XC6SLX100-2FG676C - Spartan-6 LX FPGA, 667 MHz | AMD
부품 번호: XC6SLX100-2FG676C ✓ 활성XC6SLX100-2FG676C 개요
A field-programmable gate array is a semiconductor whose logic fabric, interconnect, and configurable I/O blocks can be programmed after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining parallel programmable logic, block RAM, dedicated processing resources, dedicated I/O resources, and programmable serial transceivers where applicable. This differs from a fixed-function application-specific integrated circuit because the board designer can adapt the implemented logic and interface behavior without changing the physical device.
The Spartan-6 LX family is positioned for designs requiring more integration than small programmable logic devices while retaining a comparatively accessible FPGA architecture. The 667 MHz internal-frequency figure establishes the device's performance class, although actual interface throughput also depends on the selected I/O standards, clocking topology, routing, and implemented logic. The -2 speed suffix identifies the performance grade, and the trailing package and temperature identifiers distinguish the exact ordering configuration from other Spartan-6 LX members.
Designs using this device must account for its BGA assembly, ball assignment, power architecture, configuration method, and high-speed routing requirements. Configuration data must be loaded correctly before the FPGA begins its user-defined logic operation. Board planners should preserve the manufacturer's recommended power, decoupling, clock, and package-construction guidance, especially around banks operating at different voltage domains. Signal integrity is also important because the fine 0.80 mm package pitch constrains escape routing and demands careful PCB stack-up and return-path planning.
Typical uses include industrial automation controllers, network-interface bridging, data-acquisition equipment, embedded video and control systems, communications infrastructure, and test equipment. The Spartan-6 LX fabric is particularly useful when several fixed interfaces must be consolidated into one programmable device while preserving parallel I/O flexibility. In these systems, the FPGA can implement protocol conversion, buffering, timing control, data formatting, and supervisory logic around external transceivers or processors.
The principal design trade-off is that an FPGA adds configuration, toolchain, pin-planning, and thermal-management requirements compared with an ASIC or fixed microcontroller. Designers should choose this part when programmable logic, flexible I/O, and field-update capability justify that complexity. If only a small control algorithm is required, a microcontroller may be simpler; if fixed high-volume functionality is required, an ASIC may ultimately be more economical.
This product record consolidates the available package, speed, process, temperature, and sourcing information, then adds application guidance, pinout-status disclosure, verified comparison fields, and practical design notes. It is intended to help engineers screen the exact ordering code before reviewing the manufacturer Spartan-6 documentation and completing board-level validation.
드롭인 대체품: XC6SLX100-2FG676C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX100-2FG676C (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Package Type, Speed Grade.
XC6SLX100-2FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-3FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-3FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-3FG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX100-2FG676C 최대 정격 & 전기적 특성
| Device Type | FPGA |
| Product Family | Spartan-6 LX |
| Device Designation | XC6SLX100 |
| Speed Grade | -2 |
| Internal Frequency | 667 MHz |
| Logic Technology | 45 nm |
| Package Type | 676-BGA |
| Package Description | CSBGA-484, 19 mm x 19 mm, 0.80 mm pitch |
| Package Dimensions | 19 mm x 19 mm |
| Package Pitch | 0.80 mm |
| Number of Package Balls or Pins | 484 |
| 동작 온도 | 0°C to 85°C |
| 실장 유형 | Surface Mount |
| Lead-Free Package | Lead Free |
XC6SLX100-2FG676C lead free 핀 구성 가이드
XC6SLX100-2FG676C(lead free 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX100-2FG676C.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX100-2FG676C 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Network Interface Bridging, Data Acquisition and Signal Conditioning, Communications Equipment, Embedded Video and Display Control, Programmable Test and Measurement.
Industrial Automation Controller
The XC6SLX100-2FG676C fits an industrial automation controller because its programmable Spartan-6 LX logic can consolidate machine sequencing, parallel I/O, and communication adaptation around a processor or microcontroller. The 667 MHz internal frequency supports the timing demands of control, diagnostics, and data-formatting functions without imposing a fixed instruction-set architecture on the design. Its 0°C to 85°C commercial range suits controlled enclosures, although machinery near heat sources should use an industrial-temperature ordering option. Keep I/O planning tied to the manufacturer's bank rules and place decoupling close to the BGA power and ground balls.
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Network Interface Bridging
The XC6SLX100-2FG676C is appropriate for protocol conversion and interface bridging because FPGA logic can accommodate parallel buses, serialization boundaries, clock-domain differences, and packet-format transformations in one configurable device. The 667 MHz performance class supports common embedded networking control functions, while its extensive programmable I/O can bridge legacy peripherals to a higher-speed processor bus. The design must use approved clocking and I/O standards, and high-speed routes should have continuous reference planes to preserve signal integrity during switching.
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Data Acquisition and Signal Conditioning
The XC6SLX100-2FG676C can implement acquisition control, parallel data capture, digital filtering, and buffer management in test and measurement equipment. Its 667 MHz internal frequency and programmable logic fabric allow deterministic pipelines to be built around external converters without relying on a processor for every data-transfer operation. System timing margins must be established for the selected I/O standards and clock sources. Designers should also verify that the implemented architecture fits the device's logic, block-RAM, and DSP resources before schematic and PCB signoff.
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Communications Equipment
The XC6SLX100-2FG676C suits communications equipment requiring configurable framing, buffering, backplane conversion, or protocol monitoring. The FPGA architecture permits dedicated logic to be implemented alongside general control functions, while the 667 MHz internal frequency supports common serial, parallel, and packet-processing pipelines. For designs with external transceivers, validate voltage standards, clock topology, termination, and expected insertion loss. Keep configuration storage and startup behavior deterministic so that the communications equipment reaches a known operating state after power restoration.
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Embedded Video and Display Control
The XC6SLX100-2FG676C can implement display timing, pixel-stream processing, control interfaces, and custom video pipelines when system requirements exceed a simple fixed-function display controller. Its programmable I/O and 667 MHz processing class allow multiple timing and data paths to be coordinated in one FPGA. The exact display interface must still satisfy voltage, timing, and signal-integrity requirements at the selected package balls. Use controlled impedance routing, appropriate escape geometry, and panel-specific test points because BGA assembly can make physical rework difficult.
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Programmable Test and Measurement
The XC6SLX100-2FG676C is useful in programmable test systems where pattern generation, timing control, data capture, and instrument-interface management benefit from parallel FPGA logic. A designer can configure acquisition sequences and I/O mappings while retaining deterministic behavior under repetitive test conditions. The commercial temperature range supports standard laboratory and factory equipment, but airflow and enclosure temperature must remain within limits. Confirm resource usage for the intended bitstream and verify board-level signal integrity after BGA assembly.
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추천 제품 요약
엔지니어링 참조 데이터: XC6SLX100-2FG676C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX100-2FGG676I | XC6SLX100-3FGG676C | XC6SLX100-3FGG676I | XC6SLX100-3FG676C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA | 676-BGA | 676-BGA | 676-BGA | 676-BGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Device Designation | XC6SLX100 | XC6SLX100 | XC6SLX100 | XC6SLX100 | XC6SLX100 |
| Speed Grade | -2 | -2 | -3 | -3 | -3 |
| Logic Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Package Pitch | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm |
주요 차별점
- Commercial-temperature ordering matches controlled industrial environments (vs XC6SLX100-2FGG676I)
- Established -2 performance class with 667 MHz internal frequency (vs XC6SLX100-3FGG676C)
- Same-family 676-BGA alternatives simplify PCB reuse (vs XC6SLX100-3FGG676I)
설계 노트
Treat the 0.80 mm-pitch BGA as a controlled-impedance and fine-pitch assembly problem. Follow the manufacturer package drawing for escape geometry, pad design, via arrays, and solder-mask construction. Place the FPGA close to its memory and clocking circuitry to minimize high-speed route length, and preserve uninterrupted reference planes beneath the device so that switching current has a short return path.
Build the power tree from the manufacturer's core and I/O supply requirements rather than assigning voltage rails by bank name alone. Decoupling capacitors must connect to the intended power and ground balls with minimal loop area. Estimate dynamic power from the actual logic, clocking, I/O activity, speed grade, and temperature; the -3 alternatives may change dynamic power, so repeat the budget and thermal analysis after any speed-grade substitution.
Do not interchange the -2FGG676C ordering code with the target -2FG676C code without decoding every suffix. The available listings repeatedly identify FGG676C variants, while the requested MPN omits one G. Confirm device type, speed grade, package ball map, temperature range, and lead-free construction against the manufacturer ordering guide before placing an order or releasing a PCB.
Estimate junction temperature from total FPGA dissipation, package thermal characteristics, board construction, and the actual airflow condition. The commercial 0°C to 85°C range does not mean the junction may safely reach 85°C. For dense Spartan-6 LX designs, provide copper area, thermal vias, and enclosure airflow appropriate to the calculated dissipation, then measure temperature during representative logic and I/O activity.
규정 준수 정보
The package description identifies a lead-free construction. No explicit RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification statement is available for the exact ordering code.
