TLE95603QXXUMA1 - Automotive BLDC Motor SBC, CAN/LIN | Infineon
부품 번호: TLE95603QXXUMA1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.84 | $2.84 |
| 10 | $2.68 | $26.80 |
| 100 | $2.45 | $245.00 |
| 500 | $2.21 | $1,105.00 |
| 1,000 | $1.98 | $1,980.00 |
TLE95603QXXUMA1 개요
A motor System Basis Chip (SBC) combines what traditionally required several discrete components: the gate-driving power stage for a motor, the local power supply for a microcontroller, and the vehicle network transceiver. In the automotive electronics hierarchy, the TLE9560-3QX family sits between a standalone pre-driver and a full power SoC, providing a single-chip solution for brushless DC (BLDC) motor control nodes.
Key features include multiple integrated half-bridges that drive the external power stage of a 3-phase BLDC motor, an on-chip 5 V regulator that supplies the attached microcontroller, and dual communication interfaces (CAN FD and LIN) that connect the node to the vehicle body or powertrain network. The SPI interface allows the host MCU to configure diagnostics, protection thresholds, and PWM control parameters.
Technically, the device targets 28 V automotive board-net systems. Integrated protection and diagnostic functions - including current sensing support and fault reporting via SPI - reduce external component count and support functional-safety-oriented designs. The exposed-pad PG-VQFN-48 power package provides the thermal path needed for sustained motor-drive operation.
Typical applications include automotive BLDC pumps (water, fuel, oil), HVAC blowers and fans, window lifters, and other body-domain motor loads requiring CAN/LIN connectivity. The integrated 5 V regulator eliminates a separate LDO for the MCU.
Design consideration: provide adequate PCB copper area under the exposed pad to extract heat from the half-bridge power stage, and follow Infineon layout recommendations for the power and ground returns.
This page synthesizes distributor pricing, family drop-in options, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: TLE95603QXXUMA1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TLE9562-3QX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TLE9562
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TLE9560-3QX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TLE95603QXXUMA1 최대 정격 & 전기적 특성
| Product Type | Multifunctional Motor System IC (Motor SBC, BLDC driver) |
| Family | TLE9560-3QX |
| 패키지 | PG-VQFN-48 (exposed pad power package) |
| Motor Driver Type | NMOS half-bridge driver with integrated power stages |
| Control Interface | SPI |
| Network Interfaces | CAN FD and LIN transceiver |
| On-Chip Power Supply | Integrated 5 V voltage regulator |
| 동작 온도 | -40C to +150C |
| Board Net Voltage Class | 28 V automotive |
| Applications Class | Automotive (AEC qualification per family data) |
| Integrated Features | Power supply, communication interfaces, multiple half-bridges, support features |
| Package Padding | Exposed pad for thermal dissipation |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Target Motor Type | 3-phase BLDC |
| Diagnostics | SPI-based status and fault reporting |
TLE95603QXXUMA1 exposed pad for thermal dissipation 핀 구성 가이드
TLE95603QXXUMA1(exposed pad for thermal dissipation 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: TLE95603QXXUMA1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
TLE95603QXXUMA1 적합 용도: 6 애플리케이션s: Automotive BLDC Water and Coolant Pumps, HVAC Blowers and Cabin Fans, Fuel Pump Modules, Window Lifters and Body Motion Actuators, Industrial Pumps and Fans, Battery-Powered Robotics and Mechatronics.
Automotive BLDC Water and Coolant Pumps
The TLE95603QXXUMA1 fits automotive coolant and water pump nodes because it combines the 3-phase NMOS half-bridge drive, the 5 V MCU supply, and the LIN/CAN FD network interface in one PG-VQFN-48 chip operating from -40C to +150C. In a typical pump ECU, the half-bridges commutate the BLDC motor under SPI-commanded control from the microcontroller, while the LIN or CAN FD link reports speed, diagnostics, and fault status to the vehicle domain controller. The integrated regulator removes a discrete LDO, shrinking board area in the compact pump housing. Thermal design is the main consideration: the exposed pad must couple to sufficient copper to keep junction temperature in range at sustained pump load, and the SPI diagnostics support error handling required in thermal-management-critical circuits.
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HVAC Blowers and Cabin Fans
For HVAC blower motor ECUs, the TLE95603QXXUMA1 provides the power stage, control interface, and vehicle connectivity in a single device. The half-bridges drive the 3-phase BLDC blower with SPI-configured PWM, allowing the MCU to implement speed profiles and closed-loop control, while the CAN FD interface integrates the blower node into the body-controller network. Its -40C to +150C rating accommodates the hot environment near heater cores, and the integrated 5 V regulator powers the local MCU without a separate supply IC. Compared with a discrete pre-driver plus transceiver plus LDO bill of materials, the Motor SBC approach reduces component count, PCB area, and assembly cost, and the on-chip protection and diagnostic features reported over SPI support the fault-detection expectations of automotive thermal management systems.
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Fuel Pump Modules
In-tank fuel pump modules demand compact, thermally robust electronics with diagnostics, and the TLE95603QXXUMA1 addresses all three requirements. Its PG-VQFN-48 exposed-pad power package dissipates heat from the integrated half-bridges that drive the BLDC pump motor, while the SPI interface lets the fuel-pump controller monitor status and report faults over CAN FD or LIN to the vehicle network. The 28 V-class board-net tolerance and -40C to +150C operating range cover the automotive fuel-system environment. Because the device integrates the 5 V regulator, transceivers, and power stage on one die, designers gain board space in the constrained sender-unit housing and reduce the number of separately qualified components, an advantage when migrating from mechanical relay-switched fuel pumps to electronically commutated designs with demand-based speed control.
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Window Lifters and Body Motion Actuators
Window lifter and body actuator nodes benefit from the TLE95603QXXUMA1's integration of drive electronics and LIN connectivity. The NMOS half-bridges drive the actuator motor under MCU control with SPI-configured protection thresholds for pinch detection and stall conditions, while the LIN transceiver connects the door module to the body controller at low cost. The on-chip 5 V regulator powers the door-module MCU, and the -40C to +150C range covers door-internal temperature extremes. Using one Motor SBC instead of a pre-driver, LDO, and discrete transceiver shortens the door-module PCB and improves reliability by reducing solder-joint count. The SPI diagnostic registers provide the position and fault feedback that anti-pinch safety logic requires, which is a regulatory consideration for power window systems in many markets.
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Industrial Pumps and Fans
Although designed for automotive board-nets, the TLE95603QXXUMA1 also serves 12 V to 28 V industrial pump and fan applications that need robust BLDC drive plus a serial communication link. The CAN FD interface suits industrial fieldbus gateways, while the SPI bus connects to a general-purpose MCU for control logic. The integrated 5 V regulator simplifies the power tree in distributed I/O and actuator hardware, and the exposed-pad PG-VQFN-48 package supports conduction-cooled designs. Compared with discrete gate-driver plus MOSFET solutions, the integrated half-bridges reduce layout complexity and EMI optimization effort, and the built-in protection features reduce external sense and supervisory circuitry. Industrial designers should verify the automotive qualification profile against their environment, but the electrical and thermal envelope covers most 28 V-class industrial motor loads.
추천
Battery-Powered Robotics and Mechatronics
Battery-powered robotic joints and mechatronic actuators use the TLE95603QXXUMA1 as a compact BLDC drive node: the half-bridges commutate the motor, the SPI link carries control commands and diagnostic feedback from the host controller, and the 5 V regulator supplies local logic. Veswin's application notes position the device for battery-powered devices and robotics projects in the 28 V class. The integrated protection and SPI status reporting let the robot controller react to overcurrent and temperature events quickly, which matters in multi-axis systems where each joint must self-report faults. The -40C to +150C range provides margin for enclosed actuator housings with limited airflow, and the single-chip integration of driver, supply, and communication reduces the actuator PCB footprint, valuable in compact joint modules where every millimeter of diameter is constrained.
추천
추천 제품 요약
엔지니어링 참조 데이터: TLE95603QXXUMA1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TLE9562-3QX | TLE9562 | TLE9560-3QX |
|---|---|---|---|---|
| Package | PG-VQFN-48 (exposed pad) | PG-VQFN-48 - same | PG-VQFN-48 - same | PG-VQFN-48 - same |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Architecture | Motor SBC: half-bridges + 5V regulator + CAN FD + LIN + SPI | Same Motor SBC architecture (pin/software compatible) | Same Motor SBC architecture | Identical family architecture |
| Control Interface | SPI | SPI | SPI | SPI |
| Network Interfaces | CAN FD + LIN | CAN FD + LIN (per family datasheet) | CAN FD + LIN | CAN FD + LIN |
| On-Chip Regulator | 5 V regulator integrated | 5 V regulator integrated | 5 V regulator integrated | 5 V regulator integrated |
주요 차별점
- Highest integration in its class: driver + 5V regulator + CAN FD + LIN in one package (vs TLE9562-3QX)
- Single-source pin-compatible second variant path (vs TLE9562)
- Trade-off: no cross-brand drop-in equivalent (vs NXP/ST motor SBCs)
설계 노트
The TLE95603QXXUMA1 dissipates conduction and switching losses from its integrated half-bridges through the exposed pad of the PG-VQFN-48 package. Estimated: junction temperature rise equals total power loss multiplied by the junction-to-board thermal resistance, so allocate PCB copper under the pad based on your motor current and PWM duty cycle. For pump and blower ECUs in hot locations, verify junction temperature at worst-case ambient (up to the rated +150C environment ceiling minus self-heating) with a thermal simulation or measurement per the Infineon datasheet layout recommendations.
Place ceramic decoupling capacitors directly at the half-bridge supply pins and keep the power loop (supply - half-bridge - motor phase - ground) as small as possible to limit switching EMI. The exposed pad must be soldered to a solid, well-stitched ground plane - it is both the thermal path and part of the return path. Separate the high-current motor phase routing from the SPI and CAN/LIN signal traces, and follow the application circuit in the Infineon TLE9560-3QX datasheet for charge-pump and bootstrap component placement.
Do not treat the TLE9562 as an identical replacement without checking the configuration tables: Infineon confirms pin and software compatibility, but variant-specific options (interface configuration, protection settings) must be verified against your SPI initialization code before qualifying the swap. Also, the PG-VQFN-48 exposed pad is electrically grounded - assuming it is floating, or routing signal nets under the pad, is a common first-revision error. Verify the correct ordering-grade suffix for your temperature and quality requirements.
규정 준수 정보
RoHS compliant and lead-free per Infineon standard for automotive TLE9560-3QX family products; automotive-grade ordering variant. REACH and halogen-free status not explicitly stated in provided data.
