XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx
부품 번호: XC3S1600E-4FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $337.83 | $337.83 |
| 10 | $321 | $3,210.00 |
| 100 | $305 | $30,500.00 |
| 500 | $290 | $145,000.00 |
| 1,000 | $276 | $276,000.00 |
XC3S1600E-4FG484I 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that the designer configures in the field via HDL (VHDL/Verilog). Within the programmable logic hierarchy, the FPGA sits above CPLDs in capacity and sits alongside ASSPs as a core digital logic implementation platform for system-on-chip prototyping and production designs.
Key features of the XC3S1600E include 3,688 CLBs/LABs providing high logic density, 572MHz maximum toggle capability supported by dedicated digital clock managers (DCMs), and abundant block RAM for FIFOs and dual-port memories. The 376 I/Os support multiple I/O standards with configurable banks, enabling wide data-path interfaces.
Architecturally, the Spartan-3E platform uses a 4-input look-up table (LUT) based fabric with dedicated carry logic, multiplier blocks, and DCMs for clock conditioning - well suited to cost-sensitive control, glue logic, and DSP-lite tasks. The 90nm process keeps core power low at 1.2V while retaining robust routing flexibility.
Typical applications include industrial control and automation, embedded system prototyping, data acquisition glue logic, motor control interfaces, and communications line cards. The wide 376-I/O budget makes it a natural fit for bus bridging and parallel-to-serial adaptation.
A key design consideration: the Spartan-3E family is mature, so plan configuration via a platform Flash PROM (such as XCF-series) and verify 1.2V core, 3.3V auxiliary, and I/O bank rails meet sequencing guidance in the datasheet.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: XC3S1600E-4FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC3S1600E-4FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S1600E-4FG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S1600E-4FGG484C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S1600E-5FGG484C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S1600E-4FG484I 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Spartan-3E |
| System Gates | 1600000 (1.6M) |
| Logic Elements/Cells | 33192 |
| Logic Blocks (CLBs/LABs) | 3688 |
| Registers | 29504 |
| Total RAM Bits | 663552 bits |
| RAM Size | 81 kB |
| Number of I/Os | 376 |
| Maximum Frequency | 572 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | -4 |
| 동작 온도 | -40C to +100C (Industrial) |
| 패키지 | 484-BBGA / FBGA (FG484) |
| 실장 유형 | Surface Mount |
| Max Operating Temperature | 100 C |
| Min Operating Temperature | -40 C |
XC3S1600E-4FG484I 484-bbga / fbga (fg484) 핀 구성 가이드
XC3S1600E-4FG484I(484-bbga / fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S1600E-4FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S1600E-4FG484I 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Data Acquisition Glue Logic, Embedded System Prototyping, Communications Line Cards, Motor Control Interfaces, Video and Display Logic.
Industrial Control and Automation
The XC3S1600E-4FG484I fits industrial control because its -40C to +100C industrial rating covers factory-floor ambient conditions inside sealed cabinets, while 33,192 logic cells and 3,688 CLBs absorb PLC-style state machines, interlocks, and protocol translation in one device. The 376 user I/Os interface parallel field buses, encoder inputs, and relay drivers directly, and the 663,552 RAM bits buffer sensor histories and communication frames. Placed as the main logic controller between a CPU module and I/O cards, the FPGA toggles timing-critical handshake logic deterministically, unlike a software-only approach; the trade-off is the need to strap configuration mode pins and source a Platform Flash PROM for power-up bitstream load.
추천
Data Acquisition Glue Logic
In multi-channel data acquisition systems, the XC3S1600E-4FG484I bridges high-speed ADCs and DACs to a processor over FIFO-buffered parallel buses. Its 572MHz maximum toggle capability and dedicated DCM clock conditioning let designers generate clean sample clocks and handle source-synchronous interfaces, while 29,504 registers implement capture pipelines and 81 kB of RAM absorbs burst buffering between the analog front end and system memory. Typical connections pair it with TI ADS-series converters from the XAIPART catalog such as the ADS8482IBRGZR for 16-bit parallel sampling; the FPGA resolves the ADC's timing window with matched-length PCB traces and bank voltage matching. The key performance consideration is simultaneous-switching noise on 376 I/Os, mitigated with per-bank decoupling.
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Embedded System Prototyping
The XC3S1600E-4FG484I serves as a flexible prototyping fabric for embedded boards that must emulate ASIC interfaces or validate RTL before tape-out. With 1.6M gates, 33,192 logic cells, and full reconfigurability via JTAG or SPI Flash, a single 484-ball FBGA accommodates processor wrappers, bus bridges, and peripheral models concurrently. Designers load new bitstreams in seconds through ISE tooling, iterating clock domains using on-chip DCMs up to the 572MHz class performance of the -4 speed grade. Compared to a fixed-logic MCU, the FPGA absorbs pin-multiplexed debug taps across its 376 I/Os without PCB respins. The practical trade-off is that 90nm static power is higher than modern 28nm parts, so deep-sleep prototyping rigs should switch VCCINT with a relay or load switch when idle.
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Communications Line Cards
Telecom and datacom line cards use the XC3S1600E-4FG484I for framing, scrambling, and bus adaptation between PHY devices and backplane interfaces. The 376 I/Os support the wide parallel buses of legacy framers, while block RAM implements elastic buffers and dual-port descriptor queues across the 663,552 available bits. Distributed arithmetic in the LUT fabric handles CRC and checksum computation at line rate without dedicated DSP blocks. In a typical card, the FPGA sits between a backplane connector and a PHY/MAC pair, with VCCO banks set to 3.3V or 2.5V to match legacy signaling. Performance consideration: the -4 speed grade comfortably supports 100-155Mbps-class processing, but SerDes-class rates require a newer 7-series FPGA such as the XC7Z020-1CLG484I, which is a redesign rather than a drop-in.
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Motor Control Interfaces
Industrial drives benefit from the XC3S1600E-4FG484I's ability to generate precisely timed PWM patterns, decode quadrature encoder feedback, and supervise gate-driver interlocks in deterministic hardware. With 29,504 registers, designers implement multi-axis PWM counters with dead-band generation at nanosecond resolution, while the industrial -40C to +100C range suits drive enclosures near motors. The FPGA's 1.2V core keeps logic power modest even at full utilization, and its DCMs discipline the PWM carrier clocks derived from a single crystal. Interface it with gate drivers from the XAIPART catalog such as the UCC21750DW for isolated IGBT switching; the FPGA provides shutdown interlocks within one clock cycle, a safety advantage over interrupt-latency-bound MCU supervision. Budget I/O slew settings to control dv/dt coupled into gate loops.
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Video and Display Logic
The XC3S1600E-4FG484I implements scan conversion, parallel video bus translation, and LCD timing generation for industrial displays and legacy video equipment. Its 572MHz-class fabric and DCM-based pixel clock synthesis support VGA-through-XGA class pixel rates, while block RAM holds line buffers for scaling or de-interlacing operations within the 663,552-bit budget. The 376 I/Os accommodate wide RGB parallel video buses plus control and EDID channels on separate voltage banks, and deterministic fabric timing prevents frame tearing that software pipelines can introduce. Place the FPGA between a video source connector and a TFT panel driver, matching VCCO to 3.3V TTL signaling. Performance consideration: at high pixel clocks, register timing closure in ISE should be verified, and 90nm power density in the 23x23mm-class FBGA needs modest copper pours rather than heatsinks.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC3S1600E-4FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S1600E-4FGG484I | XC3S1600E-4FG484C | XC3S1600E-4FGG484C | XC3S1600E-5FGG484C |
|---|---|---|---|---|---|
| Package | 484-BBGA (FG484) | 484-BBGA (FG484) - same | 484-BBGA (FG484) - same | 484-BBGA (FG484) - same | 484-BBGA (FG484) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| System Gates | 1.6M | 1.6M | 1.6M | 1.6M | 1.6M |
| Logic Cells | 33192 | 33192 | 33192 | 33192 | 33192 |
| User I/Os | 376 | 376 | 376 | 376 | 376 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -4 | -4 | -4 | -4 | -5 (faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
주요 차별점
- Largest Spartan-3E logic density in the FG484 footprint (vs XC3S1400AN-4FG484I)
- Industrial temperature rating (vs XC3S1600E-4FG484C)
- RoHS-compliant drop-in available on identical footprint (vs XC3S1600E-4FGG484I)
설계 노트
The XC3S1600E-4FG484I requires three rail classes: 1.2V VCCINT (core), 3.3V VCCAUX (auxiliary), and per-bank VCCO for the 376 I/Os. Follow the Spartan-3E DS312 power-ramp guidance; the 1.2V core value is confirmed in distributor specification tables. With up to 376 simultaneously switching I/Os, provide bulk capacitance (e.g., 100uF tantalum per bank) plus 0.1uF ceramics at each VCCO pin pair. Verify power-up sequencing per the datasheet configuration chapter to prevent bitstream latch-up issues.
The 484-ball FBGA requires via-in-pad or dog-bone fanout on a dense BGA breakout; plan at least 4 signal layers with dedicated ground plane under the ball field. Use Xilinx-provided IBIS models from the Spartan-3E support package to simulate bank terminations for parallel buses. Keep configuration mode pins (M0-M2) strapped with pull resistors and keep the JTAG chain short for reliable boundary scan. Estimated: a 1.2mm ball pitch field needs 0.15mm trace/spacing to escape a single row - confirm with your fab's capability.
The Spartan-3E family is mature: design-in should include an external Platform Flash PROM (XCF-series) since there is no internal Flash, and the ISE toolchain (not Vivado) is required for bitstream generation. Do not confuse FG484 with FG320/FG400 packages - ball maps differ. When substituting -4I with -4C commercial parts, re-verify worst-case timing and enclosure temperature because the 0C to +85C commercial limit may not cover industrial ambient profiles.
규정 준수 정보
Compliance status for the FG484I (non-GG) suffix was not stated in the verified web data. The GG-suffix sibling (XC3S1600E-4FGG484I) is the RoHS-compliant lead-free variant per LCSC and distributor listings. AEC-Q100 is not applicable to this commercial/industrial FPGA family.
