XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
부품 번호: XC6SLX45-2CSG484C ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1237.56 | $1,237.56 |
| 10 | $1195 | $11,950.00 |
| 100 | $1120 | $112,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $980 | $980,000.00 |
XC6SLX45-2CSG484C 개요
Background: An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect fabric, and embedded memory/DSP/IO resources that the user can program post-manufacturing. In the power-management hierarchy, an FPGA sits above microcontrollers and ASICs in flexibility, providing parallel hardware acceleration for digital signal processing, glue logic, and high-IO bridging. The Spartan-6 LX family targets cost-sensitive, high-volume applications such as consumer, automotive infotainment, and industrial automation, balancing density with low power and low unit cost.
Key features include built-in 45 nm CMOS process technology, integrated hard IP blocks (PCI Express, GTP transceivers on LXT variants, dedicated DSP48A1 slices), on-chip block RAM, and 45 nm process low-power sleep modes. The -2 speed grade offers balanced performance versus power, while the commercial temperature grade (0 to +85 C) suits indoor and controlled-environment designs.
Architecturally, the XC6SLX45 leverages the Spartan-6 LUT-based logic fabric combined with hard DSP slices, dedicated memory blocks, and high-performance SelectIO technology. The 320 user I/O support up to 18 single-ended standards or multiple differential pairs, enabling bridge and connectivity designs. The device is configured via JTAG, Slave Serial, SPI, or BPI flash interfaces, with bitstream encryption available for IP protection.
Typical applications include automotive infotainment, consumer video/display bridging, industrial motor control, communication infrastructure glue logic, and high-density DSP pre-processing. The wide IO count and ample block RAM make this device especially suitable for multi-protocol bridging and parallel data acquisition.
Designers should note that the 484-ball CSBGA package requires careful PCB layout with microvia technology for reliable assembly. The 1.2 V core supply must use low-noise LDO regulation with adequate bulk capacitance, and all IO banks may require independent reference voltages depending on the standards used.
This page synthesizes distributor pricing, drop-in Spartan-6 alternatives, application notes, and practical design considerations that are not found in the manufacturer datasheet alone.
드롭인 대체품: XC6SLX45-2CSG484C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX45-2CSG484C (동일 폼 팩터 및 풋프린트) — 차이점: Family, Mounting Type, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX45-3CSG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75T-2CSG484C
✅ 드롭인✓ 재고 있음
$59.5 / 개
데이터시트 보기 →XC6SLX45-2CSG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-1CSG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2CSG484CES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2CSG484C 최대 정격 & 전기적 특성
| Family | Spartan-6 LX |
| Device Logic Cells | 43,661 |
| CLBs / LABs | 3,411 |
| Slices | 6,822 |
| Block RAM (bits) | 2,138,112 (~261 Kib) |
| DSP48A1 Slices | 58 |
| User I/O Count | 320 |
| Process Technology | 45 nm CMOS, 9-metal copper low-k |
| Speed Grade | -2 |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Core Supply Voltage (VCCINT) | 1.2 V (range 1.14 V to 1.26 V) |
| Auxiliary Supply Voltage (VCCAUX) | 3.3 V |
| IO Supply Voltage (VCCO) | 1.2 V to 3.3 V (per bank) |
| 패키지 | 484-ball CSBGA (CSPBGA, 19 x 19 mm, 0.8 mm pitch) |
| Internal Frequency (max) | 500 MHz |
| 실장 유형 | Surface Mount (BGA, requires microvia PCB) |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS / Lead-free | Compliant / Pb-free (lead-free) |
| Configuration Modes | JTAG, Slave Serial, SPI, BPI |
| Transceivers | None (LX variant; LXT variant required for GTP) |
XC6SLX45-2CSG484C 핀 구성
| 핀 A1 | IO_L1N_0 — Bank 0, IO pair differential N (top-left corner; consult datasheet pinout for full detail) |
| 핀 A2 | IO_L1P_0 — Bank 0, IO pair differential P |
| 핀 B1 | IO_L2N_0 — Bank 0, IO pair differential N |
| 핀 D5 | VCCINT — 1.2 V core supply (1.14-1.26 V) |
| 핀 D6 | VCCAUX — 3.3 V auxiliary supply |
| 핀 G6 | CCLK — Configuration clock |
| 핀 H6 | DONE — Configuration DONE indicator |
| 핀 K6 | PROG_B — Active-low configuration reset |
| 핀 L6 | M0 — Configuration mode pin 0 |
| 핀 M6 | M1 — Configuration mode pin 1 |
| 핀 VCCO_0 | VCCO_0 — Bank 0 IO supply (multiple ball locations; refer to datasheet pinout table) |
| 핀 GND | GND — Ground (multiple ball locations across the BGA grid; refer to datasheet pinout table) |
일반적인 애플리케이션
XC6SLX45-2CSG484C 적합 용도: 6 애플리케이션s: Automotive Infotainment Bridging, Industrial Motor Control and PLC Backplanes, Video Processing and Display Aggregation, Communication Infrastructure Glue Logic, DSP Pre-Processing and Sensor Fusion, Medical Imaging and Instrumentation.
Automotive Infotainment Bridging
The XC6SLX45-2CSG484C fits automotive infotainment bridging with 320 user I/O supporting parallel RGB, LVDS, and PSI display interfaces, plus 58 DSP48A1 slices for audio/voice pre-processing. Its 43,661 logic cells and 2,138,112 bits of block RAM enable protocol translation between MIPI-CSI camera inputs and SoC video pipes while the 1.2 V core and 45 nm process keep power manageable for in-cabin designs. Designers must select the industrial-temperature variant for under-hood reliability.
추천
Industrial Motor Control and PLC Backplanes
The XC6SLX45-2CSG484C suits industrial motor control and PLC backplane designs with 320 SelectIO pins available for multi-axis encoder inputs (QEP/Hall), PWM outputs to gate drivers, and EtherCAT or PROFIBUS link buffering. The 58 DSP slices perform field-oriented control (FOC) math at microsecond rates while the 261 Kib block RAM stores commutation tables and PID loops. Its 1.2 V core plus 3.3 V auxiliary rails map cleanly to industrial 24 V buck/boost front-ends.
추천
Video Processing and Display Aggregation
The XC6SLX45-2CSG484C drives video aggregation pipelines where 320 user I/O accept multiple camera or display streams, the 58 DSP slices perform scaling and color-space conversion, and 2,138,112 bits of block RAM buffer line buffers for up to 1080p video. Spartan-6 LX supports the SelectIO DDR2 interface for connecting external DDR2-800 memory as a frame store. The CSG484 package exposes enough IO to drive dual-display heads-up units or video walls.
추천
Communication Infrastructure Glue Logic
The XC6SLX45-2CSG484C serves as flexible glue logic between network processors, PHY devices, and backplane SERDES in communication infrastructure with abundant SelectIO for GMII/RGMII bridging, I2C/SPI control planes, and timing distribution. The 58 DSP slices can perform packet classification or simple CRC/encryption, while the 320 user I/O handle parallel data fan-out. Choose the LXT variant (LX45T) for designs needing GTP transceivers.
추천
DSP Pre-Processing and Sensor Fusion
The XC6SLX45-2CSG484C performs pre-DSP sensor fusion where its 58 DSP48A1 slices deliver up to 58 GMACs of MAC-level throughput, parallel FIR filtering, FFT/IFFT kernels for radar or sonar, and machine-learning inference for low-power edge AI. The 2,138,112 bits of block RAM serve as coefficient store and ping-pong buffers, while the 320 user I/O accept multiple LVDS or JESD204 sensor links. Spartan-6 LX remains a cost-effective platform for cost-sensitive DSP applications.
추천
Medical Imaging and Instrumentation
The XC6SLX45-2CSG484C fits portable medical imaging and instrumentation where its 320 user I/O connect to high-resolution CMOS image sensors, 58 DSP slices implement real-time image enhancement, and 2,138,112 bits of block RAM buffer line-store memory for ultrasound or endoscopy pipelines. The 45 nm CMOS process and low-power Spartan-6 LX architecture reduce thermal load for battery-powered handheld designs. Pair the FPGA with low-noise ADCs and isolated power for patient-connected applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX45-2CSG484C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX45-3CSG484C | XC6SLX75T-2CSG484C | XC6SLX45-2CSG484I | XC6SLX45-1CSG484C | XC6SLX45-2CSG484CES |
|---|---|---|---|---|---|---|
| Package | 484-ball CSBGA (19x19 mm) | 484-ball CSBGA (19x19 mm) | 484-ball CSBGA (19x19 mm) | 484-ball CSBGA (19x19 mm) | 484-ball CSBGA (19x19 mm) | 484-ball CSBGA (19x19 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 43,661 | 43,661 (same LX45 die) | 74,261 (LX75) | 43,661 (same LX45 die) | 43,661 (same LX45 die) | 43,661 (same LX45 die) |
| Speed Grade | -2 | -3 (higher Fmax) | -2 (same) | -2 (same) | -1 (lower Fmax, lower power) | -2 (same) |
| User I/O | 320 | 320 (same) | 320 (same) | 320 (same) | 320 (same) | 320 (same) |
| Block RAM (bits) | 2,138,112 | 2,138,112 (same) | 3,261,696 (LX75 has more) | 2,138,112 (same) | 2,138,112 (same) | 2,138,112 (same) |
| DSP48A1 Slices | 58 | 58 (same) | 132 (LX75 has more) | 58 (same) | 58 (same) | 58 (same) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Engineering Sample |
| Transceivers (GTP) | None (LX variant) | None (LX) | 4 GTP (LXT) | None (LX) | None (LX) | None (LX) |
| Pin-Compatible Drop-in | Yes (reference part) | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Standard 484-ball CSBGA LX45 density with broadest variant ecosystem (vs XC6SLX45-3CSG484C)
- Lower logic density in same LX family slot (vs XC6SLX75T-2CSG484C)
- Commercial temperature rating versus industrial (vs XC6SLX45-2CSG484I)
설계 노트
The Spartan-6 LX core draws significant inrush during configuration. Use a low-noise LDO such as the TPS7A4701RGWR or TPS7A2450DBVR on VCCINT (1.2 V), and a separate 3.3 V regulator on VCCAUX. Place 100 uF bulk plus 0.1 uF / 10 uF ceramic decoupling within 2 cm of each supply pin group. Hold PROG_B low until VCCINT and VCCAUX stabilize to avoid configuration failure. Estimated: inrush current at configuration can momentarily exceed 1.5 A on VCCINT for LX45 density.
The 484-ball CSBGA package uses a 0.8 mm ball pitch and requires PCB microvia (laser-drilled) technology with 1-2-1 or 1-2 build-up. Per AMD Spartan-6 PCB guidelines, ball pads should be 0.40 mm NSMD, with 0.10 mm solder mask dam. Use at least 4 PCB layers with a continuous ground plane on layer 2 directly beneath the BGA to provide thermal dissipation and a low-impedance return path for high-speed SelectIO signals.
A common Spartan-6 design mistake is tying VCCO banks to incompatible voltages; each IO bank must be driven with a single VCCO value (1.2 V to 3.3 V) per bank. Mixing LVCMOS33 and LVCMOS18 in the same bank requires care. Also, do not leave unused GTP/GTX transceiver pins floating on LXT variants - follow AMD's 'unconnected GTP pin handling' guideline. Finally, ensure the mode pins (M0, M1, M2) are strapped correctly for the chosen boot interface (SPI flash boot is most common).
규정 준수 정보
RoHS compliant per AMD product page; Pb-free lead-free CSG package. Not AEC-Q100 qualified (LX commercial variant) - select XC6SLX45-2CSG484I for industrial applications. Halogen-free status not explicitly stated in verified data.
