XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
부품 번호: XC6SLX75-2FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX75-2FG484I 개요
A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device.
The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design.
The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation.
Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools.
A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification.
This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.
드롭인 대체품: XC6SLX75-2FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX75-2FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX75-2FGG484I
✅ 드롭인✓ 재고 있음
$82.1 / 개
데이터시트 보기 →XQ6SLX75-2FG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75T-3FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-2FG484I 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Manufacturer | AMD / Xilinx |
| Logic Elements | 74,637 LE |
| Logic Blocks | 5,831 |
| Internal Frequency | 667 MHz |
| I/O Count | 280 I/O |
| Package Type | FCBGA-484 / 484-BBGA |
| Number of Terminals | 484 balls |
| Package Dimensions | 23 mm x 23 mm |
| Ball Pitch | 1 mm |
| Package Outline | MS-034 |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| 동작 온도 | 0°C to +85°C (32°F to 185°F) |
| Terminal Form | Ball |
| Package Shape | Square |
XC6SLX75-2FG484I square 핀 구성 가이드
XC6SLX75-2FG484I(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX75-2FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX75-2FG484I 적합 용도: 6 애플리케이션s: Industrial Data Acquisition, Communications Gateway, Machine Vision Processing, Motion and Control System, Test and Measurement Instrument, Embedded Communications Equipment.
Industrial Data Acquisition
The XC6SLX75-2FG484I fits parallel data-acquisition systems that combine many sensor channels, conditioning logic, buffers, and a processor interface. Its verified 74,637 logic elements and 5,831 logic blocks provide substantial parallel capacity, while up to 280 I/O helps connect converters, digital sensors, and control signals. The 0°C to +85°C industrial range suits controlled factory equipment. At 667 MHz, the device can host time-interleaved processing, although achievable throughput depends on routing and timing closure. Designers must reserve configuration pins, clock inputs, memory interfaces, and power balls before assigning acquisition channels.
추천
Communications Gateway
The XC6SLX75-2FG484I is suitable for protocol-conversion and communications gateways requiring parallel packet processing, buffering, and numerous external interfaces. The verified 280 I/O and large logic-element count allow Ethernet or serial channels to be separated into independently timed data paths. The -2 speed grade supports demanding fixed-function logic, while 667 MHz is the documented internal-frequency figure rather than a guaranteed interface rate. Design work should constrain all receive and transmit paths, account for I/O-standard differences, and verify whether the selected XC6SLX75 resources satisfy required clocks, memory, and high-speed transceivers.
추천
Machine Vision Processing
The XC6SLX75-2FG484I can implement parallel pixel pipelines, thresholding, feature extraction, and interface timing for industrial machine-vision subsystems. Its 5,831 logic blocks provide room for fixed pipelines that operate concurrently rather than processing only one operation at a time. The 484-ball package exposes a large connection count for image sensors, memory, camera-control signals, and test points. Timing must be constrained across sensor, memory, and processor domains, while PCB routing must preserve high-speed return paths. The verified 667 MHz frequency requires post-route timing review for each implemented image-processing path.
추천
Motion and Control System
The XC6SLX75-2FG484I is appropriate for industrial motion-control logic that coordinates encoders, timers, interpolation, sequencing, and safety-related monitoring. The verified -2 speed grade, 667 MHz internal frequency, and 74,637 logic elements support parallel control pipelines and deterministic hardware functions. Up to 280 I/O simplifies connections to sensors, drives, and supervisory logic, while the industrial temperature range covers equipment environments. Engineers should separate timing-critical paths, constrain them explicitly, and validate jitter and latency after placement and routing. Motor-drive power electronics remain external to the FPGA and require suitable isolation and protection.
추천
Test and Measurement Instrument
The XC6SLX75-2FG484I can serve as the programmable control and pattern engine in a test-and-measurement instrument. Its large logic count supports sequencers, timing generators, digital pattern banks, and host-facing state machines, while 280 I/O provide broad control connectivity. The -2 speed grade and 667 MHz internal-frequency figure are useful for parallel digital operations, but analog accuracy is determined outside the FPGA. Board designers should use short, controlled clock routes and provide clean supplies, termination, and isolation. The 484-BBGA package also requires an assembly process capable of inspecting dense, hidden solder joints.
추천
Embedded Communications Equipment
The XC6SLX75-2FG484I fits embedded communications equipment needing flexible packet handling, parallel bus control, and programmable interface timing. The verified 74,637 logic elements allow protocol converters, framing logic, checksums, and control state machines to coexist in hardware. Its 484-ball package provides numerous I/O options, although fixed configuration, clock, and power balls reduce user assignments. The industrial temperature range supports controlled network appliances and industrial links. Design teams should validate required block RAM, DSP, transceiver, and memory resources against the full Spartan-6 LX documentation before commit, and should compare -2 timing and power with any proposed -3 alternative.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX75-2FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX75-2FGG484I | XQ6SLX75-2FG484I | XC6SLX75T-3FGG484I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 484-BBGA / FCBGA-484 | 484-BBGA | FCBGA-484 | FCBGA-484 |
| Speed Grade | -2 | -2 | -2 | -3 |
주요 차별점
- Closest verified family and speed-grade candidate (vs XC6SLX75-2FGG484I)
- Direct -2 speed-grade alternative with qualification review required (vs XQ6SLX75-2FG484I)
- Target -2 bin avoids unrequested -3 timing and power behavior (vs XC6SLX75T-3FGG484I)
설계 노트
Treat the 484-BBGA footprint as a controlled-library component rather than drawing it from package-name dimensions alone. Use the official AMD package drawing for ball locations, solder-mask and paste features, assembly allowances, and X-ray inspection criteria. The verified body dimensions are 23 mm by 23 mm with 1 mm pitch, but body size does not independently establish a manufacturable land pattern.
Constrain each clock domain separately and review post-route timing for the actual design; the verified 667 MHz internal-frequency value is not a blanket guarantee for every logic path. Preserve continuous return planes under high-speed routes, minimize stubs, control skew, and apply source-synchronous timing constraints according to the implemented external interface. Validate every I/O standard against the selected package and bank constraints.
Confirm all required core, I/O, auxiliary, and configuration voltage rails from the complete Spartan-6 LX data sheet before schematic release. Place approved decoupling and bulk capacitance close to the device, route power and ground planes with low-impedance connectivity, and isolate noisy external circuits. The supplied excerpts do not provide supply voltages or current limits, so rails and regulator selection cannot be finalized from this page alone.
규정 준수 정보
The supplied excerpts do not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance must be verified from the current AMD product documentation and the exact ordering code.
