VTM2313S60Z02A3T00 - VTM Current Multiplier 60V | Vicor
부품 번호: VTM2313S60Z02A3T00 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $65.95 | $6,595.00 |
| 500 | $59.1 | $29,550.00 |
| 1,000 | $53.2 | $53,200.00 |
VTM2313S60Z02A3T00 개요
A VTM (Voltage Transformation Module) is a fixed-ratio, isolated DC-DC converter that performs current multiplication. As a product category, VTMs sit inside the broader hierarchy: DC-DC converter -> isolated DC-DC module -> Factorized Power component -> power management IC -> semiconductor. VTMs are typically paired with a PRM (Pre-Regulation Module) that establishes a stable, regulated input, while the VTM performs the final voltage step-down and isolation, effectively acting as a high-efficiency "current multiplier" that scales current inversely with voltage transformation.
Key features of the VTM2313S60Z02A3T00 include 60 V nominal input voltage support, fixed-ratio current multiplication, high efficiency across the load range, and a small surface-mount ChiP form factor. The device integrates Vicor's proprietary Sine Amplitude Converter (SAC™) topology operating at high switching frequency, providing tight output impedance and fast transient response for demanding digital loads such as processors, ASICs, and FPGAs.
The architecture leverages zero-voltage / zero-current switching (ZVS/ZCS) in the SAC topology, minimizing switching losses and enabling high power density. Internal planar magnetics and a robust ChiP package deliver predictable thermal performance and clean DC output without the bulk of traditional isolated brick converters.
Typical applications include high-current PoL for data-center CPUs, GPUs and AI accelerators, telecom 48 V intermediate bus architectures, industrial 60 V bus systems, and any application where a PRM+VTM pair is used to deliver fast, isolated, low-voltage power close to the load. The 60 V input range supports both nominal 48 V telecom rails and 60 V nominal industrial bus architectures.
When designing with this device, always pair it with a compatible Vicor PRM that regulates the bus voltage before the VTM. Maintain tight PCB layout around the SAC transformer footprint to minimize loop inductance, and follow Vicor's thermal management guidelines for ChiP-based products.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, optimized for engineers selecting Factorized Power Architecture components.
드롭인 대체품: VTM2313S60Z02A3T00 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: VTM2313S60Z02A3T00 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package Type, Product Type, Topology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
VTM2313S60Z01A3T00
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
VTM2313S60Z03A3T00
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
VTM2313S60E54H0T00
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
VTM2313S60E50H0T00
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
VTM2313S60Z04A3T00
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM2313S60Z02A3T00 최대 정격 & 전기적 특성
| Product Type | VTM Current Multiplier (isolated DC-DC module) |
| 토폴로지 | SAC (Sine Amplitude Converter) - fixed ratio |
| Architecture | Vicor Factorized Power (VTM stage) |
| Nominal Input Voltage | 60 V |
| 출력 전압 | Fixed ratio from input (VTM ratio is part number encoded) |
| Package Type | Vicor ChiP (surface mount) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Vicor ChiP product line is RoHS compliant per manufacturer policy) |
| Companion PRM | PRM2313S60E54H0T00 or equivalent 60 V PRM (per Vicor Factorized Power design) |
VTM2313S60Z02A3T00 vicor chip (surface mount) 핀 구성 가이드
VTM2313S60Z02A3T00(vicor chip (surface mount) 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: VTM2313S60Z02A3T00.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
VTM2313S60Z02A3T00 적합 용도: 6 애플리케이션s: Data-Center CPU/GPU PoL via Factorized Power, 48 V Telecom Intermediate Bus Architecture (IBA), Industrial 60 V Bus Power Distribution, High-Performance ASIC/FPGA Core Power, AI Accelerator Card Power Delivery, Test & Measurement Equipment Power.
Data-Center CPU/GPU PoL via Factorized Power
The VTM2313S60Z02A3T00 is ideally suited as the final current-multiplication stage in a Factorized Power Architecture feeding high-current CPUs, GPUs, and AI accelerators. Its 60 V nominal input allows the upstream PRM to operate on a 48 V telecom bus while the VTM performs fixed-ratio step-down with very low output impedance, which directly improves transient response for sub-microsecond load steps at the processor. Compared with a conventional buck converter, the SAC topology produces no fundamental switching frequency at the output, eliminating the LC ripple that would otherwise couple into the processor's sensitive analog blocks.
추천
48 V Telecom Intermediate Bus Architecture (IBA)
In 48 V telecom intermediate bus designs, the VTM2313S60Z02A3T00 is used as the second-stage converter after a front-end PRM that regulates the bus. Its wide 60 V input tolerance accommodates nominal 48 V rails with margin for transient over-voltage events defined by telecom standards. The ChiP surface-mount package enables higher power density than traditional quarter-brick or eighth-brick isolated converters, allowing more PoL channels in the same PCB area while maintaining tight regulation at the load.
추천
Industrial 60 V Bus Power Distribution
Industrial automation systems that operate from a 60 V nominal DC bus benefit from the VTM2313S60Z02A3T00's high step-down ratio and isolation. The device converts the high-voltage bus to a low-voltage, high-current rail that feeds motor drivers, PLC CPUs, and sensor signal-conditioning circuits. The VTM's low output impedance reduces voltage droop during motor-drive current transients, which improves system-level regulation without adding bulk capacitance to the PCB.
추천
High-Performance ASIC/FPGA Core Power
ASICs and FPGAs with sub-1 V core voltages and high transient currents require the very low output impedance that the VTM2313S60Z02A3T00 provides. By placing the VTM close to the load and feeding it from a regulated PRM bus, designers achieve point-of-load performance with less PCB area than a discrete buck solution. The fixed-ratio conversion also simplifies feedback-loop design compared with a conventional voltage-mode buck regulator, which shortens development time for complex digital boards.
추천
AI Accelerator Card Power Delivery
AI accelerator cards (training and inference GPUs, custom silicon) consume hundreds of watts per chip and demand sub-microsecond transient response at the load. The VTM2313S60Z02A3T00, paired with a 60 V PRM, delivers the high current and tight regulation these cards require while operating from the rack-level 48 V or 60 V distribution. The ChiP footprint supports dense paralleling of multiple VTMs to scale current without changing the basic PCB topology.
추천
Test & Measurement Equipment Power
Bench-top and rack-mount test equipment often needs clean, isolated low-voltage rails at high current for analog signal chains and digital control boards. The VTM2313S60Z02A3T00's isolated, fixed-ratio conversion removes ground loops between the high-voltage input bus and sensitive measurement circuits. The fixed-ratio topology also means the output voltage tracks the PRM-regulated bus, simplifying calibration and remote-sense design for production test systems.
추천
추천 제품 요약
엔지니어링 참조 데이터: VTM2313S60Z02A3T00 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | VTM2313S60Z01A3T00 | VTM2313S60Z03A3T00 | VTM2313S60E54H0T00 | VTM2313S60E50H0T00 | VTM2313S60Z04A3T00 |
|---|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Package | Vicor ChiP (2313 family) | Vicor ChiP (2313 family) - same | Vicor ChiP (2313 family) - same | Vicor ChiP (2313 family) - same | Vicor ChiP (2313 family) - same | Vicor ChiP (2313 family) - same |
| Nominal Input Voltage | 60 V | 60 V | 60 V | 60 V | 60 V | 60 V |
| Topology | SAC fixed-ratio VTM | SAC fixed-ratio VTM | SAC fixed-ratio VTM | SAC fixed-ratio VTM | SAC fixed-ratio VTM | SAC fixed-ratio VTM |
| Output Ratio Encoding | Z02 (part-number defined) | Z01 | Z03 | E54 | E50 | Z04 |
| Architecture Compatibility | Vicor Factorized Power (PRM+VTM pair) | Vicor Factorized Power | Vicor Factorized Power | Vicor Factorized Power | Vicor Factorized Power | Vicor Factorized Power |
| Mounting Type | Surface Mount (ChiP) | Surface Mount (ChiP) | Surface Mount (ChiP) | Surface Mount (ChiP) | Surface Mount (ChiP) | Surface Mount (ChiP) |
| Cross-Brand Drop-In Available | No (Vicor proprietary ChiP) | No (Vicor proprietary ChiP) | No (Vicor proprietary ChiP) | No (Vicor proprietary ChiP) | No (Vicor proprietary ChiP) | No (Vicor proprietary ChiP) |
주요 차별점
- Native 60 V input rating for 48 V telecom and 60 V industrial buses (vs Lower-voltage VTM variants (e.g., 48 V-only or 28 V-only families))
- SAC topology delivers low output impedance and no fundamental switching ripple at the load (vs Conventional isolated brick converters)
- ChiP SMT package enables higher power density than traditional through-hole bricks (vs Industry-standard quarter-brick and eighth-brick modules)
설계 노트
A VTM is not a standalone voltage regulator. The VTM2313S60Z02A3T00 must be preceded by a Vicor PRM that establishes a regulated bus; applying an unregulated 60 V source directly will produce an unregulated output and may exceed downstream load ratings. According to Vicor's Factorized Power documentation, designers must validate the PRM+VTM pair using the Vicor PowerBench tool before committing to a PCB layout.
Estimated: at full rated load (assume 200 W output per the 2313 family datasheet family) with 95% peak efficiency, internal dissipation is roughly 10 W. Vicor ChiP packages depend on PCB copper area and forced-air cooling for heat removal; the manufacturer's ChiP thermal design guide should be consulted. Designers must avoid placing hot components directly above the VTM's planar magnetic area and must keep airflow paths unobstructed.
Maintain tight loop areas around the VTM input and output power pads, and follow Vicor's land-pattern and via-array recommendations exactly. Use multiple top-layer and inner-layer copper pours stitched with vias to minimize AC loop inductance and to spread heat. According to the Vicor ChiP design guidelines, a minimum of four thermal vias per power pad is typical, and the PCB should be at least 8 layers with dedicated inner power planes.
규정 준수 정보
RoHS compliance inferred from Vicor's published ChiP product line statement; REACH and conflict-mineral statements must be confirmed with Vicor's environmental compliance documents for the specific 2313 family variant.
