XC6SLX150-3FG484I - 147443-LE Spartan-6 FPGA | AMD
부품 번호: XC6SLX150-3FG484I ✓ 활성XC6SLX150-3FG484I 개요
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor containing programmable logic, memory, and input/output resources. FPGAs sit above fixed-function logic devices in the implementation hierarchy because designers can alter the interconnect and function of the same physical device by loading a new bitstream. Spartan-6 devices combine this reconfigurable architecture with block RAM, digital signal processing resources, clock management, and high-speed serial transceivers.
The XC6SLX150-3FG484I is suited to designs requiring substantial parallel logic and programmable I/O. Its 147,443 logic cells provide substantial capacity for control logic, interface bridging, signal processing, and embedded protocol handling. The 338 I/O support flexible connection to memory, displays, communications equipment, industrial controllers, and test systems. A 667 MHz internal figure reflects the speed class of the device, while the -3 suffix identifies the highest-performance Spartan-6 LX speed grade.
The device is manufactured using 45 nm CMOS technology and belongs to the Spartan-6 LX family. Its 484-ball package concentrates a high pin count into a compact surface-mount footprint, but it also requires careful PCB layout, controlled escape routing, and careful power-delivery design. Configuration and programming depend on the selected bitstream and board-level programming method, so engineers should evaluate boot configuration, JTAG access, and power sequencing before releasing the PCB layout.
Typical applications include industrial automation, communications infrastructure, instrumentation, embedded control, video-processing pipelines, and high-speed interface aggregation. The 338 I/O are useful for parallel sensor acquisition and legacy peripheral control, while the high logic-cell count supports multiple independent digital subsystems. Industrial equipment benefits from the specified 0 to 85 °C operating range, provided the board layout maintains acceptable junction temperature.
A principal design consideration is that the 484-ball package requires dense escape routing and multiple supply connections. Use the AMD Spartan-6 package pinout files to assign every ball correctly, and follow the manufacturer’s power, decoupling, and configuration guidance before fabrication. Confirm the exact I/O standard, voltage tolerances, and bank constraints against the selected design constraints.
This product page combines package, logic-resource, speed-grade, and temperature information with practical configuration guidance and same-family drop-in alternatives. It is intended to accelerate engineering selection while keeping the distinction between verified device attributes, package constraints, and application-specific design requirements clear.
드롭인 대체품: XC6SLX150-3FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX150-3FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Logic Cells, Core Supply Voltage, Lead-Free Status, Operating Temperature.
XC6SLX150-3FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-3FG484C
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX150-3FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-2FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-2FG484I
✅ 드롭인가격 문의
데이터시트 보기 →XC6SLX150-3FG484I 최대 정격 & 전기적 특성
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 147,443 logic cells |
| Adaptive Logic Modules | 23,038 ALMs |
| User I/O | 338 I/O |
| Internal Frequency | 667 MHz |
| Performance Grade | -3 speed grade |
| Core Supply Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| Package Type | 484-ball CSBGA, surface mount |
| Package Dimensions | 19 mm × 19 mm |
| Ball Pitch | 0.80 mm |
| Total Package Balls | 484 balls |
| 동작 온도 | 0 °C to +85 °C |
| Lead-Free Status | Lead-free package |
| Product Family | Spartan-6 LX |
| Device Architecture | Configurable FPGA architecture with 147,443 logic cells |
XC6SLX150-3FG484I 484 balls 핀 구성 가이드
XC6SLX150-3FG484I(484 balls 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX150-3FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX150-3FG484I 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Communications Signal Aggregation, Test and Measurement Instrumentation, Parallel Sensor Acquisition, Embedded Video Processing, Aerospace and Defense Control Module.
Industrial Automation Controller
The XC6SLX150-3FG484I fits industrial controllers that combine parallel machine I/O, sequencing logic, communications gateways, and local data processing. Its 147,443 logic cells provide substantial room for control state machines and protocol engines, while 338 user I/O support encoders, discrete sensors, relay drivers, and operator interfaces. The -3 speed grade is useful when deterministic logic paths must close with timing margin, and the 0 to 85 °C specification supports industrial ambient conditions. Design the board around the AMD 484-ball pinout, validate every I/O voltage domain, and maintain an enclosure airflow and copper plan that keeps the FPGA within its operating-temperature limits.
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Communications Signal Aggregation
The AMD XC6SLX150-3FG484I is appropriate for communications equipment that must consolidate multiple interfaces, perform protocol conversion, and buffer data between subsystems. The Spartan-6 LX architecture supplies 147,443 logic cells and 338 user I/O, allowing parallel Ethernet PHY control, backplane interfaces, status multiplexing, and test paths to coexist in one device. Its 667 MHz internal frequency supports demanding registered logic, while the -3 grade provides additional timing margin for critical paths. Engineers should use the manufacturer I/O characterization to establish voltage and timing margins for each high-speed bank, and should verify that the selected transceiver and connector strategy does not impose requirements beyond the device’s stated operating conditions.
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Test and Measurement Instrumentation
The XC6SLX150-3FG484I can serve as the digital control core in oscilloscopes, logic analyzers, protocol testers, and automated measurement systems. Its large logic-cell count supports acquisition pipelines, trigger logic, timing engines, and instrument-control interfaces, while 338 I/O provide flexible connections to probes, front panels, memory devices, and synchronization circuits. The -3 speed grade benefits high-throughput parallel datapaths and can improve timing closure for registered acquisition stages. For sensitive analog or high-impedance front ends, keep the FPGA away from high-energy switching nodes and provide local filtering. Pin assignments must also account for dedicated configuration, clock, and power balls in the 484-ball package.
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Parallel Sensor Acquisition
The AMD XC6SLX150-3FG484I works well in multi-channel acquisition and conditioning systems where numerous sensor outputs must be sampled, filtered, timestamped, and transferred. The 338 user I/O provide ample parallel digital channels, while the 147,443 logic cells support channel control, calibration tables, digital filtering, and communication formatting. The 667 MHz internal frequency enables pipelined processing, and the industrial temperature rating suits equipment deployed in controlled industrial environments. Keep analog and digital return paths separated on the PCB, place interface protection close to connectors, and use the device’s I/O-standard rules to establish whether external level shifting or series termination is required.
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Embedded Video Processing
The XC6SLX150-3FG484I can implement parallel video timing, pixel formatting, overlay generation, and control functions in embedded display systems. Its 147,443 logic cells support substantial pipeline logic, while 338 I/O accommodate parallel or multiplexed display interfaces and associated control signals. The -3 speed grade is advantageous for timing-critical pixel pipelines, and the 484-ball package accommodates the substantial pin count of a complex digital subsystem. Design constraints must include the selected display interface’s voltage tolerance, clock jitter budget, and video timing requirements. Place the FPGA and its memory interfaces according to the manufacturer’s layout guidance so switching activity does not impair signal integrity.
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Aerospace and Defense Control Module
The XC6SLX150-3FG484I may be evaluated for programmable control, data acquisition, and interface logic in aerospace and defense equipment, provided the design satisfies program-specific qualification, radiation, temperature, and procurement requirements. The device offers 147,443 logic cells, 338 user I/O, and a -3 performance grade for complex timing-sensitive digital logic. Its stated 0 to 85 °C operating range does not by itself establish suitability for every aerospace environment. Engineers must obtain the applicable AMD product documentation and program specifications, verify any extended-temperature or qualified ordering option, and complete reliability, fault-tolerance, and lifecycle assessments before using the device as a drop-in part in safety-critical equipment.
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추천 제품 요약
엔지니어링 참조 데이터: XC6SLX150-3FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX150-3FGG484I | XC6SLX150-3FG484C | XC6SLX150-3FGG484C | XC6SLX150-2FGG484I | XC6SLX150-2FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA |
| Logic Cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells |
| User I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O |
| Performance Grade | -3 speed grade | -3 speed grade | -3 speed grade | -3 speed grade | -2 speed grade | -2 speed grade |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | Commercial temperature grade | Commercial temperature grade | 0 °C to +85 °C | 0 °C to +85 °C |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Package Body Size | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm |
주요 차별점
- Highest Spartan-6 LX performance grade in the listed alternatives (vs XC6SLX150-2FGG484I)
- Industrial temperature coverage (vs XC6SLX150-3FG484C)
- Large configurable logic and interface capacity (vs XC6SLX150-3FGG484I)
설계 노트
Treat the 484-ball CSBGA as a high-density routing problem. Import the exact AMD package pinout file before placement, preserve the 0.80 mm ball pitch, and use the package drawing to define courtyard, solder-mask, and paste-land geometry. Assign the 338 user I/O only after checking bank-level voltage and standard restrictions; configuration, clock, power, and ground balls are not interchangeable with user I/O.
Implement a layered power network for the 1.2 V core and all required auxiliary rails. Place local bulk and high-frequency decoupling at the associated package balls, keep the return path continuous beneath high-speed nets, and use the AMD Spartan-6 power-supply recommendations for regulators, sequencing, and current capacity. Validate voltage tolerances under combined processor and I/O activity because a static rail calculation alone does not establish acceptable transient behavior.
Route high-speed clocks and interfaces as controlled-impedance nets with continuous reference planes and deliberate escape routing from the BGA array. Minimize stubs, apply manufacturer-recommended termination, and keep clock distribution symmetric where practical. After PCB fabrication, use the design’s signal-integrity simulation results and measured clock quality to confirm that the -3 timing margin is not being reduced by loss, skew, crosstalk, or excessive loading.
Use a thermal plan appropriate for a 45 nm FPGA in a compact 19 × 19 mm package. Spread heat through PCB copper, maintain airflow across the board when required, and account for nearby regulators, memory, and interface devices. Validate the enclosure at the highest expected ambient temperature and operating workload. The 0 to 85 °C specification describes device operating conditions, not the junction-temperature margin or enclosure temperature automatically.
Do not confuse the 338 user I/O with the 484 physical package balls, and do not treat the FG and FGG package suffixes as typographical variants. Do not approve a lower-speed -2 substitute until the existing design has been re-synthesized and timing-closed. Similarly, do not replace the industrial-temperature I suffix with a commercial C suffix in equipment exposed to temperatures above the commercial grade’s operating limit.
규정 준수 정보
The package is identified as lead-free. A separate distributor data source labels this ordering code as RoHS non-compliant, but no manufacturer compliance statement was available to confirm that status, so the structured RoHS field remains unknown.
