XC7A75T - Artix-7 FPGA 75K Logic Cells | AMD
MPN: XC7A75T β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
Drop-in alternatives for XC7A75T β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7A100T
β Drop-Inβ In Stock
$25.3 / Unit
View Datasheet βXC7A50T
β Drop-Inπ Reference alternative (not in catalog)
XC7A75T-2FGG484I
β Drop-Inβ In Stock
$74.87 / Unit
View Datasheet βXC7A75T-1FTG256C
β Drop-Inπ Reference alternative (not in catalog)
XC7A75T-1FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC7A75T Maximum Ratings & Electrical Characteristics
| Logic Cells | 75,520 |
| Block RAM | 1,800 Kb |
| DSP Slices | 90 |
| CMTs | 5 |
| GTP Transceivers | 6 |
| Max GTP Line Rate | 6.6 Gb/s |
| User I/O (FGG484) | 285 |
| User I/O (FTG256) | 170 |
| Package Options | FGG484, FTG256, CSG324 |
| Process Technology | 28nm |
| Operating Temperature | 0C to +85C (C grade), -40C to +100C (I grade) |
| Core Voltage | 1.0V |
| Configuration Interfaces | JTAG, SPI, BPI |
| RoHS Status | Compliant |
| Speed Grades | -1, -2, -3 |
XC7A75T Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O pin, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O pin, differential pair N |
| Pin B1 | IO_L2P_T0 β User I/O pin, differential pair P |
| Pin B2 | IO_L2N_T0 β User I/O pin, differential pair N |
| Pin C1 | IO_L3P_T0 β User I/O pin, differential pair P |
| Pin C2 | IO_L3N_T0 β User I/O pin, differential pair N |
| Pin D1 | IO_L4P_T0 β User I/O pin, differential pair P |
| Pin D2 | IO_L4N_T0 β User I/O pin, differential pair N |
| Pin E1 | IO_L5P_T0 β User I/O pin, differential pair P |
| Pin E2 | IO_L5N_T0 β User I/O pin, differential pair N |
| Pin F1 | IO_L6P_T0 β User I/O pin, differential pair P |
| Pin F2 | IO_L6N_T0 β User I/O pin, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A75T is suitable for 6 applications: Software-Defined Radio, Motor Control, Medical Imaging, Industrial Networking, Aerospace and Defense, Test and Measurement.
Software-Defined Radio
The XC7A75T is ideal for software-defined radio (SDR) due to its 6 GTP transceivers supporting up to 6.6 Gb/s, which can interface with high-speed ADCs and DACs. Its 75,520 logic cells provide ample resources for digital down/up conversion, filtering, and modulation. The low power consumption of the 28nm process is critical for portable and battery-operated SDR platforms. The device's DSP slices enable efficient implementation of FIR filters and FFTs, essential for signal processing. With support for PCIe, the XC7A75T can easily connect to host processors for control and data transfer.
Recommended
Motor Control
The XC7A75T is well-suited for motor control applications, offering 90 DSP slices for implementing complex control algorithms like field-oriented control (FOC) and space vector modulation. Its 5 CMTs provide flexible clocking for PWM generation and encoder feedback. The device's low power and cost make it attractive for industrial drives and robotics. With up to 285 user I/Os, it can interface with multiple sensors and gate drivers. The GTP transceivers enable high-speed communication with higher-level controllers or networks, such as EtherCAT or PROFINET, for synchronized multi-axis control.
Recommended
Medical Imaging
In medical imaging systems like ultrasound and MRI, the XC7A75T provides the logic density and DSP capabilities needed for real-time image processing. Its 75,520 logic cells can implement beamforming, filtering, and image enhancement algorithms. The 6 GTP transceivers support high-speed data acquisition from sensors and interfaces to host computers. The device's low power consumption is beneficial for portable and battery-powered medical devices. The XADC block allows on-chip temperature and voltage monitoring, ensuring reliable operation in critical medical environments. The Artix-7 family's cost-effectiveness makes it suitable for high-volume medical equipment.
Recommended
Industrial Networking
The XC7A75T is an excellent choice for industrial networking equipment such as Ethernet switches, gateways, and protocol converters. Its 6 GTP transceivers support Gigabit Ethernet and other high-speed serial protocols, enabling robust data communication. The device's logic cells can implement switching fabrics, packet processing, and protocol stacks. The low power and cost of the Artix-7 family are ideal for distributed industrial nodes. With support for various I/O standards, it can interface with legacy fieldbuses and modern industrial Ethernet. The XC7A75T's reliability and long-term availability make it suitable for industrial applications with extended lifecycles.
Recommended
Aerospace and Defense
The XC7A75T is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. Its 75,520 logic cells and DSP slices enable complex signal processing and beamforming. The device supports bitstream encryption for IP protection, a critical feature for defense systems. The GTP transceivers allow high-speed data links between subsystems. The industrial temperature grade (-40C to +100C) ensures operation in harsh environments. The Artix-7 family's low power is advantageous for airborne and space-borne systems where power is limited. AMD's long-term supply commitment supports defense program lifecycles.
Recommended
Test and Measurement
The XC7A75T is well-suited for test and measurement equipment like oscilloscopes, logic analyzers, and signal generators. Its high-speed GTP transceivers can interface with high-speed ADCs and DACs for signal acquisition and generation. The logic cells and DSP slices enable real-time triggering, decimation, and waveform processing. The device's low power and small footprint are beneficial for portable instruments. The XADC block provides on-chip monitoring for calibration and diagnostics. With support for PCIe, the XC7A75T can easily connect to a host PC for data analysis and control. The Artix-7 family's cost-effectiveness makes it ideal for cost-sensitive test equipment.
Recommended
Recommended Products Summary
Engineering reference data for XC7A75T β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A100T | XC7A50T | 5CEFA7F27I7 |
|---|---|---|---|---|
| Logic Cells | 75,520 | 101,440 | 52,160 | 149,500 |
| Block RAM | 1,800 Kb | 2,700 Kb | 900 Kb | 6,912 Kb |
| DSP Slices | 90 | 240 | 120 | 224 |
| GTP Transceivers | 6 | 16 | 4 | 6 |
| Max Transceiver Speed | 6.6 Gb/s | 6.6 Gb/s | 6.6 Gb/s | 3.125 Gb/s |
| Package | FGG484, FTG256, CSG324 | FGG484, FTG256, CSG324 | FGG484, FTG256, CSG324 | FBGA-672 |
| Brand | AMD | AMD | AMD | Intel |
| Process Technology | 28nm | 28nm | 28nm | 28nm |
Key Differentiators
- Higher logic density than XC7A50T (vs XC7A50T)
- Lower cost and power than XC7A100T (vs XC7A100T)
- More transceivers than XC7A50T (vs XC7A50T)
Design Notes
The XC7A75T requires a 1.0V core supply and 1.8V/2.5V/3.3V auxiliary supplies. Use low-dropout regulators (LDOs) or switching regulators with low ripple. Place 100nF decoupling capacitors close to each power pin and a 10uF bulk capacitor per supply rail. Follow the power supply decoupling guidelines in UG475 to minimize noise and ensure reliable operation.
For high-speed GTP transceivers, route differential pairs with controlled impedance (100 ohm differential) and minimize vias. Keep traces short and use ground planes for return paths. Follow the layout guidelines in UG476 for transceiver routing. For general I/O, use series termination resistors to reduce reflections.
The XC7A75T's power dissipation depends on utilization and clock frequency. For high-utilization designs, use a heatsink or forced airflow. The thermal resistance (theta_JA) for the FGG484 package is approximately 10-15 C/W. Ensure the junction temperature stays below 125C for commercial grade and 100C for industrial grade.
Compliance Information
RoHS compliant per AMD product page. AEC-Q100 not applicable for FPGA. Other compliance data not provided.