STM32L4R9ZGJ6 - 120MHz Cortex-M4 1MB Flash MCU | STMicroelectronics
부품 번호: STM32L4R9ZGJ6 ✓ 활성STM32L4R9ZGJ6 개요
A low-dropout voltage regulator is a power-management component that converts an input supply into a stable internal rail while limiting power loss. In this microcontroller, the low-power architecture supports operation from a 1.71 V to 3.6 V supply, with shutdown current as low as 33 nA and a VBAT mode drawing 305 nA to maintain the real-time clock and 32 backup registers. This makes the device suitable for designs where standby energy consumption is as important as active processing capability.
The STM32L4R9ZGJ6 provides a 32-bit Arm Cortex-M4 processor with FPU, 1 MB of flash, and up to 640 KB of SRAM across the STM32L4R9 family. Its feature set includes USB OTG, DFSD capability, and the low-power peripherals associated with the STM32L4+ platform. The J6 ordering option identifies the temperature-qualified 144-pin package configuration used for industrial and extended-temperature designs.
The device is designed around the STM32L4+ low-power architecture, including FlexPowerControl, multiple sleep modes, and batch acquisition mode. These resources allow firmware to remain responsive while limiting energy use during idle periods. The Cortex-M4 core supports efficient digital signal processing and control workloads without requiring a separate DSP component in many embedded applications.
Typical applications include industrial sensor nodes, compact data loggers, battery-powered handheld instruments, connected industrial equipment, and USB-connected control peripherals. The small 144-UFBGA package also makes the part suitable for space-constrained designs where board area is limited and thermal management must be planned carefully.
When laying out the PCB, follow the package ball assignments and recommended land pattern in the STM32L4R9ZG datasheet, provide clean supply decoupling, and keep sensitive analog and communication traces away from high-current switching paths. Because the package is a fine-pitch BGA, assembly capability, solder-paste volume, stencil design, and X-ray inspection requirements should be confirmed before volume production.
This page consolidates electrical characteristics, package information, design considerations, and verified drop-in candidates to support component selection, schematic capture, PCB planning, and sourcing decisions without duplicating the raw datasheet layout.
드롭인 대체품: STM32L4R9ZGJ6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32L4R9ZGJ6 (동일 폼 팩터 및 풋프린트) — 차이점: Flash Memory, Package, VBAT Mode Current, Series, Product Type.
STM32L4R9ZIJ6
✅ 드롭인가격 문의
데이터시트 보기 →STM32L4R9ZGT6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32L4R9ZIT6
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →STM32L4R9ZJH6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32L4R9ZIH6
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
STM32L4R9ZGJ6 최대 정격 & 전기적 특성
| Product Type | 32-bit ultra-low-power microcontroller (MCU) |
| Core | Arm Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz |
| Architecture | 32-bit ARM RISC |
| Flash Memory | 1 MB (1M x 8 bits) |
| Maximum Family SRAM | 640 KB across STM32L4R9 family |
| 동작 공급 전압 | 1.71 V to 3.6 V |
| 동작 온도 범위 | -40 °C to 85 °C or -40 °C to 125 °C |
| VBAT Mode Current | 305 nA for RTC and 32 x 32-bit backup registers |
| Shutdown Mode Current | 33 nA |
| USB Interface | USB OTG |
| Storage Interface | DFSD |
| Low-Power Control | FlexPowerControl |
| Acquisition Mode | Batch acquisition mode (BAM) |
| 패키지 | 144-UFBGA (10 x 10 mm) |
| 실장 유형 | Surface mount |
| Series | STM32L4+ Series |
STM32L4R9ZGJ6 144-ufbga (10 x 10 mm) 핀 구성 가이드
STM32L4R9ZGJ6(144-ufbga (10 x 10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32L4R9ZGJ6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32L4R9ZGJ6 적합 용도: 6 애플리케이션s: Industrial Sensor Nodes, Battery-Powered Data Loggers, USB Connected Control Peripherals, Precision Measurement Instruments, Smart Building and Environmental Controls, Portable Medical and Wellness Devices.
Industrial Sensor Nodes
The STM32L4R9ZGJ6 fits compact industrial sensor nodes that sample physical inputs, run local filtering, and communicate over a low-speed network. Its 120 MHz Cortex-M4 core provides enough performance for digital filtering and protocol handling, while the 1 MB of flash supports a bootloader, application firmware, and configuration storage. The shutdown current of 33 nA and VBAT current of 305 nA help reduce maintenance requirements in devices that wake periodically. The 144-UFBGA package also saves board area, although fine-pitch assembly and thermal-path design require careful PCB planning.
Battery-Powered Data Loggers
The STM32L4R9ZGJ6 is well suited to battery-powered data loggers that acquire sensor readings at intervals and store them locally. The 1 MB of flash provides useful firmware and data-buffer capacity, while the ultra-low-power shutdown mode limits current to 33 nA when the MCU is inactive. VBAT mode can preserve the RTC and 32 backup registers at 305 nA, supporting timestamp continuity between main-supply power cycles. For a practical energy budget, account for the sensor, radio, regulator, and leakage current because the microcontroller value represents only one part of the system load.
USB Connected Control Peripherals
The STM32L4R9ZGJ6 supports USB-connected control peripherals through its integrated USB OTG capability, eliminating the need for a separate USB interface controller in many designs. At 120 MHz, the Cortex-M4 core can handle USB servicing alongside control-loop execution and protocol processing. The 1 MB flash capacity is useful for firmware updates and interface configuration, and the small 144-UFBGA package helps minimize enclosure size. Designers should follow the manufacturer USB clock, power, and signal-routing recommendations and validate suspend current at the complete-product level.
Precision Measurement Instruments
The STM32L4R9ZGJ6 can serve as the control processor in compact measurement instruments that combine sensor conditioning, digital conversion, and local display or communication. The 120 MHz Cortex-M4 FPU accelerates filtering and numeric processing, while the 1 MB flash allows substantial embedded application code. Low-power operating modes improve handheld instrument endurance between measurements, and the RTC backup capability preserves operating context when the primary supply is removed. Analog accuracy is determined mainly by the selected external and internal analog circuitry, so this MCU should be paired with a carefully designed reference and front end.
Smart Building and Environmental Controls
The STM32L4R9ZGJ6 suits distributed environmental controllers that monitor temperature, humidity, occupancy, or air quality and drive building-automation outputs. Its low-power modes permit long standby intervals between readings, while the high-performance core supports concurrent communication and control tasks. The USB OTG interface provides a convenient local configuration and service path, and DFSD capability can support removable or internal flash storage where the board design includes it. A 144-UFBGA footprint reduces board area in space-constrained controller modules, but the assembly process must support fine-pitch BGA inspection and rework.
Portable Medical and Wellness Devices
The STM32L4R9ZGJ6 is applicable to compact wellness and low-power medical peripherals that combine sensor acquisition with local signal processing. The Cortex-M4 FPU supports arithmetic-heavy filtering without a separate DSP, and the 1 MB flash supports firmware, calibration data, and update logic. Low shutdown and VBAT currents help satisfy battery-life targets, while USB OTG enables data exchange with a host computer or charging dock. Medical designs still require their own risk assessment, electrical isolation where applicable, validation of measurement accuracy, and confirmation of the exact qualification grade for the intended environment.
엔지니어링 참조 데이터: STM32L4R9ZGJ6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32L4R9ZIJ6 | STM32L4R9ZGT6 | STM32L4R9ZIT6 | STM32L4R9ZJH6 | STM32L4R9ZIH6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 144-UFBGA (10 x 10 mm) | 144-UFBGA (10 x 10 mm) | 144-UFBGA (10 x 10 mm) | 144-UFBGA (10 x 10 mm) | 144-UFBGA (10 x 10 mm) | 144-UFBGA (10 x 10 mm) |
| CPU Core | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB (1M x 8 bits) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Operating Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Shutdown Mode Current | 33 nA | 33 nA | 33 nA | 33 nA | 33 nA | 33 nA |
| USB Interface | USB OTG | USB OTG | USB OTG | USB OTG | USB OTG | USB OTG |
| Temperature Qualification | GJ6 ordering option; verify grade in the manufacturer ordering table | IJ6 ordering option; verify grade in the manufacturer ordering table | GT6 ordering option; verify grade in the manufacturer ordering table | IT6 ordering option; verify grade in the manufacturer ordering table | JH6 ordering option; verify grade in the manufacturer ordering table | IH6 ordering option; verify grade in the manufacturer ordering table |
주요 차별점
- High core frequency within an ultra-low-power architecture (vs STM32L4R9ZIJ6)
- Compact 10 x 10 mm footprint with extensive embedded resources (vs STM32L4R9ZGT6)
- Low standby-current capability for energy-limited products (vs STM32L4R9ZIT6)
설계 노트
Use the STM32L4R9ZG recommended land pattern and follow the manufacturer's 144-UFBGA assembly guidance exactly, including pad dimensions, solder-mask definition, and paste volume. The 10 x 10 mm BGA leaves limited escape-routing room, so route critical interfaces on the outer layers and confirm that the assembly house supports the required BGA pitch, X-ray inspection, and rework process before schematic release.
Place the required supply and bulk-decoupling capacitors close to their associated device balls, with the shortest possible return path to the ground reference. Separate sensitive analog or RTC-related routing from switching nodes and high-current loads. Because the MCU can operate from 1.71 V to 3.6 V, verify regulator tolerance, startup sequencing, and load-transient performance against the electrical characteristics for the intended temperature grade.
Do not assume that a matching 144-UFBGA footprint guarantees an acceptable substitution. Compare the complete ordering codes for flash density, temperature grade, qualification status, peripheral enablement, and package revision before changing the MPN. Also validate the firmware and production test process because qualification suffixes can affect qualification documentation even when the electrical and ball assignments are unchanged.
규정 준수 정보
The STM32L4+ family is an industrial microcontroller family, so AEC-Q100 automotive qualification is not applicable to the standard ordering option. RoHS, REACH, lead-free, halogen-free, and conflict-minerals statements require confirmation from the manufacturer product-compliance documentation for the exact ordering code.