MPC555LFAVR40 - 32-Bit 40 MHz 448 KB Flash MCU | NXP
부품 번호: MPC555LFAVR40 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MPC555LFAVR40 개요
A microcontroller is a programmable semiconductor device that integrates a processor core, memory, peripherals, and I/O into one component. In the hierarchy of electronic devices, the MPC555 belongs to the MCU class, which sits below embedded processor and above general-purpose semiconductor categories. It executes firmware, reads inputs, controls actuators, and coordinates communication and timing within a larger embedded system. The MPC555 specifically reflects the automotive and industrial control requirements of the MPC500 generation.
The verified listing identifies the MPC555 core as a 32-bit PowerPC design operating at 40 MHz. Its program memory is 448 KB organized as 448K x 8, while the available specification listing reports 26K x 8 RAM. The package provides 101 I/O, and the oscillator type is external, meaning the design must supply the required clock externally. Search results also characterize the device as suitable for automotive applications such as engine and transmission control, as well as robotics and avionics control.
MPC555LFAVR40 belongs to a performance-oriented MCU family rather than a low-pin general-purpose controller. Its 272-pin PBGA offers substantially more connection capacity than common SOIC or QFN microcontrollers, supporting the wide peripheral and signal set expected in complex control systems. The 27 x 27 mm package also requires careful PCB layout, ball-pad design, and assembly planning because of its large land grid and thermal requirements.
Typical use cases include engine-control units, transmission-control systems, industrial automation equipment, robotic controllers, and avionics-control systems. In each case, firmware can use the 448 KB Flash region for program storage and the reported 26K x 8 RAM for working data. Because the package is PBGA and the product is marked end-of-life by NXP, new production designs should confirm availability, lifecycle status, software support, and obsolescence migration options before committing to a design.
A critical design consideration is that this is a legacy, high-pin-count MCU rather than a modern low-cost MCU. Board designers should use the official NXP documentation for complete electrical characteristics, pin multiplexing, clock requirements, memory timing, power sequencing, and PCB land patterns. Software migration should also account for the PowerPC architecture, legacy toolchain compatibility, peripheral mapping, and any qualified replacement program.
This page synthesizes the verified distributor and manufacturer search data, identifies the lifecycle and package constraints, and separates confirmed MPC555LFAVR40 specifications from parameters that require consultation of the official datasheet. It is intended as an engineering sourcing and planning reference, not as a substitute for the complete manufacturer documentation.
드롭인 대체품: MPC555LFAVR40 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC555LFAVR40 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, Number of I/O, Peripherals, Program Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC555LFCVR40
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC555LFCZP40
✅ 드롭인✓ 재고 있음
$36.75 / 개
데이터시트 보기 →SPC5644AF0MLU1R
✅ 드롭인✓ 재고 있음
$42.75 / 개
데이터시트 보기 →SPC5566MVR132
✅ 드롭인✓ 재고 있음
$24.5 / 개
데이터시트 보기 →SPC5674FAMVR3R
✅ 드롭인✓ 재고 있음
$35.02 / 개
데이터시트 보기 →MPC555LFAVR40 최대 정격 & 전기적 특성
| Product Type | 32-bit microcontroller (MCU) |
| Processor Core | PowerPC |
| 최대 클록 주파수 | 40 MHz |
| Program Memory Size | 448 KB (448K x 8) |
| Program Memory Type | Flash |
| RAM Size | 26K x 8 |
| Number of I/O | 101 |
| Oscillator Type | External |
| 패키지 | 272-PBGA |
| Package Dimensions | 27 x 27 mm |
| 실장 유형 | Surface mount |
| Packaging | Tray |
| Automotive Positioning | Automotive applications |
| Core Architecture | PowerPC |
| Product Family | MPC500 |
| RoHS 상태 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
MPC555LFAVR40 27 x 27 mm 핀 구성 가이드
MPC555LFAVR40(27 x 27 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC555LFAVR40.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC555LFAVR40 적합 용도: 6 애플리케이션s: Automotive Engine Control, Transmission Control, Industrial Automation Control, Robotics Control, Avionics Control, Embedded Communications Gateway.
Automotive Engine Control
The MPC555LFAVR40 fits legacy engine-control platforms because the verified search results associate the MPC555 with automotive applications and identify a 32-bit PowerPC core operating at 40 MHz. Its 448 KB Flash provides program storage, while the reported 26K x 8 RAM supports working data and the 101 I/O provide broad peripheral connectivity. In an engine-control unit, the device could coordinate sensor acquisition, actuator timing, and control algorithms. The major constraint is lifecycle: NXP identifies the part as end of life, so a new production program should verify approved sourcing and migration options before relying on it.
추천
Transmission Control
The MPC555LFAVR40 is a reasonable candidate for a legacy transmission-control module because its 32-bit PowerPC architecture and 40 MHz clock provide real-time processing capability, while the 272-PBGA package exposes a large number of connections for sensors, actuator drivers, and communications. The 448 KB Flash can hold control software and calibration data, with 26K x 8 RAM available for runtime state. Engineers must verify exact peripheral assignments, electrical limits, temperature requirements, and diagnostic requirements. Since the product is marked end of life, production continuation depends on approved inventory and software validation.
추천
Industrial Automation Control
MPC555LFAVR40 can serve in industrial equipment requiring deterministic embedded control, broad I/O, and a moderate amount of on-chip program memory. The verified 40 MHz PowerPC core and 448 KB Flash are suitable for legacy machine-control software, while 101 I/O can support digital inputs, outputs, communications, and actuator interfaces. A practical design must include external clocking because the oscillator is listed as external, plus validated power regulation, signal conditioning, and isolation for factory environments. The end-of-life status makes supply-risk review and long-term maintenance planning essential for industrial lifecycle programs.
추천
Robotics Control
The MPC555LFAVR40 is identified in the verified results as suitable for robotics control, where a 32-bit PowerPC core can coordinate motion logic, sensor processing, and actuator sequencing. Its 448 KB Flash supports embedded firmware, while the reported 26K x 8 RAM can hold state and communication buffers. The 101 I/O and 272-PBGA package offer substantial connection capacity but require a careful multilayer PCB, external clock source, and robust power design. Robotics developers should confirm peripheral mapping and motor-driver isolation. Because the MCU is end of life, new robot platforms should assess a current MCU unless maintaining an existing design is the objective.
추천
Avionics Control
The verified results associate the MPC555 family with avionics control, making MPC555LFAVR40 relevant to legacy airborne or industrial avionics subsystems. Its 32-bit 40 MHz processor and 448 KB Flash can support embedded control software, while the reported 26K x 8 RAM serves runtime working memory. Before using the device in any new avionics function, engineers must verify temperature, radiation, qualification, environmental, and supplier requirements from official documentation; none are supplied here. End-of-life status means that airworthiness programs need controlled procurement, configuration management, and a documented replacement or sustainment plan.
추천
Embedded Communications Gateway
MPC555LFAVR40 can be evaluated for a legacy communications gateway where a 40 MHz 32-bit processor, 448 KB Flash, and 101 I/O are useful for protocol handling and peripheral coordination. The reported 26K x 8 RAM is modest, so buffering and protocol memory requirements must be checked carefully. Its external oscillator requirement calls for a stable clock design, and the 272-PBGA package demands a high-density PCB layout. This is primarily a legacy-platform use case because the product is marked end of life. Any deployment should confirm current stock, package revision, software support, and long-term environmental requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC555LFAVR40 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC555LFCVR40 | MPC555LFCZP40 | SPC5644AF0MLU1R | SPC5566MVR132 | SPC5674FAMVR3R |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 272-PBGA | 272-PBGA | 272-PBGA | 272-PBGA | 272-PBGA | 272-PBGA |
| Product Family | MPC500 | MPC555 comparison candidate | MPC555 comparison candidate | SPC comparison candidate | SPC comparison candidate | SPC comparison candidate |
주요 차별점
- Confirmed MPC555 identity and lifecycle visibility (vs MPC555LFCVR40)
- 448 KB embedded Flash with 26K x 8 RAM (vs MPC555LFCZP40)
- 101 I/O in a high-density control package (vs SPC5644AF0MLU1R)
- External oscillator architecture (vs SPC5566MVR132)
설계 노트
The MPC555LFAVR40 uses a 272-pin PBGA measuring 27 x 27 mm, so the PCB footprint must be taken directly from the official NXP package drawing. Validate ball pitch, ball-map orientation, power and ground distribution, and assembly process before release. A generic BGA footprint can create hidden failures even when the nominal ball count matches. Because the complete pinout is not included in the supplied verified data, do not finalize routing until the exact MPC555 documentation has been reviewed.
The supplied data confirms an external oscillator type but does not provide the complete power-supply specification. Power design must therefore wait for the official electrical tables, including supply rails, tolerance, sequencing, current limits, and decoupling requirements. Route high-current power and ground connections with the shortest practical paths, and place required bypass capacitors at the package pins according to the manufacturer layout guidance. Do not infer a 3.3 V or 5 V operating condition from an isolated search snippet.
Treat clock, reset, debug, and high-speed communication routes as controlled PCB signals. The external oscillator requirement makes clock distribution especially important: confirm the specified frequency, tolerance, impedance, and reference-circuit topology from the MPC555 documentation. Keep noisy switching or power-conversion paths away from sensitive input and communication nets, and use the manufacturer’s recommended grounding and decoupling arrangement. Signal-integrity analysis is required if the system uses long external buses or high-speed external memories.
The largest substitution risk is confusing catalogue equivalence with pin-to-pin compatibility. MPC555LFCVR40, MPC555LFCZP40, and the SPC candidates appear in search or comparison results, but the supplied evidence does not establish matching ball assignments, memory maps, peripherals, electrical limits, or software behaviour. Do not change an existing production PCB based on family name or package count alone. Obtain an official cross-reference, compare the complete ordering information, and validate firmware, clock, power, and peripherals before approving a replacement.
The package is a 272-pin PBGA, and no verified thermal resistance, maximum junction temperature, or power dissipation data is included in the supplied results. Estimate device dissipation only after obtaining the operating voltage, current, clock activity, and peripheral-load information from the official datasheet. Account for the thermal path through the PBGA, PCB copper, vias, and enclosure. For automotive, industrial, robotics, or avionics use, verify the required ambient temperature and qualification conditions separately.
규정 준수 정보
The supplied verified data describes automotive positioning but does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance status must be confirmed from the official NXP product documentation or current manufacturer declarations.
