VTM48MP012T130AA0 - 130A VTM Current Multiplier 40V-1V | Vicor
부품 번호: VTM48MP012T130AA0 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86.5 | $865.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71 | $35,500.00 |
| 1,000 | $65.5 | $65,500.00 |
VTM48MP012T130AA0 개요
What is a VTM? A VTM (Voltage Transformation Module) is a Sine Amplitude Converter - a resonant, fixed-ratio DC-DC converter in Vicor's Factorized Power Architecture (FPA) family. Functionally, a VTM operates like a DC transformer: it provides isolation (where used with a PRM) and a fixed transformation ratio with low AC impedance beyond the bandwidth of most downstream regulators. Within the FPA hierarchy, a VTM sits downstream of a PRM (Pre-Regulation Module), where the PRM provides a regulated intermediate bus and the VTM performs the final current multiplication or voltage step-down close to the load. This split architecture enables very high current delivery at sub-1V rails without the bulk output capacitors normally required.
Key features of the VTM48MP012T130AA0 include 130 A continuous output current, a 1 V nominal output (40:1 fixed ratio), 40 V nominal input voltage, and operation from standard 48 V or 24 V PRM regulators up to 60 VDC input. The ChiP (Converter housed in Package) construction uses a co-molded thermally conductive body providing a large thermal interface area with superior thermal conductivity, allowing standard pick-and-place SMT assembly while dissipating the heat generated by 130 A delivery. The SAC topology presents a low AC impedance, allowing bulk load capacitance to be moved to the input side of the converter.
Typical applications include high-current GPU/CPU core voltage rails in AI accelerator cards, point-of-load conversion for ASIC and FPGA core supplies, 48 V direct-to-processor power stages for data center and telecom equipment, and any sub-1V high-current rail where conventional buck converters would require excessive output capacitance or where 48 V distribution is preferred to reduce I²R losses.
Designers should note that VTM modules are intended to be paired with a Vicor PRM regulator on the primary side; a standalone VTM without a regulated upstream source will not provide a tightly regulated output voltage. The low-AC-impedance SAC behavior also means downstream bulk capacitors can be drastically reduced or relocated to the input side, changing the conventional bulk-decoupling paradigm.
드롭인 대체품: VTM48MP012T130AA0 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
VTM48MP012T130BA0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM48EH012T130AA0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM48MF012T130AA0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM48EP012T130AA0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM48MP010T130AA0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
VTM48MP012T130AA0 최대 정격 & 전기적 특성
| Product Type | VTM (Voltage Transformation Module) / Sine Amplitude Converter |
| 토폴로지 | Sine Amplitude Converter (SAC), fixed-ratio current multiplier |
| Input Voltage (Nominal) | 40 V |
| 입력 전압 범위 | 26 V to 60 V (operating from standard 24V/48V PRM regulators) |
| Output Voltage (Nominal) | 1 V (fixed 1/40 ratio) |
| Output Current (Continuous) | 130 A |
| Transformation Ratio (K) | 1/40 |
| Power Delivery (Approx.) | 130 W to 1560 W depending on input/output conditions |
| 패키지 | Vicor ChiP (co-molded, surface mount) |
| 실장 유형 | Surface Mount (standard pick-and-place compatible) |
| Cooling | Conduction-cooled via package thermal interface; co-molded ChiP body |
| Architecture Pairing | Designed for use with Vicor PRM pre-regulation modules |
| Output Capacitance Multiplier | 1600x reduction vs. conventional POL approaches (per manufacturer) |
| RoHS 상태 | Compliant (per Vicor product page) |
VTM48MP012T130AA0 vicor chip (co-molded, surface mount) 핀 구성 가이드
VTM48MP012T130AA0(vicor chip (co-molded, surface mount) 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: VTM48MP012T130AA0.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
VTM48MP012T130AA0 적합 용도: 6 애플리케이션s: AI Accelerator / GPU Core Voltage Rail, 48 V Direct-to-Processor Data Center Power Stage, FPGA / ASIC Core Supply for High-Speed Compute Boards, Telecom 48 V Bus Point-of-Load Conversion, Test & Measurement High-Current Load Emulator, Industrial High-Power Module / Robotics Drive Stage.
AI Accelerator / GPU Core Voltage Rail
The VTM48MP012T130AA0 is purpose-built for sub-1V high-current core rails on AI accelerator cards and GPUs that require hundreds of amps from a 48 V bus. With its 130 A / 1 V output rating and 1/40 fixed transformation ratio, it delivers the current multiplication needed directly at the load while accepting the upstream regulated 40 V from a Vicor PRM. The 1600x reduction in output capacitance versus a conventional buck frees PCB area around the GPU BGA, and the ChiP package's co-molded thermal path removes hot spots. A reverse-polarity output cap at the load of just a few microfarads is sufficient, simplifying the routing on the GPU power island.
추천
48 V Direct-to-Processor Data Center Power Stage
Hyperscale data centers increasingly distribute 48 V directly to server boards to cut I²R losses in bus bars and harnesses. The VTM48MP012T130AA0 enables the final stage of that 48 V-to-CPU architecture by stepping the 40 V PRM-regulated intermediate bus down to a 1 V CPU core rail at 130 A. Compared with a discrete buck converter at the same conversion ratio, the VTM's SAC topology achieves measurably higher efficiency (often above 96%) and drastically reduces bulk output capacitor count. The ChiP form factor permits pick-and-place assembly on the same SMT line as surrounding digital components.
추천
FPGA / ASIC Core Supply for High-Speed Compute Boards
High-performance FPGAs and ASICs draw 100 A+ from sub-1V rails and are highly intolerant of supply noise. The VTM48MP012T130AA0's low-output-impedance SAC behavior provides a clean, low-ripple 1 V rail at 130 A, while its high conversion efficiency at large VIN-to-VOUT ratios (40:1) minimizes board-level thermal rise. Because output capacitance can be moved to the input side of the VTM, designers gain routing space directly under the BGA - critical for dense FPGA/ASIC boards where every layer of the stackup is contested. The ChiP package supports reflow assembly with the rest of the SMT components.
추천
Telecom 48 V Bus Point-of-Load Conversion
Telecom and networking equipment traditionally use -48 V bus distribution and require isolated, high-current POL rails for baseband processors and network ASICs. The VTM48MP012T130AA0 paired with an isolated PRM and a BCM bus converter provides a complete 48 V-to-1 V power chain. The VTM's 60 V transient tolerance tolerates typical -48 V telecom bus excursions, and its conduction-cooled ChiP body allows direct attachment to a cold plate. Efficiency at 40:1 step-down remains high, reducing total system power dissipation in densely populated line cards.
추천
Test & Measurement High-Current Load Emulator
ATE and bench power systems that emulate sub-1V high-current loads (CPUs, GPUs, ASICs under test) need clean, low-ripple sources at hundreds of amps. The VTM48MP012T130AA0, paired with a PRM, can deliver a programmable 1 V / 130 A rail from a 48 V bench supply, with the PRM providing the dynamic regulation. The VTM's flat-impedance SAC behavior gives the load a near-ideal DC source, improving measurement repeatability. The ChiP form factor also lends itself to compact ATE fixture integration.
추천
Industrial High-Power Module / Robotics Drive Stage
Industrial servo drives and robotics controllers increasingly use 48 V distribution with high-current point-of-load rails for motor control DSPs and FPGA-based controllers. The VTM48MP012T130AA0 delivers 130 A at 1 V from a 40 V intermediate bus, providing the clean low-voltage supply these digital controllers require. The ChiP package's enhanced thermal interface supports conduction cooling into the industrial chassis heatsink, while the 1600x output-capacitance reduction simplifies the mechanical layout of the drive board. Industrial-grade screening grades are available within the same VTM ChiP family.
추천
추천 제품 요약
엔지니어링 참조 데이터: VTM48MP012T130AA0 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | VTM48MP012T130BA0 | VTM48EH012T130AA0 | VTM48MF012T130AA0 | VTM48EP012T130AA0 | VTM48MP010T130AA0 |
|---|---|---|---|---|---|---|
| Package | Vicor ChiP (co-molded SMT) | Vicor ChiP (co-molded SMT) - same | Vicor ChiP (co-molded SMT) - same | Vicor ChiP (co-molded SMT) - same | Vicor ChiP (co-molded SMT) - same | Vicor ChiP (co-molded SMT) - same |
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Output Voltage | 1 V | 1 V | 1.2 V | 1 V | 1 V | 1.0 V |
| Output Current | 130 A | 130 A | 130 A | 130 A | 130 A | 130 A |
| Input Voltage (Nominal) | 40 V | 40 V | 48 V | 40 V | 40 V | 40 V |
| Transformation Ratio (K) | 1/40 | 1/40 | 1/40 (1.2 V @ 48 V in) | 1/40 | 1/40 | 1/40 variant |
| Topology | SAC (Sine Amplitude Converter), unregulated | SAC, unregulated | SAC, unregulated | SAC, unregulated | SAC, unregulated | SAC, unregulated |
| Requires PRM Upstream | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- 1600x reduction in output capacitance requirement (vs Conventional buck converter at 40 V to 1 V / 130 A)
- Higher efficiency at large step-down ratios (vs Conventional buck converter (e.g. 40:1 step-down))
- Co-molded ChiP package with built-in thermal interface (vs Discrete through-hole Vicor legacy modules (VI/VI-J00))
설계 노트
The VTM48MP012T130AA0 must be paired with a Vicor PRM (Pre-Regulation Module) upstream. The PRM provides the regulated 40 V intermediate bus that the VTM then transforms by its fixed 1/40 ratio to the final load voltage. Without a PRM, the VTM output is unregulated and tracks the input scaled by 1/40 - never acceptable as a final supply for digital loads. Plan the upstream PRM selection (PRM48AH480T200A00 is a common match) before committing to the VTM.
Although the ChiP package is highly thermally conductive, 130 A delivery at 1 V still dissipates meaningful power even at high efficiency (estimated: at 96% efficiency, ~5 W dissipation at full load). Provide a thermal interface from the top of the ChiP body to a heatsink or cold plate using the recommended thermal interface material. Do not rely on PCB copper alone for thermal management at full 130 A. Reference the Vicor datasheet mechanical drawing for the thermal interface pad location.
The Vicor ChiP package is reflow-solderable but uses bottom-side power pads rather than traditional leads. Strictly follow Vicor's recommended land pattern and stencil aperture in the datasheet to avoid solder voids, which cause both mechanical and thermal reliability issues. Place input capacitors close to the upstream PRM rather than at the VTM input, taking advantage of the SAC's 1600x output-capacitance reduction - the bulk capacitance normally at the load moves to the PRM side of the VTM.
Do not apply input voltages above 60 V or below 26 V - the SAC topology will not survive. Do not assume the VTM is a regulated POL converter; it is a fixed-ratio current multiplier, and all load regulation must come from the upstream PRM. Do not skip input capacitance - the SAC still requires sufficient input hold-up for the upstream bus. Finally, do not parallel VTM modules without consulting Vicor's paralleling application note; current sharing is not automatic.
규정 준수 정보
RoHS compliance per Vicor product page. AEC-Q100 not applicable for this power-module category. Lead-free confirmed; halogen-free status not explicitly stated in available data and left as 'unknown' per data-authenticity rules.
