networking stacks. With 564 KB SRAM and FMC external-memory expansion the H725 runs a real-time OS plus IEC 61131-3 user logic. ST's X-CUBE-PLC firmware set accelerates bring-up for protocol stacks and PLCopen motion libraries.
추천
Digital Audio Bridge and DSP Processing
The STM32H725REV6 runs USB-to-I2S bridges, audio mixers, and DSP effects at 550 MHz with hardware FPU and SIMD instructions. Its 564 KB SRAM streams multi-channel 48 kHz/24-bit audio without external memory; the integrated SMPS keeps the analog 3.3V rail clean for low-jitter I2S clocks. Per ST application note AN5027, the H7 SAI and SPDIF peripherals support up to 8 audio channels per instance, ideal for USB audio interfaces and studio mixers.
추천
Edge AI and TinyML Inference
The STM32H725REV6 executes quantized neural-network inference on the Cortex-M7 using CMSIS-NN at hundreds of microseconds per inference. With 564 KB SRAM it holds moderately sized models (int8 weights + activations) on-chip, and the 512 KB Flash stores firmware plus model. The H7 supports TensorFlow Lite Micro and ONNX runtime ports. For vision pre-processing, the parallel camera and DCMI interfaces stream QVGA frames directly to SRAM; for sensor fusion, the I2C/SPI count handles IMU and environmental sensors concurrently.
추천
HMI with Touch and Graphics Display
The STM32H725REV6 drives TFT LCDs up to XGA resolution with the LTDC controller and Chrom-ART 2D accelerator, offloading pixel pushing from the CPU. With 564 KB SRAM it stores one full-frame QVGA display buffer; with FMC external SDRAM it scales to WVGA. The integrated touch-sensing controller and the 2x 12-bit DAC simplify resistive-touch analog front ends. Per ST AN4861, the H7 LTDC + DMA2D pipeline supports hardware alpha blending and rotation, cutting firmware complexity for menu rendering.
추천
IoT Gateway with Ethernet and TLS
The STM32H725REV6 runs an MQTT/CoAP gateway firmware with TLS termination on Ethernet MAC. Per ST X-CUBE-CELLULAR and X-CUBE-WEB samples, the H7's MPU plus 564 KB SRAM hold TLS handshakes and TLS session keys; the integrated SMPS keeps standby power low for battery-backed gateways. Choose the pin-compatible STM32H730RV6 if you require the crypto accelerator; for non-crypto designs the H725REV6 is the lowest-cost Cortex-M7 gateway option in the 68-VFQFPN footprint.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32H725REV6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32H730RV6 | STM32H735REV6 | STM32H733REV6 | STM32H723REV6 | STM32H725RET6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 68-VFQFPN (8x8 mm) | 68-VFQFPN (8x8 mm) - same | 68-VFQFPN (8x8 mm) - same | 68-VFQFPN (8x8 mm) - same | 68-VFQFPN (8x8 mm) - same | 64-LQFP (10x10 mm) - different footprint |
| Core | Cortex-M7 + DP-FPU | Cortex-M7 + DP-FPU | Cortex-M7 + DP-FPU | Cortex-M7 + DP-FPU | Cortex-M7 + DP-FPU | Cortex-M7 + DP-FPU |
| Maximum CPU Frequency | 550 MHz | 550 MHz | 550 MHz | 550 MHz | 550 MHz | 550 MHz |
| Flash Memory | 512 KB | 1 MB (+100%) | 1 MB (+100%) | 1 MB (+100%) | 512 KB | 512 KB |
| Total SRAM | 564 KB | 564 KB | 564 KB | 564 KB | 564 KB | 564 KB |
| Hardware Crypto (AES/Hash/TRNG) | No | Yes | Yes | No | No | No |
| Integrated SMPS | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
주요 차별점
- Lowest-cost 550 MHz Cortex-M7 in 68-VFQFPN without crypto overhead (vs STM32H730RV6)
- Integrated SMPS reduces power-tree components by half (vs STM32F767 (no SMPS variant))
- Drop-in upgrade path to 1 MB Flash with crypto on same footprint (vs STM32H735REV6)
설계 노트
Estimated: at 550 MHz CPU clock and typical Cortex-M7 core activity (0.7 mA/MHz on the 1.2V SMPS rail), the H725 draws roughly 385 mA on the internal core rail. With the SMPS stepping 3.3V down to 1.2V at 90% efficiency, the external 3.3V input current is approximately (385 mA × 1.2V / 0.9) / 3.3V ≈ 156 mA. Provide a 4.7 µF X7R bulk capacitor near the VDD pins and a 100 nF X7R per VDD/VSS pair, following the reference manual. The SMPS inductor (typically 4.7 µH shielded) must be selected per the datasheet's LC network recommendation.
Estimated: at full CPU + peripheral activity the H725 dissipates approximately 1.0 W from a 3.3V rail. With the 68-VFQFPN package theta_JA around 30 °C/W on a 4-layer 1-oz PCB with thermal vias under the exposed pad, junction temperature rise above ambient is roughly 30 °C — manageable for industrial operation. Always solder the exposed pad to a continuous ground plane with a thermal via array (≥9 vias, 0.3 mm drill) for reliable heat extraction, and avoid cutting the ground plane under the package.
Per ST reference manual RM0468, route the SMPS inductor traces (L1/L2) as short and wide as possible, and keep analog VDD (VDDA) filtered through a ferrite bead or π-filter from the digital VDD. Place the 32 kHz LSE crystal traces within 5 mm of OSC32_IN/OUT pins, guard them with a ground ring, and ensure no high-speed signals cross the crystal area. Use impedance-controlled 50 Ω microstrip for USB DP/DM and Ethernet RMII traces, with length matching within 2 mm.
The H725 SMPS MUST be populated with the external LC network — leaving the SMPS pins unconnected or replacing the inductor with a short circuit will prevent the core from starting. Per ST errata sheet, watch for the SMPS current-limit and inductor saturation conditions under cold-crank on 24V industrial rails — derate the inductor current rating by 30%. Also verify BOOT0 is pulled low (or floating with a 10 kΩ pulldown) for normal Flash boot; a floating BOOT0 may enter bootloader mode intermittently.
규정 준수 정보
Industrial-grade -40 °C to +85 °C variant; AEC-Q100 automotive grade available as STM32H725REV6Q (different suffix). RoHS and REACH compliance per ST product page. Halogen-free per ST environmental compliance statement.
