XC7A100T-1FGG484I - Artix-7 FPGA, 285 I/O | AMD
부품 번호: XC7A100T-1FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $26.06 | $26.06 |
| 10 | $24.5 | $245.00 |
| 100 | $22 | $2,200.00 |
| 500 | $19.5 | $9,750.00 |
| 1,000 | $17.5 | $17,500.00 |
XC7A100T-1FGG484I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be wired together in different configurations. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware reconfiguration. In the system hierarchy, an FPGA sits above microcontrollers in complexity and parallelism, offering massive parallel processing capabilities for tasks like digital signal processing (DSP), high-speed I/O, and custom logic implementation.
Key features of the XC7A100T-1FGG484I include 285 user I/Os, which provide ample connectivity for interfacing with external peripherals and memory. The device also integrates Mixed-Mode Clock Managers (MMCM) and Phase-Locked Loops (PLL) for robust clock generation and management. With 4,976,640 bits of block RAM, it can handle substantial data buffering and storage requirements. The Artix-7 family is optimized for highest performance-per-watt, making it suitable for power-sensitive applications.
Technically, the Artix-7 series is built on a 28nm high-k metal gate (HKMG) process, offering a significant improvement in performance and power efficiency over older generations. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, enabling flexible interfacing. The FGG484 package provides a compact footprint while still offering a high pin count for complex designs. The 'I' suffix indicates an industrial temperature grade, allowing operation from -40°C to +100°C (Tj).
Typical applications include software-defined radio, motor control, industrial networking, and video processing. The XC7A100T's combination of logic density, I/O count, and DSP capabilities makes it ideal for these mid-range applications where cost and power are critical. For example, in software-defined radio, the FPGA can handle multiple channels of digital down-conversion and filtering in parallel, offloading the host processor.
When designing with this device, careful attention must be paid to power supply decoupling and sequencing. The FPGA requires multiple voltage rails (VCCINT, VCCAUX, VCCO), and proper sequencing is essential to avoid latch-up or damage. Refer to the Xilinx 7 Series FPGAs Power Management Application Note (XAPP) for detailed guidance.
드롭인 대체품: XC7A100T-1FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A100T-1FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7A100T-2FGG484I
✅ 드롭인✓ 재고 있음
$45.9375 / 개
데이터시트 보기 →XC7A100T-1FGG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XA7A100T-1FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A75T-1FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A100T-1FG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A100T-1FGG484I 최대 정격 & 전기적 특성
| Family | Artix-7 |
| Logic Cells | 101440 |
| Number of I/Os | 285 |
| Block RAM | 4976640 bits |
| Technology | 28nm |
| Core Voltage | 1V |
| 패키지 | 484-BBGA (FGG484) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Tj) |
| Speed Grade | -1 |
| RoHS 상태 | Compliant |
| Lifecycle | Active |
XC7A100T-1FGG484I 핀 구성
| 핀 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 핀 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 핀 B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 핀 B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 핀 C1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 핀 C2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 핀 D1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| 핀 D2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
| 핀 E1 | IO_L5P_T0 — User I/O bank 0, differential pair P |
| 핀 E2 | IO_L5N_T0 — User I/O bank 0, differential pair N |
| 핀 F1 | IO_L6P_T0 — User I/O bank 0, differential pair P |
| 핀 F2 | IO_L6N_T0 — User I/O bank 0, differential pair N |
일반적인 애플리케이션
XC7A100T-1FGG484I 적합 용도: 6 애플리케이션s: Software-Defined Radio, Motor Control, Industrial Networking, Video Processing, Test and Measurement, Aerospace and Defense.
Software-Defined Radio
The XC7A100T-1FGG484I is ideal for software-defined radio (SDR) due to its high logic density and DSP capabilities. With 101,440 logic cells, it can implement multiple digital down-conversion (DDC) and channelization filters in parallel, processing wideband signals in real-time. The 285 I/Os allow interfacing with high-speed ADCs and DACs, while the MMCMs and PLLs generate precise clocking for sample rates. The industrial temperature grade ensures reliable operation in field-deployed radios. Compared to a microcontroller, the FPGA's parallel architecture offloads the host processor, enabling higher throughput and lower latency for signal processing tasks.
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Motor Control
The XC7A100T-1FGG484I excels in motor control applications, particularly for multi-axis servo drives and industrial automation. Its 285 I/Os can interface with multiple incremental encoders, Hall sensors, and PWM drivers simultaneously. The FPGA's parallel processing enables implementing Field-Oriented Control (FOC) algorithms with high bandwidth and low jitter, improving motor efficiency and torque response. The 28nm process and 1V core voltage contribute to low power consumption, which is critical for heat-sensitive environments. The industrial temperature grade (-40C to +100C) ensures reliable operation in factory floors. Compared to a DSP, the FPGA offers more flexibility for custom control topologies and faster I/O response.
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Industrial Networking
The XC7A100T-1FGG484I is well-suited for industrial networking equipment such as Ethernet switches, protocol converters, and fieldbus gateways. With 285 I/Os, it can support multiple Ethernet PHYs and serial interfaces like UART, SPI, and I2C. The FPGA's logic cells can implement custom packet processing, protocol bridging (e.g., EtherCAT, PROFINET), and time-sensitive networking (TSN) features with deterministic latency. The 4,976,640 bits of block RAM provide ample buffering for packet queues. The industrial temperature grade ensures operation in factory environments. Compared to a standard Ethernet switch IC, the FPGA offers full customization of the data path, enabling unique features and protocol support.
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Video Processing
The XC7A100T-1FGG484I is a strong candidate for video processing applications like image scaling, color space conversion, and frame buffering. Its 101,440 logic cells can implement multiple video processing pipelines in parallel, handling 1080p or even 4K resolutions at real-time frame rates. The 285 I/Os support various video interfaces such as MIPI CSI-2, LVDS, and HDMI. The block RAM can be configured as line buffers or frame buffers, reducing external memory bandwidth requirements. The 28nm process provides high performance-per-watt, making it suitable for portable or embedded vision systems. Compared to a GPU, the FPGA offers lower latency and deterministic processing, which is critical for real-time video analytics.
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Test and Measurement
The XC7A100T-1FGG484I is used in test and measurement equipment such as logic analyzers, signal generators, and data acquisition systems. Its high I/O count (285) allows capturing many digital signals simultaneously, while the logic cells implement trigger logic, pattern generation, and data compression. The MMCMs and PLLs generate precise clocks for time-stamping and sample rate control. The industrial temperature grade ensures accuracy in varying environments. Compared to a dedicated ASIC, the FPGA provides reconfigurability, allowing firmware updates to add new features without hardware changes. The 4,976,640 bits of block RAM can buffer large amounts of captured data before transferring to a host.
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Aerospace and Defense
The XC7A100T-1FGG484I is suitable for aerospace and defense applications like radar signal processing, secure communications, and flight control systems. The industrial temperature grade and robust 28nm process ensure reliable operation in harsh environments. The FPGA's parallel processing enables real-time beamforming, pulse compression, and encryption algorithms. The 285 I/Os interface with various sensors and communication links. The device's low power consumption is critical for airborne systems where heat dissipation is limited. Compared to a radiation-hardened FPGA, the XC7A100T offers a cost-effective solution for less extreme environments, with the flexibility to reconfigure for different missions.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7A100T-1FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A100T-2FGG484I | XC7A100T-1FGG484C | XA7A100T-1FGG484I | XC7A75T-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 101440 | 101440 | 101440 | 101440 | 75520 |
| Number of I/Os | 285 | 285 | 285 | 285 | 285 |
| Block RAM (bits) | 4976640 | 4976640 | 4976640 | 4976640 | 3870720 |
| Speed Grade | -1 | -2 | -1 | -1 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Automotive | Industrial |
| Core Voltage | 1V | 1V | 1V | 1V | 1V |
주요 차별점
- Higher logic density than XC7A75T (vs XC7A75T-1FGG484I)
- Industrial temperature grade (vs XC7A100T-1FGG484C)
- Cost-effective compared to -2 speed grade (vs XC7A100T-2FGG484I)
설계 노트
The XC7A100T-1FGG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (bank-specific, e.g., 3.3V, 2.5V, 1.8V). Proper power sequencing is critical to avoid latch-up. Use a dedicated power management IC like the TPS7A4701 for low-noise analog rails and a switching regulator for VCCINT. Ensure adequate decoupling capacitors (100nF and 10uF) near each power pin. Refer to Xilinx UG583 for detailed power supply design guidelines.
The XC7A100T-1FGG484I in the FGG484 package can dissipate significant power, especially at high utilization. The package thermal resistance (theta_JA) is approximately [DATA_NEEDED: theta_JA value] C/W. For designs exceeding 2W, consider adding a heatsink or forced airflow. The industrial temperature grade allows operation up to 100C junction, but keep the junction temperature below 85C for reliability. Use thermal vias under the package to improve heat transfer to the PCB ground plane.
For the 484-pin BGA, use a 4-layer or more PCB with a solid ground plane. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Place decoupling capacitors as close to the FPGA power pins as possible. Follow Xilinx UG475 for package pinout and PCB layout recommendations. Ensure the BGA footprint has proper solder mask and pad design to avoid solder bridging.
규정 준수 정보
The FGG484 package is lead-free (RoHS compliant). AEC-Q100 is not applicable for FPGAs; automotive grade is indicated by the XA prefix.
