XC6SLX150-3FG484I - 147443-LE Spartan-6 FPGA | AMD
MPN： XC6SLX150-3FG484I ✓ 啟用中XC6SLX150-3FG484I 概覽
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor containing programmable logic, memory, and input/output resources. FPGAs sit above fixed-function logic devices in the implementation hierarchy because designers can alter the interconnect and function of the same physical device by loading a new bitstream. Spartan-6 devices combine this reconfigurable architecture with block RAM, digital signal processing resources, clock management, and high-speed serial transceivers.
The XC6SLX150-3FG484I is suited to designs requiring substantial parallel logic and programmable I/O. Its 147,443 logic cells provide substantial capacity for control logic, interface bridging, signal processing, and embedded protocol handling. The 338 I/O support flexible connection to memory, displays, communications equipment, industrial controllers, and test systems. A 667 MHz internal figure reflects the speed class of the device, while the -3 suffix identifies the highest-performance Spartan-6 LX speed grade.
The device is manufactured using 45 nm CMOS technology and belongs to the Spartan-6 LX family. Its 484-ball package concentrates a high pin count into a compact surface-mount footprint, but it also requires careful PCB layout, controlled escape routing, and careful power-delivery design. Configuration and programming depend on the selected bitstream and board-level programming method, so engineers should evaluate boot configuration, JTAG access, and power sequencing before releasing the PCB layout.
Typical applications include industrial automation, communications infrastructure, instrumentation, embedded control, video-processing pipelines, and high-speed interface aggregation. The 338 I/O are useful for parallel sensor acquisition and legacy peripheral control, while the high logic-cell count supports multiple independent digital subsystems. Industrial equipment benefits from the specified 0 to 85 °C operating range, provided the board layout maintains acceptable junction temperature.
A principal design consideration is that the 484-ball package requires dense escape routing and multiple supply connections. Use the AMD Spartan-6 package pinout files to assign every ball correctly, and follow the manufacturer’s power, decoupling, and configuration guidance before fabrication. Confirm the exact I/O standard, voltage tolerances, and bank constraints against the selected design constraints.
This product page combines package, logic-resource, speed-grade, and temperature information with practical configuration guidance and same-family drop-in alternatives. It is intended to accelerate engineering selection while keeping the distinction between verified device attributes, package constraints, and application-specific design requirements clear.
直接替換替代品，適用於 XC6SLX150-3FG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX150-3FG484I （相同外形與佔位） — 差異在於 Device Type, Logic Cells, Core Supply Voltage, Lead-Free Status, Operating Temperature.
XC6SLX150-3FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-3FG484C
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX150-3FGG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-2FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX150-2FG484I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX150-3FG484I 最大額定值與電氣特性
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 147,443 logic cells |
| Adaptive Logic Modules | 23,038 ALMs |
| User I/O | 338 I/O |
| Internal Frequency | 667 MHz |
| Performance Grade | -3 speed grade |
| Core Supply Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| Package Type | 484-ball CSBGA, surface mount |
| Package Dimensions | 19 mm × 19 mm |
| Ball Pitch | 0.80 mm |
| Total Package Balls | 484 balls |
| 工作溫度 | 0 °C to +85 °C |
| Lead-Free Status | Lead-free package |
| Product Family | Spartan-6 LX |
| Device Architecture | Configurable FPGA architecture with 147,443 logic cells |
XC6SLX150-3FG484I 484 balls 腳位配置指南
XC6SLX150-3FG484I（484 balls 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX150-3FG484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX150-3FG484I 適用於 6 應用s: Industrial Automation Controller, Communications Signal Aggregation, Test and Measurement Instrumentation, Parallel Sensor Acquisition, Embedded Video Processing, Aerospace and Defense Control Module.
Industrial Automation Controller
The XC6SLX150-3FG484I fits industrial controllers that combine parallel machine I/O, sequencing logic, communications gateways, and local data processing. Its 147,443 logic cells provide substantial room for control state machines and protocol engines, while 338 user I/O support encoders, discrete sensors, relay drivers, and operator interfaces. The -3 speed grade is useful when deterministic logic paths must close with timing margin, and the 0 to 85 °C specification supports industrial ambient conditions. Design the board around the AMD 484-ball pinout, validate every I/O voltage domain, and maintain an enclosure airflow and copper plan that keeps the FPGA within its operating-temperature limits.
推薦
Communications Signal Aggregation
The AMD XC6SLX150-3FG484I is appropriate for communications equipment that must consolidate multiple interfaces, perform protocol conversion, and buffer data between subsystems. The Spartan-6 LX architecture supplies 147,443 logic cells and 338 user I/O, allowing parallel Ethernet PHY control, backplane interfaces, status multiplexing, and test paths to coexist in one device. Its 667 MHz internal frequency supports demanding registered logic, while the -3 grade provides additional timing margin for critical paths. Engineers should use the manufacturer I/O characterization to establish voltage and timing margins for each high-speed bank, and should verify that the selected transceiver and connector strategy does not impose requirements beyond the device’s stated operating conditions.
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Test and Measurement Instrumentation
The XC6SLX150-3FG484I can serve as the digital control core in oscilloscopes, logic analyzers, protocol testers, and automated measurement systems. Its large logic-cell count supports acquisition pipelines, trigger logic, timing engines, and instrument-control interfaces, while 338 I/O provide flexible connections to probes, front panels, memory devices, and synchronization circuits. The -3 speed grade benefits high-throughput parallel datapaths and can improve timing closure for registered acquisition stages. For sensitive analog or high-impedance front ends, keep the FPGA away from high-energy switching nodes and provide local filtering. Pin assignments must also account for dedicated configuration, clock, and power balls in the 484-ball package.
推薦
Parallel Sensor Acquisition
The AMD XC6SLX150-3FG484I works well in multi-channel acquisition and conditioning systems where numerous sensor outputs must be sampled, filtered, timestamped, and transferred. The 338 user I/O provide ample parallel digital channels, while the 147,443 logic cells support channel control, calibration tables, digital filtering, and communication formatting. The 667 MHz internal frequency enables pipelined processing, and the industrial temperature rating suits equipment deployed in controlled industrial environments. Keep analog and digital return paths separated on the PCB, place interface protection close to connectors, and use the device’s I/O-standard rules to establish whether external level shifting or series termination is required.
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Embedded Video Processing
The XC6SLX150-3FG484I can implement parallel video timing, pixel formatting, overlay generation, and control functions in embedded display systems. Its 147,443 logic cells support substantial pipeline logic, while 338 I/O accommodate parallel or multiplexed display interfaces and associated control signals. The -3 speed grade is advantageous for timing-critical pixel pipelines, and the 484-ball package accommodates the substantial pin count of a complex digital subsystem. Design constraints must include the selected display interface’s voltage tolerance, clock jitter budget, and video timing requirements. Place the FPGA and its memory interfaces according to the manufacturer’s layout guidance so switching activity does not impair signal integrity.
推薦
Aerospace and Defense Control Module
The XC6SLX150-3FG484I may be evaluated for programmable control, data acquisition, and interface logic in aerospace and defense equipment, provided the design satisfies program-specific qualification, radiation, temperature, and procurement requirements. The device offers 147,443 logic cells, 338 user I/O, and a -3 performance grade for complex timing-sensitive digital logic. Its stated 0 to 85 °C operating range does not by itself establish suitability for every aerospace environment. Engineers must obtain the applicable AMD product documentation and program specifications, verify any extended-temperature or qualified ordering option, and complete reliability, fault-tolerance, and lifecycle assessments before using the device as a drop-in part in safety-critical equipment.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX150-3FG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX150-3FGG484I | XC6SLX150-3FG484C | XC6SLX150-3FGG484C | XC6SLX150-2FGG484I | XC6SLX150-2FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA | 484-ball CSBGA |
| Logic Cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells | 147,443 logic cells |
| User I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O |
| Performance Grade | -3 speed grade | -3 speed grade | -3 speed grade | -3 speed grade | -2 speed grade | -2 speed grade |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | Commercial temperature grade | Commercial temperature grade | 0 °C to +85 °C | 0 °C to +85 °C |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Package Body Size | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm | 19 mm × 19 mm |
主要差異化特點
- Highest Spartan-6 LX performance grade in the listed alternatives (對比XC6SLX150-2FGG484I)
- Industrial temperature coverage (對比XC6SLX150-3FG484C)
- Large configurable logic and interface capacity (對比XC6SLX150-3FGG484I)
設計說明
Treat the 484-ball CSBGA as a high-density routing problem. Import the exact AMD package pinout file before placement, preserve the 0.80 mm ball pitch, and use the package drawing to define courtyard, solder-mask, and paste-land geometry. Assign the 338 user I/O only after checking bank-level voltage and standard restrictions; configuration, clock, power, and ground balls are not interchangeable with user I/O.
Implement a layered power network for the 1.2 V core and all required auxiliary rails. Place local bulk and high-frequency decoupling at the associated package balls, keep the return path continuous beneath high-speed nets, and use the AMD Spartan-6 power-supply recommendations for regulators, sequencing, and current capacity. Validate voltage tolerances under combined processor and I/O activity because a static rail calculation alone does not establish acceptable transient behavior.
Route high-speed clocks and interfaces as controlled-impedance nets with continuous reference planes and deliberate escape routing from the BGA array. Minimize stubs, apply manufacturer-recommended termination, and keep clock distribution symmetric where practical. After PCB fabrication, use the design’s signal-integrity simulation results and measured clock quality to confirm that the -3 timing margin is not being reduced by loss, skew, crosstalk, or excessive loading.
Use a thermal plan appropriate for a 45 nm FPGA in a compact 19 × 19 mm package. Spread heat through PCB copper, maintain airflow across the board when required, and account for nearby regulators, memory, and interface devices. Validate the enclosure at the highest expected ambient temperature and operating workload. The 0 to 85 °C specification describes device operating conditions, not the junction-temperature margin or enclosure temperature automatically.
Do not confuse the 338 user I/O with the 484 physical package balls, and do not treat the FG and FGG package suffixes as typographical variants. Do not approve a lower-speed -2 substitute until the existing design has been re-synthesized and timing-closed. Similarly, do not replace the industrial-temperature I suffix with a commercial C suffix in equipment exposed to temperatures above the commercial grade’s operating limit.
合規資訊
The package is identified as lead-free. A separate distributor data source labels this ordering code as RoHS non-compliant, but no manufacturer compliance statement was available to confirm that status, so the structured RoHS field remains unknown.
