VTM2308S52Z0276T01 - 103.33A Non-Isolated PoL Module | Vicor
부품 번호: VTM2308S52Z0276T01 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $135 | $1,350.00 |
| 100 | $122 | $12,200.00 |
| 500 | $109 | $54,500.00 |
| 1,000 | $95 | $95,000.00 |
VTM2308S52Z0276T01 개요
A Voltage Transformation Module (VTM) is a non-isolated, fixed-ratio DC-DC converter used as a building block inside a Factorized Power Architecture (FPA). Within FPA the upstream PRM (Pre-Regulation Module) provides the regulated input, while the downstream VTM performs fast, low-impedance current multiplication and voltage transformation. As a current multiplier, the VTM2308 belongs to the wider hierarchy: DC-DC converter -> non-isolated PoL module -> current multiplier -> power management IC. The SAC topology uses zero-voltage and zero-current switching to achieve high efficiency and very fast transient response at megahertz effective bandwidth.
Key features include a 38.4V nominal input voltage, a fixed 1.2V output, a continuous output current of 103.33A, and the very small 2308 ChiP package outline. Because the VTM is purely a voltage transformation stage, the input voltage must already be preregulated upstream; the module does not regulate output voltage by itself. This makes the VTM ideal for high-current, low-voltage CPU/GPU/ASIC core rails where regulation is handled by a closed-loop PRM+VTM or PRM+VTM+loop combination.
Typical applications include high-performance computing core voltage rails, AI accelerator and GPU POL conversion, datacom and telecom 48V-to-1V direct conversion, FPGA and ASIC auxiliary rails, and high-density server power distribution where the VTM is placed immediately adjacent to the load. The fixed 1.2V output is convenient for legacy 1.2V logic rails and many DDR3/DDR4 secondary rails.
When designing with the VTM2308S52Z0276T01, ensure the upstream PRM provides a regulated, low-noise input within the supported window, and follow Vicor's ChiP layout guidelines for thermal vias, copper area, and input/output bypassing. Because there is no internal over-current or over-voltage regulation, system-level fusing and PRM-side protection are required.
드롭인 대체품: VTM2308S52Z0276T01 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: VTM2308S52Z0276T01 (동일 폼 팩터 및 풋프린트) — 차이점: Topology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
VTM2308S52Z0276T00
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →VTM2308S52Z0276T01 최대 정격 & 전기적 특성
| Manufacturer | Vicor Corporation |
| 토폴로지 | Sine Amplitude Converter (SAC) - non-isolated, fixed-ratio current multiplier |
| Module Type | Non-Isolated PoL Module / Voltage Transformation Module (VTM) |
| 출력 수 | 1 |
| 출력 전압 | 1.2 V |
| 최대 출력 전류 | 103.33 A |
| Input Voltage (Nominal) | 38.4 V |
| 패키지 | 2308 SM-CHIP (ChiP) |
| 실장 유형 | Surface Mount |
VTM2308S52Z0276T01 2308 sm-chip (chip) 핀 구성 가이드
VTM2308S52Z0276T01(2308 sm-chip (chip) 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: VTM2308S52Z0276T01.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
VTM2308S52Z0276T01 적합 용도: 6 애플리케이션s: High-Performance Computing CPU/GPU Core Rail, AI Accelerator / GPU Board Power Distribution, Datacom / Telecom 48V-to-1V Direct Conversion, FPGA / ASIC Auxiliary PoL Rail, High-Density Server / Cloud Computing VR, Industrial High-Current POL Conversion.
High-Performance Computing CPU/GPU Core Rail
The Vicor VTM2308S52Z0276T01's 1.2V/103.33A rating and 2308 ChiP footprint make it well suited as the final current-multiplier stage next to a high-current CPU or GPU core rail. Placed adjacent to the load, it accepts a preregulated 38.4V bus from a Vicor PRM upstream and performs the fixed-ratio voltage transformation with SAC topology, achieving very fast transient response and low output impedance at megahertz effective bandwidth — critical when modern CPU/GPU loads change in microseconds. The 103.33A continuous capability covers mainstream server core rails without paralleling multiple modules.
추천
AI Accelerator / GPU Board Power Distribution
AI accelerator cards and GPU compute boards consume hundreds of amps at very low voltages, and the VTM2308S52Z0276T01 is designed to deliver 103.33A at 1.2V from a preregulated 38.4V intermediate bus. Using Vicor's Factorized Power Architecture (FPA), the PRM handles regulation while the VTM sits at the point of load, eliminating bulky intermediate bus capacitors and reducing distribution losses across the PCB. The 2308 ChiP package exposes top-side copper for direct thermal attachment to a heatsink or cold plate, essential for AI accelerator cards with constrained airflow.
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Datacom / Telecom 48V-to-1V Direct Conversion
Datacom and telecom systems operate from a 48V backplane, and the VTM2308S52Z0276T01 paired with a Vicor BCM front end can step 48V down to 1.2V directly at the load with very high aggregate efficiency. The 103.33A output at 1.2V supplies modern networking ASICs, switch-fabric chips, and SoCs that have moved to sub-1V rails. Because the VTM is non-isolated, isolation is provided by the upstream BCM stage, while the VTM handles the high-ratio current multiplication close to the load for minimal distribution loss.
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FPGA / ASIC Auxiliary PoL Rail
FPGAs and ASICs often require multiple auxiliary PoL rails at currents well above 50A; the VTM2308S52Z0276T01 supplies a 1.2V/103.33A rail with very low output impedance for the auxiliary domain. Combined with the high SAC bandwidth, the VTM responds to load steps faster than traditional buck converters, improving voltage margin during load transients. Designers can mount the 2308 ChiP directly under the FPGA BGA or at the nearest PCB edge to minimize PCB distribution losses.
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High-Density Server / Cloud Computing VR
In hyperscale cloud servers, every watt and every square millimeter matters. The VTM2308S52Z0276T01's 2308 ChiP surface-mount form factor and SAC topology deliver 1.2V/103.33A in a footprint smaller than discrete DrMOS solutions, enabling denser motherboard layouts and shorter current loops. Pairing with a PRM upstream gives system designers a fully regulated, isolated 48V-to-1.2V path with high efficiency and excellent transient performance for next-generation server CPUs.
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Industrial High-Current POL Conversion
Industrial embedded systems, robotics controllers, and machine-vision platforms increasingly demand sub-1V rails at high current for advanced SoCs and FPGAs. The VTM2308S52Z0276T01 brings Vicor's SAC topology into a ruggedized industrial POL design: 1.2V/103.33A from a 38.4V rail, in a surface-mount 2308 ChiP that simplifies PCB assembly and supports conformal-coated boards. Industrial thermal and reliability expectations are well matched by Vicor's ChiP qualification program, making this VTM a strong fit for harsh-environment deployments.
추천
추천 제품 요약
엔지니어링 참조 데이터: VTM2308S52Z0276T01 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | VTM2308S52Z0276T00 |
|---|---|---|
| Package | 2308 SM-CHIP (ChiP) | 2308 SM-CHIP (ChiP) - same |
| Brand | Vicor | Vicor |
| Topology | SAC - non-isolated, fixed-ratio current multiplier | SAC - non-isolated, fixed-ratio current multiplier (same) |
| Output Voltage | 1.2 V | 1.2 V |
| Maximum Output Current | 103.33 A | 103.33 A |
| Nominal Input Voltage | 38.4 V | 38.4 V |
| Output Regulation | No - fixed-ratio (requires upstream PRM) | No - fixed-ratio (requires upstream PRM) |
| Variant Suffix | T01 | T00 (minor revision/screening grade) |
주요 차별점
- True drop-in identical part from same Vicor family (vs VTM2308S52Z0276T00)
- Vicor proprietary 2308 ChiP and SAC topology (vs Cross-brand DrMOS / multiphase buck controllers)
설계 노트
The VTM2308S52Z0276T01 is a fixed-ratio current multiplier, NOT a regulator. The input must be driven from a regulated, low-noise intermediate bus — typically 38.4V from a Vicor PRM, or a 38.4V rail derived from a 48V backplane via a BCM. Driving the VTM2308 from an unregulated bus will pass unregulated transients directly to the load, so do not bypass the PRM/BCM front end.
At 103.33A continuous output (≈124W) the 2308 ChiP dissipates significant heat even at SAC efficiencies above 95%. Follow Vicor's 2308 ChiP layout guide: provide top-side copper spreading, thermal vias to inner copper layers, and adequate airflow or cold-plate contact. Estimated junction rise depends on airflow and copper area; use Vicor's online thermal simulator for accurate predictions before locking your mechanical design.
Place the VTM2308S52Z0276T01 as close as possible to the load to minimize PCB distribution loss and parasitic inductance — the whole point of the FPA architecture is to multiply current right at the load. Use wide, short copper pours on both input and output, place input bulk capacitance at the PRM output, and place small ceramic decoupling at the VTM input and output pads per Vicor's reference layout.
규정 준수 정보
Compliance values not confirmed from the verified web data. Refer to the Vicor 2308 VTM family datasheet and the XAIPART order acknowledgement for current RoHS/REACH/lead-free status.
