XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
부품 번호: XC6SLX45-3FGG484C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19.29 | $19.29 |
| 10 | $17.8 | $178.00 |
| 100 | $15.95 | $1,595.00 |
| 500 | $13.75 | $6,875.00 |
| 1,000 | $12.1 | $12,100.00 |
XC6SLX45-3FGG484C 개요
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets.
The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources.
Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs.
When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations.
Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: XC6SLX45-3FGG484C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX45-3FGG484C (동일 폼 팩터 및 풋프린트) — 차이점: Block RAM, Package, Speed Grade, Logic Cells, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC6SLX45-4FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2FGG484C
✅ 드롭인✓ 재고 있음
$118.75 / 개
데이터시트 보기 →XC6SLX45-3FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-N3FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX75-3FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC6SLX45-2FGG484I
✅ 드롭인✓ 재고 있음
$65.1 / 개
데이터시트 보기 →XC6SLX45-3FGG484C 최대 정격 & 전기적 특성
| Series | Spartan-6 LX |
| Logic Cells | 43,661 |
| System Gates | 2,138,112 |
| CLBs | 3,411 |
| User I/Os | 316 |
| Block RAM | 2,011 Kbits (2,088 Kb) |
| DSP48A1 Slices | 58 |
| Speed Grade | -3 |
| Operating Frequency | 862 MHz |
| Process Technology | 45 nm CMOS |
| 패키지 | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch |
| 동작 온도 | 0 C to +85 C (commercial, "C" suffix) |
| Supply Voltage VCCINT | 1.0 V to 1.05 V |
| Supply Voltage VCCO | 1.2 V to 3.3 V |
| Memory Controller Blocks | 2 (DDR/DDR2/DDR3/LPDDR) |
| 실장 유형 | Surface Mount |
| Lead Free / RoHS | Yes (LEAD FREE per distributor descriptions) |
XC6SLX45-3FGG484C 핀 구성
| 핀 A1 | GND — Ground reference |
| 핀 B1 | IO_L1N_A3_D16 — Bank 1 I/O, differential pair negative |
| 핀 C1 | IO_L1P_A3_D17 — Bank 1 I/O, differential pair positive |
| 핀 D1 | VCCO_0 — Bank 0 I/O supply voltage |
| 핀 E1 | IO_L2N — Bank 0 I/O |
| 핀 F1 | IO_L2P — Bank 0 I/O |
| 핀 G1 | GND — Ground reference |
| 핀 H1 | IO_L3N — Bank 0 I/O |
| 핀 J1 | IO_L3P — Bank 0 I/O |
| 핀 K1 | VCCO_0 — Bank 0 I/O supply voltage |
| 핀 L1 | IO_L4N — Bank 0 I/O |
| 핀 M1 | IO_L4P — Bank 0 I/O |
| 핀 N1 | GND — Ground reference |
| 핀 P1 | IO_L5N — Bank 0 I/O |
| 핀 R1 | IO_L5P — Bank 0 I/O |
| 핀 T1 | VCCO_0 — Bank 0 I/O supply voltage |
| 핀 U1 | IO_L6N — Bank 0 I/O |
| 핀 V1 | IO_L6P — Bank 0 I/O |
| 핀 W1 | GND — Ground reference |
| 핀 Y1 | CCLK_0 — Configuration clock |
일반적인 애플리케이션
XC6SLX45-3FGG484C 적합 용도: 7 애플리케이션s: Industrial Motor Control and Drive, Video Processing and Display Bridging, Communications Backplane Bridging, Automotive Driver-Assistance Prototyping, Consumer Electronics Glue Logic Replacement, ASIC Emulation and Prototyping, Test and Measurement Front-End.
Industrial Motor Control and Drive
The XC6SLX45-3FGG484C fits motor-drive applications because its 58 DSP48A1 slices provide hardware-accelerated Park/Clark transforms and PI loops in real time, while its 316 user I/Os handle resolver feedback, encoder inputs, Hall sensors, gate-driver PWM outputs, and CAN/UART links without external glue logic. The integrated dual memory controller blocks (MCB) interface to DDR2/DDR3 sample buffers used in vibration analytics, and SelectIO banks accept 1.2 V to 3.3 V signals from a mix of 3.3 V gate drivers and 1.8 V feedback sensors. Compared with a discrete DSP+MCU, an LX45 consolidates control law, commutation, current sampling, and protective sequences on a single die that can be reconfigured via JTAG for different motor types.
추천
Video Processing and Display Bridging
The XC6SLX45 suits mid-resolution video pipelines (1080p60) because its 2,011 Kbits of block RAM hold multiple line buffers, the 58 DSP slices run color-space conversion and scaling arithmetic in parallel, and the SelectIO banks support LVDS-25, TMDS, and DisplayPort source-sink interfaces through soft IP. Designers route DVI/HDMI from a graphics SoC through the LX45 to perform format conversion, chroma upsampling, or simple overlay insertion. The 316 user I/Os leave enough margin for parallel camera interfaces, BT.656 streams, and side-band control signals (I2C, GPIO). Spartan-6 video reference designs from AMD shorten integration risk for production display-bridging products.
추천
Communications Backplane Bridging
Bridge between UART, SPI, I2C, PCIe, and parallel LVDS buses using the LX45 fabric to implement custom protocol converters in compact PCB footprints. The 43,661 logic cells and 2.1 M system gates handle multi-channel bridges with 4x PCIe Gen 1 hard IP endpoints (Spartan-6 LXT subfamily), while the integrated MCB interfaces to DDR3 line-card packet memory. SelectIO supports LVDS-25 pair rates up to 1.0 Gbps for backplane serialization. Compared to ASSP bridge ICs, the LX45 supports late protocol changes and field upgrades via in-system reconfiguration, making it attractive for telecom line cards that must adapt to evolving backplane standards.
추천
Automotive Driver-Assistance Prototyping
Build pre-silicon prototype of ADAS sensor-fusion SoCs in the XC6SLX45-3FGG484C. The 58 DSP slices implement FFT, matrix multiplication, and noise-reduction kernels for radar/lidar signal chains, and the 316 I/Os aggregate cameras, radar sensors, and CAN-FD vehicle buses. Designers map ASIC-style architectures to LX45 fabric with near-final I/O timing to validate algorithms before committing to silicon. For production deployment in cabin environments where temperatures stay within 0 C to +85 C, the commercial-grade LX45 suffices; the XC6SLX45-3FGG484I variant handles under-hood and exterior modules where temperatures swing from -40 to +100 C.
추천
Consumer Electronics Glue Logic Replacement
Replace multiple discrete CPLDs, level shifters, and bus-arbitration ICs with a single XC6SLX45-3FGG484C to shrink PCB area and BOM cost in consumer products like set-top boxes, smart appliances, and home gateways. The 3,411 CLBs compress hundreds of glue-logic functions into a single 23 x 23 mm BGA. Spartan-6 I/O flexibility accepts 1.2 V to 3.3 V mixed-voltage buses without external translators, while the 45 nm low-static-power process keeps idle consumption low for ENERGY STAR compliance. End-of-product-line firmware updates are trivial via the SPI configuration interface.
추천
ASIC Emulation and Prototyping
Use the XC6SLX45-3FGG484C as a building block in multi-FPGA ASIC prototyping platforms, partitioning larger SoC designs across multiple Spartan-6 devices wired together on a TDM interconnect. The 862 MHz Fmax on -3 speed grade handles mid-complexity IP cores, while the FGG484 footprint fits standard prototyping daughter-card patterns. Engineers compress chip-level designs across 4-8 LX45 devices to validate RTL before tape-out, reducing ASIC re-spin costs. Combined with AMD's ChipScope debug cores and trace tools, the LX45 provides real-time visibility into ASIC-equivalent signal behavior.
추천
Test and Measurement Front-End
The XC6SLX45-3FGG484C sits between analog front-end ICs and downstream processors in production testers, applying custom DSP filters to ADC samples, generating stimulus waveforms, and managing timing-critical handshake sequences. The 58 DSP48A1 slices run FIR filters and Goertzel detectors in parallel across multiple channels, and the 316 I/Os parallelize to multiple 16-bit ADC buses. SelectIO supports LVDS-25 sampling at 1 Gsps effective rate when paired with external ADCs. The Spartan-6 LX family's long-life-cycle industrial supply chain makes it a reliable choice for testers that must be maintained for 10+ years.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC6SLX45-3FGG484C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC6SLX45-4FGG484C | XC6SLX45-2FGG484C | XC6SLX45-3FGG484I | XC6SLX75-3FGG484C |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 23x23 mm, 1.0 mm pitch | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | AMD (formerly Xilinx) | AMD | AMD | AMD | AMD |
| Logic Cells | 43,661 | 43,661 | 43,661 | 43,661 | 74,637 |
| Speed Grade | -3 | -4 (faster) | -2 (slower) | -3 | -3 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| User I/Os | 316 | 316 | 316 | 316 | 316 |
| Block RAM | 2,011 Kbits | 2,011 Kbits | 2,011 Kbits | 2,011 Kbits | 3,096 Kbits |
| DSP48A1 Slices | 58 | 58 | 58 | 58 | 132 |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
주요 차별점
- Mid-density Spartan-6 LX position with optimal price/logic-cell ratio (vs XC6SLX25-3FTG256C)
- Integrated memory controller blocks for DDR2/DDR3 (vs XC6SLX16-3CPG196C)
- Drop-in upgrade path to higher density LX75 (vs XC6SLX45-3CSG324C)
설계 노트
The XC6SLX45-3FGG484C requires separate power rails: VCCINT (1.0-1.05 V core), VCCAUX (2.5 V auxiliary), and VCCO (1.2-3.3 V per I/O bank). Follow AMD's recommended power-on sequence in DS160: VCCINT must reach 1.0 V before VCCAUX, with rise rates between 0.2 ms and 50 ms. A monolithic regulator such as the TPS62177 with sufficient bulk decoupling (47 uF + 10 uF + 0.1 uF) reduces core-supply ripple below 25 mVpp, satisfying Spartan-6 noise margins. Decoupling capacitors must be placed within 100 mils of each supply pin and the GND plane stitched adjacent to every BGA via.
Route the 1.0 mm pitch BGA escape using micro-via-in-pad or 4 mil trace/4 mil space rules at the outer layers. Avoid placing decoupling capacitors under the BGA shadow unless via-in-pad is enabled, and provide a solid GND plane in layer 2 with stitched GND vias at every BGA perimeter pin. SelectIO LVDS-25 pairs must be matched within 5 mil length tolerance across the entire routing path to maintain 250 mV UI jitter budget; this applies especially to DDR memory interfaces routed from the integrated MCB.
Estimated: at 1.0 V core supply, 100% logic utilization, and 0.9 GHz toggle rate, the LX45 dissipates approximately 0.7-1.0 W static plus dynamic power. The FGG484 package has a junction-to-ambient thermal resistance of approximately 12-15 C/W on a 4-layer PCB with thermal vias under the BGA center, so the junction rises only ~15 C above ambient. For FPGA-heavy designs (95%+ utilization, 1 GHz operation), add a 30 x 30 mm copper heat-spreader plate or active airflow to keep junction below 100 C for commercial-grade parts.
Do not connect VCCO banks to different voltages without first configuring bank voltage registers in the bitstream - hot-swap of bank voltages during operation is not supported. Configuration bitstreams generated by ISE Design Suite must target the correct package and speed grade (XC6SLX45-3FGG484C) - using a different package or speed grade causes bitstream CRC errors and failed configuration. After JTAG configuration, hold INIT_B high for at least 2 ms before driving DONE signals externally.
규정 준수 정보
FGG suffix indicates Pb-free FBGA ball finish. LEAD FREE confirmed by multiple distributors. Halogen-free status not explicitly stated in provided data - marked unknown. Spartan-6 family is not AEC-Q100 qualified; for automotive, use automotive-grade Spartan-6 XA variants.
