STM32L151QCH6 - 32MHz Cortex-M3 256KB MCU | STMicroelectronics
부품 번호: STM32L151QCH6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.0447 | $8.04 |
| 10 | $8.0447 | $80.45 |
| 100 | $8.0447 | $804.47 |
| 500 | $8.0447 | $4,022.35 |
| 1,000 | $8.0447 | $8,044.70 |
STM32L151QCH6 개요
A microcontroller is a programmable system-on-chip that integrates a processor core, memory, clock circuitry, communications interfaces, timers, analog peripherals, and power-management blocks. Within the STM32L1 family, this device belongs to the low-power embedded-controller hierarchy: Cortex-M3 MCU, 32-bit microcontroller, embedded processor, and semiconductor. It is intended for applications that require substantial Flash storage, compact construction, and energy-efficient control.
Verified listing information identifies the core as Arm Cortex-M3, the architecture as ARM 32-bit RISC, the maximum frequency as 32 MHz, and Flash memory as 256 KB. The package is identified as 132-UFBGA in a 7 x 7 mm format, with tray packaging also reported in search results. Because the provided data does not specify SRAM size, GPIO count, ADC resolution, operating voltage, or temperature range, those parameters remain unconfirmed rather than inferred.
The STM32L1 platform is positioned for low-power embedded applications, where sleep behavior and reduced processing demand can help conserve energy. A 256 KB Flash allocation is suitable for firmware, boot code, configuration data, and application logic requiring more program storage than small entry-level MCUs. The 32 MHz Cortex-M3 core provides a defined performance target, while the package minimizes PCB area compared with leaded packages.
Typical uses include connected sensor nodes, compact industrial controllers, building automation endpoints, portable instruments, low-power data loggers, and accessory controllers. Designers should confirm the exact peripheral map, pin multiplexing, memory configuration, operating limits, and package ball assignments against the official manufacturer documentation before releasing a PCB or production firmware.
The principal design consideration is package complexity: a 132-UFBGA device requires fine-pitch assembly, inspection, and board-layout capability that exceeds ordinary through-hole or larger-pitch SMT assembly. Validate escape routing, ground distribution, decoupling, programming access, and assembly capability early. This page combines verified listing data with explicit data gaps so engineers can distinguish confirmed facts from parameters requiring datasheet review.
Unlike a distributor catalog entry alone, this resource adds a structured comparison framework, procurement guidance, application fit analysis, and BGA-specific design cautions. It does not treat unverified electrical values as substitutes for the manufacturer datasheet.
드롭인 대체품: STM32L151QCH6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32L151QCH6 (동일 폼 팩터 및 풋프린트) — 차이점: Architecture, Package, Product Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청STM32L151QCH6 최대 정격 & 전기적 특성
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M3 |
| Architecture | ARM 32-bit RISC |
| 최대 클록 주파수 | 32 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| Supply Voltage Options Listed | 1.8 V / 2.5 V / 3.3 V |
| 패키지 | 132-UFBGA (7 x 7 mm) |
| 핀 수 | 132 balls |
| 실장 유형 | Surface mount |
| Packaging | Tray |
| Core Architecture | 32-bit |
| Device Family | STM32L1 |
| Power Class | Ultra-low-power |
STM32L151QCH6 132-ufbga (7 x 7 mm) 핀 구성 가이드
STM32L151QCH6(132-ufbga (7 x 7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32L151QCH6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32L151QCH6 적합 용도: 6 애플리케이션s: Connected Sensor Nodes, Industrial Control Modules, Building Automation Endpoints, Portable Data Loggers, Low-Power Measurement Instruments, USB-Conditioned Accessories.
Connected Sensor Nodes
The STM32L151QCH6 fits connected sensor nodes that require a 32 MHz Arm Cortex-M3 core and more program space than a small entry-level controller. Its 256 KB Flash can hold networking stacks, sensor drivers, local buffering, and application firmware, while the STM32L1 ultra-low-power positioning supports battery-conscious designs. The MCU should acquire sensor data, manage thresholds, and format local telemetry. Before release, verify SRAM capacity, sleep current, wake-up sources, radio interface availability, and analog front-end requirements against the manufacturer documentation.
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Industrial Control Modules
STM32L151QCH6 is suitable for compact industrial control modules where local logic must combine deterministic peripheral control with substantial firmware storage. The 32 MHz Cortex-M3 processor can coordinate digital inputs, outputs, communications, and application state, while 256 KB Flash provides room for a bootloader and field logic. Its 132-UFBGA package saves board area but increases assembly and inspection demands. Engineers should verify available I/O, communication peripherals, ESD requirements, supply range, and industrial temperature limits before schematic approval.
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Building Automation Endpoints
The STM32L151QCH6 can support building-automation endpoints that monitor inputs and control lights, access equipment, or environmental subsystems. Its 256 KB Flash accommodates protocol logic and application firmware, while the STM32L1 low-power focus is valuable in equipment expected to spend substantial time idle. The controller can debounce inputs, execute control sequences, and supervise a local bus. Validate low-power wake behavior, timer resources, bus electrical levels, package ball access, and any safety-related requirements using official STMicroelectronics documentation.
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Portable Data Loggers
STM32L151QCH6 fits portable data loggers that must store firmware, acquisition logic, and event metadata while maintaining a compact board. The confirmed 256 KB Flash provides more program capacity than basic MCUs, and the 32 MHz Cortex-M3 core can service sampling, buffering, and communication routines. Its STM32L1 ultra-low-power positioning supports battery-operated use, but actual battery life depends on unverified active and sleep currents. Confirm SRAM, ADC characteristics, operating temperature, data-interface availability, and low-power modes before selecting the part.
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Low-Power Measurement Instruments
STM32L151QCH6 is a candidate for low-power measurement instruments because its Cortex-M3 core can perform control and signal-processing tasks while 256 KB Flash accommodates acquisition firmware. A compact instrument could use the MCU to sequence sensors, apply calibration, record results, and drive a local display or communications link. The ultra-low-power family positioning may reduce standby consumption, but measurement accuracy depends on unlisted analog specifications. Verify ADC resolution, acquisition timing, analog inputs, reference behavior, and signal-conditioning architecture before committing to this MCU.
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USB-Conditioned Accessories
STM32L151QCH6 can serve as the application controller in a compact USB-connected accessory when its USB device interface and electrical requirements are verified for the exact device. The 32 MHz Cortex-M3 core and 256 KB Flash are suitable for protocol handling, configuration, and control tasks. A practical design could enumerate the accessory, manage status LEDs, authenticate commands, and supervise a local sensor. USB data routing, connector protection, clock requirements, firmware support, and package-ball availability must be confirmed from official documentation before layout release.
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추천 제품 요약
엔지니어링 참조 데이터: STM32L151QCH6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
설계 노트
Treat the 132-UFBGA land pattern as a manufacturing-critical interface. The verified package is only 7 x 7 mm, so confirm ball pitch, pad dimensions, solder-mask definition, paste stencil, via-in-pad policy, and assembly capability against the official package drawing. Do not derive the footprint from the distributor snippet alone. Prototype assembly should include X-ray or equivalent inspection because hidden solder defects under the BGA can escape visual inspection.
Plan power distribution and decoupling only after the manufacturer pin and ball tables identify every supply and ground connection. Place required bulk and high-frequency decoupling capacitors close to their designated balls, provide short return paths, and separate sensitive signal routes from switching nodes. Because no individual pinout was supplied, assigning rails or capacitor locations from the 132-UFBGA name alone would risk an invalid layout.
Do not equate a 32-bit Cortex-M3 core with drop-in software or hardware compatibility. Firmware porting must account for memory map, peripherals, interrupts, startup code, clock configuration, and package pin multiplexing. Before substituting any STM32L1 or cross-brand MCU, compare the official datasheets, validate the 132-UFBGA ball map, confirm Flash and SRAM capacity, and test all board-level peripherals. Firmware recompilation alone does not prove hardware compatibility.
규정 준수 정보
The supplied search results do not provide explicit compliance declarations for STM32L151QCH6. No compliance status has been inferred.
