XC7A75T-1FGG676I - 75,520-Cell Artix-7 FPGA | AMD
부품 번호: XC7A75T-1FGG676I ✓ 활성XC7A75T-1FGG676I 개요
An FPGA is a reconfigurable digital integrated circuit whose internal logic blocks, programmable interconnect, block RAM, and DSP resources can be configured after manufacture. In the product hierarchy, an FPGA is a semiconductor and programmable logic device; the Artix-7 family provides a balance of logic density, performance-per-watt, DSP capability, and cost. The XC7A75T is larger than smaller Artix-7 devices while remaining within a 676-ball FBGA footprint that provides substantial I/O and power connectivity.
Verified data identifies 75,520 logic cells, 300 I/O pins, MMCM and PLL resources, 200 MHz device performance, and a 1 V operating range for this part. These resources support parallel datapath designs, digital control, communications, signal processing, and embedded system control. The 300 available I/O pins are particularly useful when a design requires multiple buses, memory interfaces, high-speed transceivers implemented in fabric, or external peripheral connectivity. The MMCM and PLL resources allow designs to derive or distribute clock signals when the design requires controlled frequency relationships.
The 28 nm CMOS implementation supports a compact, power-efficient solution for designs needing more parallel processing than discrete logic can provide. Configuration determines the implemented circuit, allowing design revisions and product-family flexibility without changing the PCB. In a prototype, the FPGA can support multiple functions concurrently, such as control logic, data acquisition, DSP filtering, and communication formatting. This integration reduces the number of separate programmable components, although the exact internal resource allocation depends on the selected design and tool configuration.
Typical applications include industrial automation and factory control, robotics, communications infrastructure, instrumentation, medical monitoring, and embedded control systems. The XC7A75T is also appropriate for education, prototyping, and research environments where designers need access to a relatively high density of programmable logic and DSP resources. These uses benefit from parallel processing and the ability to implement multiple data paths without requiring a separate processor for every function.
The key design consideration is package and power planning. A 676-ball FBGA device requires careful PCB layout, power delivery, thermal management, and high-density manufacturing capability. Designers should use the AMD package pinout files and the appropriate device documentation to verify ball assignments, decoupling, configuration interfaces, and I/O constraints. This page combines verified distributor specifications, pricing references where available, package information, and practical migration guidance for engineers evaluating the XC7A75T.
드롭인 대체품: XC7A75T-1FGG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A75T-1FGG676I (동일 폼 팩터 및 풋프린트) — 차이점: Package Type.
XC7A75T-1FGG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC7A75T-2FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A75T-2FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A100T-1FGG676I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7A75T-1FGG676I 최대 정격 & 전기적 특성
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 75,520 cells |
| Maximum I/O Pins | 300 pins |
| Maximum Device Performance | 200 MHz |
| Core Supply Voltage | 0.950 V to 1.05 V |
| Process Technology | 28 nm CMOS |
| 패키지 | 676-ball FBGA |
| Package Type | 676-BGA |
| Package Code | FGG676 |
| Temperature Grade | Industrial grade |
| Clocking Resources | MMCM and PLL |
| Terminal Count | 676 terminals |
| 장착 스타일 | Surface mount |
| Package Shape | Square |
| Maximum Seated Height | 2.44 mm |
XC7A75T-1FGG676I square 핀 구성 가이드
XC7A75T-1FGG676I(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7A75T-1FGG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7A75T-1FGG676I 적합 용도: 6 애플리케이션s: Industrial Automation and Factory Control, Robotics and Motion Control, Communication and Network Equipment, Medical Monitoring and Diagnostic Systems, Test and Measurement Instrumentation, Embedded Control and Prototyping.
Industrial Automation and Factory Control
The XC7A75T-1FGG676I fits factory-control equipment that must combine deterministic parallel logic with industrial temperature requirements. Its 75,520 logic cells can host sequencing, machine-state machines, interlocks, counter logic, and communication formatting, while 300 I/O pins provide substantial connectivity to sensors, actuators, motor drives, and operator interfaces. The industrial “I” grade is the relevant advantage over commercial C-grade alternatives. In a typical machine-control board, the FPGA can process encoder inputs, coordinate safety interlocks, and format data for an upstream processor. The 28 nm CMOS implementation also supports a compact, reconfigurable architecture. Designers should use the AMD Artix-7 package pinout files, define the power and ground distribution network, and reserve the 676-ball FBGA for a manufacturing process capable of handling its fine pitch and thermal requirements.
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Robotics and Motion Control
The XC7A75T-1FGG676I is suitable for robotic controllers that must coordinate multiple sensors, encoders, and actuator commands in real time. The 75,520-cell fabric allows parallel control blocks and DSP-oriented datapaths to coexist, while 300 I/O pins can support digital feedback channels, communication ports, and timing inputs. Compared with discrete controller implementations, an FPGA can combine deterministic logic, pulse-width generation, position processing, and safety sequencing in one programmable device. The verified 200 MHz maximum device performance provides a defined basis for timing analysis, although actual interface rates depend on the design, I/O standards, and routing. A robot controller can place the FPGA beside motor-driver circuitry and use its I/O banks for encoder capture and synchronized command generation. Engineers should validate voltage-tolerance levels, pin constraints, clocking topology, and thermal performance before release.
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Communication and Network Equipment
The XC7A75T-1FGG676I can implement protocol conversion, packet processing, test logic, and interface bridging in communications equipment. Its 75,520 logic cells provide capacity for parallel packet classification, buffers, and state machines, while 300 I/O pins can be partitioned among high-speed serial fabrics, parallel buses, and control interfaces. The MMCM and PLL resources identified in the verified data help engineers develop internal clock relationships for multi-rate systems. Unlike a fixed-function network ASIC, the FPGA allows protocol updates and field-specific logic changes to be programmed without a PCB respin. A typical adapter can terminate multiple physical layers, validate frames, and transfer data to an embedded processor. The design must still account for I/O standards, timing closure, board-level signal integrity, and the dense FBGA layout. The same-package Artix-7 alternatives are useful when temperature or performance-grade requirements differ.
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Medical Monitoring and Diagnostic Systems
The XC7A75T-1FGG676I can support signal-acquisition, filtering, feature extraction, and control functions in medical monitoring equipment. Its 75,520 logic cells allow multiple sensor channels and digital signal-processing blocks to be integrated, while 300 I/O pins provide connections to converters, memories, and communications modules. The industrial temperature designation may be useful in laboratory, monitoring, and diagnostic equipment where the manufacturer specifies industrial-grade components. The device can implement parallel data paths or DSP-style processing while the design migrates algorithms through configuration. For connected systems, Ethernet or USB transceivers can provide data transfer to a host. Because the supplied data does not establish medical certification, developers should treat regulatory qualification as a separate design requirement and confirm operating-temperature and reliability limits in the current AMD documentation.
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Test and Measurement Instrumentation
The XC7A75T-1FGG676I is well suited to programmable instrumentation that combines acquisition, pattern generation, timing control, and analysis. The 75,520-cell fabric provides room for parallel acquisition paths and control sequences, and the 300 I/O pins permit flexible assignment across data buses, trigger lines, and external converters. The verified 200 MHz device-performance figure offers a useful reference for synchronous logic, while MMCM and PLL resources support derived and distributed clocks. In an automated test system, the FPGA can coordinate stimuli, capture responses, and execute real-time analysis without relying on a general-purpose processor for every cycle. Designers should use the device's clocking and I/O guidelines to establish timing margins, and should evaluate the 676-ball package for probing, assembly, and thermal-design requirements. The same-density -2 alternatives may help where a higher speed grade is valuable.
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Embedded Control and Prototyping
The XC7A75T-1FGG676I provides a substantial programmable fabric for embedded-control prototypes, FPGA-based education platforms, and research systems. Engineers can implement multiple CPUs in hardware, custom instruction pipelines, sensor fusion logic, test benches, and accelerator functions, then revise the design through configuration rather than replacing discrete components. Its 75,520 logic cells and 300 I/O pins offer enough connectivity for common development boards and custom peripheral interfaces, while 28 nm CMOS technology supports a modern implementation. The device is especially useful when a prototype requires more parallelism or deterministic control than a microcontroller provides. Development planning should include memory interface constraints, configuration storage and boot behavior, clock-source assignment, and JTAG access. PCB implementation also requires careful BGA fanout, decoupling, and thermal validation before the design is placed into production.
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추천 제품 요약
엔지니어링 참조 데이터: XC7A75T-1FGG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A75T-1FGG676C | XC7A75T-2FGG676I | XC7A75T-2FGG676C | XC7A100T-2FGG676I | XC7A100T-1FGG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FBGA | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same |
| Logic Cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 101,440 cells | 101,440 cells |
| Performance Grade | -1 | -1 | -2 | -2 | -2 | -1 |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Industrial | Industrial |
| Process Technology | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS |
| Clocking Resources | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL |
주요 차별점
- Industrial temperature grade within the same-density Artix-7 options (vs XC7A75T-1FGG676C)
- Lower performance-grade designation than the -2 alternatives (vs XC7A75T-2FGG676I)
- Lower logic density than the 100T family alternative (vs XC7A100T-2FGG676I)
설계 노트
Treat the 676-ball FBGA as a high-density routed component. Use the AMD Artix-7 package pinout files and current package drawings to assign power, ground, configuration, clock, and user I/O balls. Follow the recommended escape-routing, via, and layer-transition strategy for the exact PCB stack-up; preserve the specified power and ground plane connectivity, and validate the completed layout with the manufacturer's design-rule and signal-integrity guidance.
The verified core voltage range is 0.950 V to 1.05 V, so the regulator network, sequencing, and decoupling must be designed for the complete Artix-7 device power architecture rather than a single nominal rail. Use only the power pins and bank-specific requirements defined in the current device documentation. Confirm the final bill of materials against the manufacturer's power-supply and decoupling recommendations, because the supplied search data does not provide rail current limits, startup sequencing, or capacitor values.
Estimate total dissipation from the finalized design rather than the nominal 200 MHz device-performance figure, since actual activity factor, I/O loading, voltage, and core power depend on implementation. Use the current Artix-7 power-estimation workflow and the package thermal model, then check junction-temperature margin across ambient and industrial-temperature conditions. Provide copper planes and thermal vias where the package design supports them, and avoid assuming that the BGA package alone is sufficient for high-utilization industrial operation.
Do not treat same-package Artix-7 variants as unconditional replacements. A -1 to -2 change alters the nominal performance grade, an I to C change alters the temperature class, and a move from the 75T to 100T device changes the logic-cell count from 75,520 to 101,440. Before substitution, rerun synthesis, placement, timing, power, and bitstream generation; then verify configuration, boot behavior, I/O constraints, and PCB assembly using the exact device documentation.
규정 준수 정보
The supplied verified snippets identify the industrial temperature grade and 28 nm CMOS process but do not explicitly provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Automotive qualification is not established for this FPGA, so AEC-Q100 is marked not_applicable.