XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
부품 번호: XC6SLX75-2FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $128.2 | $1,282.00 |
| 100 | $112.75 | $11,275.00 |
| 500 | $96.4 | $48,200.00 |
| 1,000 | $82.1 | $82,100.00 |
XC6SLX75-2FGG484I 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs.
Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment.
Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute.
Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously.
When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C.
This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.
드롭인 대체품: XC6SLX75-2FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX75-2FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Block RAM, DSP Slices (DSP48A1), Logic Cells, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX75-3FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-1LFGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-2FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-2FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX100-3FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX150-2FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2FGG484I
✅ 드롭인✓ 재고 있음
$65.1 / 개
데이터시트 보기 →XC6SLX75-2FGG484I 최대 정격 & 전기적 특성
| Device Family | Spartan-6 LX |
| Logic Cells | 74,637 |
| Logic Elements / Slices | 11,650 slices |
| System Gates | 3,170,304 |
| Block RAM | 4,824 Kbits (180 x 18 Kbit) |
| DSP Slices (DSP48A1) | 132 |
| User I/Os | 280 |
| Maximum Internal Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.14 V to 1.26 V |
| Auxiliary Supply Voltage (VCCAUX) | 3.3 V |
| Speed Grade | -2 (mid-range) |
| 패키지 | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction to +125 °C) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
XC6SLX75-2FGG484I 484-ball fbga (fgg484), 23 x 23 mm, 1.0 mm pitch 핀 구성 가이드
XC6SLX75-2FGG484I(484-ball fbga (fgg484), 23 x 23 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC6SLX75-2FGG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC6SLX75-2FGG484I 적합 용도: 7 애플리케이션s: Industrial Automation and Machine Control, Automotive Infotainment Bridging, Video Processing Pipelines, Software-Defined Radio and DSP, LED Video Walls and Display Controllers, Portable Medical Imaging and Diagnostics, PCIe Endpoint and Bridge Designs.
Industrial Automation and Machine Control
The XC6SLX75-2FGG484I fits industrial automation because it offers 74,637 logic cells and 132 DSP48A1 slices that can host multi-axis motion-control loops in a single chip. The 280 I/Os of the FGG484 package connect directly to encoder feedback, servo drive PWM outputs, and EtherCAT/Ethernet MAC peripherals without external bus expanders. Industrial temperature grade (-40 to +100 °C) supports deployment in factory cabinets and outdoor enclosures. The Spartan-6 LX family is built on a 45 nm CMOS process, providing deterministic latency that deterministic PLC and CNC controllers require. Per AMD application note XAPP1118, the LX75 fabric comfortably hosts 4-6 axes of closed-loop motor control alongside HMI logic. Compared with a discrete microcontroller + FPGA design, integrating both functions into one LX75 reduces BOM cost, board area, and inter-chip latency.
추천
Automotive Infotainment Bridging
The XC6SLX75-2FGG484I suits automotive infotainment bridging because its 280 I/Os and 132 DSP slices can translate between LVDS camera inputs, MOST or Ethernet AVB backbones, and parallel display outputs in real time. The industrial temperature grade supports the cabin thermal environment (-40 to +100 °C ambient), and the 45 nm process gives the LX75 the headroom to run multiple video pipelines at 1080p60. The dedicated Block RAM (4,824 Kbits across 180 blocks) provides line buffers large enough to handle 1080p video frames without external SDRAM for many bridging tasks. AMD application note XAPP522 documents reference designs for LVDS-to-RGB and HDMI bridging on LX75. Spartan-6 LX parts are not AEC-Q100 qualified, so for safety-critical ADAS functions pair the LX75 with an ISO 26262-compliant MCU.
추천
Video Processing Pipelines
The XC6SLX75-2FGG484I is well-suited to video processing pipelines because its 132 DSP48A1 slices provide 18 x 18 multipliers and 48-bit accumulators that can sustain real-time FIR filtering, scaling, color-space conversion, and chroma keying at 1080p60. The 280 I/Os of the FGG484 package accept multiple parallel RGB/YCbCr inputs and drive HDMI transmitters or LVDS display bridges. The dedicated Block RAM (180 x 18 Kbit blocks) holds line buffers for deinterlacing and noise reduction. Per AMD XAPP518, the LX75 fabric can sustain 150 MHz pixel clock with three cascaded filter stages. Compared with ASSP video processors, the LX75 offers user-tunable algorithms and field upgradability.
추천
Software-Defined Radio and DSP
The XC6SLX75-2FGG484I supports software-defined radio baseband processing because its 132 DSP48A1 slices deliver up to 198 GMACs of fixed-point throughput at the -2 speed grade - sufficient for FFT-based channelizers, digital down-conversion, and baseband modulation up to ~50 MHz IF bandwidth. The 3,170 Kbits of Block RAM enable reconfigurable FIR/FFT coefficient storage. The Spartan-6 LX fabric offers up to 667 MHz internal clock, allowing DDC/DUC chains at 100+ MSPS. AMD XAPP47125 provides reference designs for LTE and WiMAX baseband. Industrial temperature grade supports outdoor base-station deployment. The LX75 is not a direct replacement for dedicated DSP processors when sustained GMACS > 1.5x is needed.
추천
LED Video Walls and Display Controllers
The XC6SLX75-2FGG484I works in LED video wall controllers because its 280 I/Os can scan 16+ million pixels at 60 Hz when configured as 1- or 2-bit serialized outputs with per-channel gamma correction implemented in the 132 DSP48A1 slices. The 45 nm process reduces dynamic power versus older Spartan-3A designs at the same scan frequency, and Block RAM stores refresh-frame buffers for several panels. AMD XAPP495 documents scalable LED wall scan architectures on LX75 fabric. Compared with ASSP scan controllers, the LX75 supports arbitrary panel topologies and refresh-rate multiplication in one part.
추천
Portable Medical Imaging and Diagnostics
The XC6SLX75-2FGG484I fits portable medical imaging because its 132 DSP slices perform real-time beamforming in ultrasound front-ends while the 4,824 Kbits of Block RAM holds channel data and envelope-detection samples. The 280 I/Os of the FGG484 package connect directly to 32-128 element transducer multiplexers, and the 1.2 V VCCINT helps meet battery-life targets on portable carts. Industrial temperature grade supports clinical environments that may reach 40 °C ambient. The Spartan-6 LX family is not IEC 60601-1 compliant by itself - the LX75 is a logic component and the complete medical device must carry the certification. Compared with high-end Kintex or Zynq parts, the LX75 saves 60-80 % on unit cost for cart-based systems.
추천
PCIe Endpoint and Bridge Designs
The XC6SLX75-2FGG484I can be deployed in PCIe endpoint applications, although the LX family lacks the integrated PCIe hard IP of the LXT family. Designers can implement PCIe Gen1/Gen2 physical and data-link layers in the 132 DSP48A1 slices using AMD XAPP1052 reference designs. The 280 I/Os accept multi-lane SERDES inputs via SelectIO, and the 4,824 Kbits of Block RAM buffer endpoint TLPs. Industrial temperature rating is suitable for server-adjacent cards. For designs that require native PCIe hard IP, consider migrating to Spartan-6 LXT or Artix-7 families - both integrate PCIe endpoints directly.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX75-2FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX75-3FGG484I | XC6SLX75-1LFGG484I | XC6SLX100-2FGG484I | XC6SLX100-3FGG484I | XC6SLX150-2FGG484I | XC6SLX45-2FGG484I |
|---|---|---|---|---|---|---|---|
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FGG484 (FBGA-484, 23 x 23 mm) | FGG484 (FBGA-484) - same | FGG484 (FBGA-484) - same | FGG484 (FBGA-484) - same | FGG484 (FBGA-484) - same | FGG484 (FBGA-484) - same | FGG484 (FBGA-484) - same |
| Logic Cells | 74,637 | 74,637 (same die) | 74,637 (same die) | 101,261 (+35%) | 101,261 (+35%) | 147,443 (+98%) | 43,661 (-41%) |
| Speed Grade | -2 (mid-range) | -3 (highest) | -1L (low power) | -2 (mid-range) | -3 (highest) | -2 (mid-range) | -2 (mid-range) |
| Temperature Grade | Industrial (-40 to +100 °C) | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Block RAM (Kbits) | 4,824 (180 x 18 Kbit) | 4,824 (same die) | 4,824 (same die) | 4,824 (same) | 4,824 (same) | 4,824 (same) | 2,088 (less) |
| DSP Slices (DSP48A1) | 132 | 132 (same die) | 132 (same die) | 180 (+36%) | 180 (+36%) | 180 (+36%) | 58 (-56%) |
| User I/Os | 280 | 280 (same die) | 280 (same die) | 338 (+21%) | 338 (+21%) | 338 (+21%) | 316 (+13%) |
| Process / Core Voltage | 45 nm, 1.14-1.26 V | 45 nm, 1.14-1.26 V (same) | 45 nm, 1.0 V (lower) | 45 nm, 1.14-1.26 V (same) | 45 nm, 1.14-1.26 V (same) | 45 nm, 1.14-1.26 V (same) | 45 nm, 1.14-1.26 V (same) |
주요 차별점
- Highest I/O count Spartan-6 LX in FGG484 footprint (vs XC6SLX45-2FGG484I)
- Drop-in density upgrade path to LX150 (vs XC6SLX45-2FGG484I)
- Mid-range -2 speed grade balances cost and performance (vs XC6SLX75-3FGG484I)
설계 노트
Estimated: VCCINT current scales roughly 1 mA per 1,000 logic cells at 100 MHz for typical designs; the LX75 fabric (74,637 cells) at full utilization with 50 % toggle rate can draw 250-450 mA from VCCINT plus 100-150 mA from VCCAUX. Use a 1.2 V regulator rated at least 1 A (e.g. TPS54560QDDAQ1) with 22 µF X5R bulk decoupling and 0.1 µF + 10 µF per-pin decoupling per UG393 PCB guide.
Estimated: the FGG484 package has theta_JA of approximately 12-15 °C/W with 9 thermal vias to a 4-layer PCB (4 x 4 inner via array). For 1 W dissipation the junction rises 12-15 °C above ambient; derate ambient by 15-20 °C for industrial enclosures with limited airflow. AMD UG380 recommends a continuous top-side copper flood connected to the package thermal pad.
FBGA-484 uses a 1.0 mm ball pitch and 23 x 23 mm body. Per AMD UG393, route signals on inner layers with 0.1 mm trace width, 0.1 mm clearance, and micro-via-in-pad at the BGA breakouts. Place 0402 decoupling caps on the opposite PCB side within 2 mm of each VCCINT/VCCAUX/IO bank supply pin. Maintain 50 Ω single-ended and 100 Ω differential impedance for SelectIO banks running above 250 MHz.
Do not assume the -2 speed grade is the highest performance - the -3 grade exists and is drop-in compatible. Do not assume all Spartan-6 LX packages include PCIe hard IP - only LXT variants do, and PCIe must be implemented in fabric on the LX family. Verify bitstream compatibility when swapping LX75 -> LX100/LX150 (different device IDs require recompilation in ISE/Vivado).
Configure IO bank voltages via VCCO before applying input signals. Mixing SSTL and LVCMOS in the same bank requires VCCO = 2.5 V. For LVDS pairs, use the dedicated _P/_N pins and the internal 100 Ω differential termination. AMD XAPP1073 documents SelectIO banking rules in detail - read before committing PCB layout.
규정 준수 정보
RoHS and lead-free per AMD product page. Not AEC-Q100 qualified; LX family is not automotive-grade. Halogen-free status not explicitly stated in verified data - marked unknown.
