TPS65951A1ZGU - OMAP PMIC + Audio Codec 169-BGA | Texas Instruments
부품 번호: TPS65951A1ZGU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.21 | $62.10 |
| 100 | $5.52 | $552.00 |
| 500 | $4.97 | $2,485.00 |
| 1,000 | $4.48 | $4,480.00 |
TPS65951A1ZGU 개요
A power management IC (PMIC) is a highly integrated voltage regulator and power sequencing subsystem that consolidates multiple bucks, LDOs, and supervisory functions into a single silicon die. In the power management hierarchy, the PMIC sits above discrete DC/DC converters and LDOs, providing complete multi-rail power trees for application processors and modems. The TPS65951 extends this concept by embedding an entire audio module with codecs, digital filters, input preamplifiers and amplifiers, and Class-D output amplifiers.
Key features include 12 regulated outputs, a maximum operating supply voltage of 4.5 V (5.25 V absolute per digchip listing), SmartReflex dynamic voltage scaling for OMAP application processors, and integrated Class-D audio amplifiers that eliminate external speaker driver ICs. The audio subsystem supports full codec functionality, reducing BOM count and board area in handset designs.
The device communicates with the application processor and/or modem over an I2C/SPI-compatible control interface, allowing software-controlled sequencing, voltage adjustment, and power-down. The industrial temperature grade (-40C to +85C) supports harsh-environment handheld devices. According to TI product documentation, production data conforms to specifications per standard TI terms.
Typical applications include OMAP-based smartphone and tablet power trees, mobile handset audio subsystems, and portable battery-powered devices requiring tightly sequenced multi-rail power with integrated audio.
Design consideration: verify each rail's load budget against the datasheet current limits, as individual LDO outputs are rated up to 70 mA maximum output current; high-current processor cores must be powered from the step-down converters.
드롭인 대체품: TPS65951A1ZGU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TPS65951A1ZGU (동일 폼 팩터 및 풋프린트) — 차이점: Audio Subsystem, Function, Package, Operating Temperature, Target Processor.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TPS65951A1ZGUR
✅ 드롭인✓ 재고 있음
$5.94 / 개
데이터시트 보기 →TPS65951A1ZWSR
✅ 드롭인✓ 재고 있음
$5.95 / 개
데이터시트 보기 →TPS65950A3ZXN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TPS65950BZXNR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TPS65951A1ZGU 사양
| 기능 | Integrated Power Management IC with Audio Codec |
| Application Target | Handheld / Mobile Devices, OMAP PMIC |
| 출력 수 | 12 |
| Step-Down DC/DC Converters | 3 |
| LDO Regulators | 10 |
| Maximum Output Current (LDO) | 70 mA |
| Maximum Output Power | 69 mW |
| Maximum Operating Supply Voltage | 4.5 V |
| Absolute Supply Voltage | 5.25 V |
| Battery Type | Li-ion / Li-ion polymer / cobalt-nickel-manganese cell |
| SmartReflex Support | Yes (dynamic voltage scaling) |
| Audio Subsystem | Audio codec, digital filters, preamps, Class-D amplifiers |
| 동작 온도 | -40C to +85C |
| 패키지 | 169-BGA MicroStar LFBGA (12 x 12 mm) |
| 실장 유형 | Surface Mount |
| Temperature Grade | Industrial |
| Number of Terminals | 169 |
TPS65951A1ZGU 핀 구성
| 핀 A1 | VBACKUP — Backup battery input for RTC domain |
| 핀 B2 | GND — Ground |
| 핀 C3 | VBUS — USB VBUS input sense |
| 핀 D4 | VDD1/VACC — Battery/charger input supply |
| 핀 E5 | VDCDC1 — Step-down converter 1 output |
| 핀 F6 | VDCDC2 — Step-down converter 2 output |
| 핀 G7 | VDCDC3 — Step-down converter 3 output |
| 핀 H8 | VLDO1 — LDO regulator 1 output |
| 핀 J9 | VLDO2 — LDO regulator 2 output |
| 핀 K10 | SCL — I2C clock for control interface |
| 핀 L11 | SDA — I2C data for control interface |
| 핀 M12 | NRESPWRON — Power-on reset output / response |
일반적인 애플리케이션
TPS65951A1ZGU 적합 용도: 6 애플리케이션s: OMAP-Based Smartphone Power Tree, Mobile Handset Audio Subsystem, Battery-Powered Portable Devices, Industrial Ruggedized Handhelds, Connected IoT Mobile Terminals, Test Fixtures and Legacy OMAP Repair.
OMAP-Based Smartphone Power Tree
The TPS65951A1ZGU was designed as the companion PMIC for TI OMAP application processors in mobile cellular handsets. Its 3 step-down DC/DC converters power processor cores with SmartReflex dynamic voltage scaling, while 10 LDOs supply analog, memory, and RF rails up to 70 mA each. Placed directly off a Li-ion or Li-ion polymer battery (4.5 V max operating), it provides software-controlled sequencing via the OMAP reference design, eliminating 10+ discrete regulators and cutting board area in the dense handset power section.
추천
Mobile Handset Audio Subsystem
The TPS65951 integrates a complete audio module: codecs, digital filters, input preamplifiers and amplifiers, and Class-D output amplifiers. In a handset, this single device handles microphone preamps, earpiece and speaker drive without a separate codec IC or Class-D amplifier chip. Because the codec shares the PMIC silicon, audio rail sequencing and power-down are coordinated automatically, reducing pop-noise events. Class-D outputs deliver efficient speaker drive from the battery rail, extending talkback and media playback battery life versus Class-AB alternatives.
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Battery-Powered Portable Devices
Handsets powered by Li-ion, Li-ion polymer, or cobalt-nickel-manganese cells benefit from the TPS65951's direct battery input architecture with a 4.5 V maximum operating voltage and 5.25 V absolute maximum. Its 12 outputs cover the full power tree of a portable product, while the industrial -40C to +85C rating supports ruggedized handhelds used outdoors. Integration of power management and audio in one 12 x 12 mm 169-BGA minimizes quiescent overhead and simplifies battery-life modeling across discharge curves.
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Industrial Ruggedized Handhelds
With an industrial temperature grade of -40C to +85C, the TPS65951A1ZGU suits ruggedized data terminals, field scanners, and industrial communicators built on OMAP-class processors. SmartReflex dynamic voltage scaling lets firmware trade processor performance against power in duty-cycled field applications, while the ten LDOs cleanly power touch controllers, sensors, and wireless modules. The 169-BGA MicroStar package reflows on standard SMT lines, and multi-source packaging (tray or Tape and Reel via the ZGUR suffix) supports both prototype and volume assembly.
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Connected IoT Mobile Terminals
IoT terminals that embed cellular modems alongside an OMAP-class processor use the TPS65951's modem-support rails and I2C-controlled sequencing. The three step-down converters deliver the high transient currents demanded by RF power amplifiers during burst transmission, while dedicated LDOs supply low-noise rails for VCOs and crystal oscillators. Its 70 mA LDO limit matches typical GPS and modem I/O loads, and the integrated audio codec handles voice uplink/downlink for handset-style IoT products without additional audio silicon.
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Test Fixtures and Legacy OMAP Repair
Production lines and repair depots maintaining OMAP-era devices use the TPS65951A1ZGU for board-level replacement of failed PMICs, which are among the highest-failure components in dropped or liquid-damaged handsets. Reballing a fresh 169-BGA onto the original footprint restores the complete power tree and audio path without firmware changes, since all sequencing profiles are stored on the PMIC. Availability of both tray (ZGU) and Tape and Reel (ZGUR) packaging accommodates hand-placed rework and automated nozzle pickup respectively.
추천
추천 제품 요약
엔지니어링 참조 데이터: TPS65951A1ZGU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TPS65951A1ZGUR | TPS65950A3ZXN | TPS659114A2NMAR |
|---|---|---|---|---|
| Package | 169-BGA MicroStar (12x12) | 169-BGA MicroStar (12x12) - same | 169-BGA MicroStar (12x12) - same | NMA BGA - different |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| SmartReflex Support | Yes | Yes | Yes | Yes |
| Packaging | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
주요 차별점
- Fully integrated audio module with Class-D amplifiers (vs TPS659114A2NMAR)
- SmartReflex dynamic voltage scaling (vs TPS65950A3ZXN)
- 12-rail consolidation in 12x12 mm BGA (vs TPS65951A1ZGUR)
설계 노트
Respect the 4.5 V maximum operating supply voltage and 5.25 V absolute maximum on the battery input. Add a TVS diode on USB VBUS and charger inputs, since USB transients can exceed 5.25 V during hot-plug events. Budget LDO rails at no more than 70 mA each; processor core currents must come from the three step-down converters, not LDOs.
The 169-ball 0.8 mm-pitch BGA requires careful fanout. Place the step-down converter input capacitors and inductors on the PCB side directly beneath the die, keeping the high-di/dt buck loops as small as possible. Use via-in-pad on thermal and power balls to connect to internal planes; a minimum 4-layer stackup is recommended per TI OMAP reference designs.
Do not assume TPS65950 and TPS65951 variants are interchangeable without checking ballmaps and audio channel configurations - Utmel comparison pages flag differences between TPS65950A3ZXN, TPS65951A1ZGU, and TPS65950BZXNR. Also verify the boot sequencing configuration (strap pins vs I2C-loaded profile) matches your application processor, or the system will fail to power up.
규정 준수 정보
Compliance status not stated in provided web data; verify on TI product page.
