XC7A200T-2FGG484I - Artix-7 FPGA 215K Logic Cells | AMD
부품 번호: XC7A200T-2FGG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $129.55 | $129.55 |
| 10 | $118.5 | $1,185.00 |
| 100 | $105.2 | $10,520.00 |
| 500 | $95.8 | $47,900.00 |
| 1,000 | $88.4 | $88,400.00 |
XC7A200T-2FGG484I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs sit within the broader hierarchy of programmable logic devices, which are part of the semiconductor industry. Unlike fixed-function ASICs, FPGAs offer reconfigurability, making them ideal for prototyping, low-to-mid volume production, and applications requiring field updates. The Artix-7 family specifically targets cost-sensitive, high-volume applications where performance-per-watt and low power are critical.
Key features of the XC7A200T-2FGG484I include 740 DSP slices for high-speed digital signal processing, 10 clock management tiles (CMTs) with MMCM and PLL, and support for various configuration interfaces including JTAG, SPI, and BPI. The -2 speed grade offers a balanced performance point, with the -3 being the highest performance and -1/-1LI/-2L optimized for lower static power. The device also integrates analog mixed-signal (AMS) blocks with a 12-bit 1MSPS ADC for on-chip monitoring.
Technically, the Artix-7 architecture is built on a 28nm high-k metal gate (HKMG) process, providing a significant leap in logic density and power efficiency over previous generations. The fabric includes 6-input look-up tables (LUTs), dedicated carry chains, and shift register logic, enabling efficient implementation of complex datapaths. The block RAM can be configured in various aspect ratios, and the DSP48E1 slices support 25x18 multiplication with 48-bit accumulation, ideal for filter and FFT implementations.
Typical applications include software-defined radio, motor control, medical imaging, and industrial networking. The high I/O count and DSP resources make it suitable for video processing, high-speed data acquisition, and aerospace/defense systems requiring reconfigurable logic. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, careful attention must be paid to power supply decoupling, with multiple 1.0V core and 1.8V auxiliary rails requiring proper filtering. Configuration bitstream storage in external SPI flash is recommended for production, and the device supports partial reconfiguration for dynamic logic updates.
드롭인 대체품: XC7A200T-2FGG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7A200T-2FGG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7A200T-2FBG484I
✅ 드롭인✓ 재고 있음
$89.15 / 개
데이터시트 보기 →XC7A200T-2SBG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7A200T-2CSG484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7A75T-2FGG484I
⚡ 동일 패키지✓ 재고 있음
$59.89 / 개
데이터시트 보기 →XC7A200T-2FGG484I 최대 정격 & 전기적 특성
| Family | Artix-7 |
| Number of Logic Elements/Cells | 215360 |
| Number of LABs/CLBs | 16825 |
| Total RAM Bits | 13455360 |
| Number of I/O | 285 |
| Number of DSP Slices | 740 |
| 패키지 | 484-BBGA, FCBGA (FGG484) |
| 동작 온도 | -40°C to +100°C |
| Core Supply Voltage | 0.95V to 1.05V (nominal 1.0V) |
| Speed Grade | -2 |
| Configuration Interfaces | JTAG, SPI, BPI, SelectMAP |
| Clock Management Tiles | 10 (with MMCM and PLL) |
| Analog Mixed Signal | 12-bit 1MSPS ADC |
| Process Technology | 28nm HKMG |
| RoHS 상태 | Compliant |
XC7A200T-2FGG484I 핀 구성
| 핀 A1 | IO_L1P_T0 — User I/O bank 0 |
| 핀 A2 | IO_L1N_T0 — User I/O bank 0 |
| 핀 B1 | VCCINT — Core supply 1.0V |
| 핀 B2 | GND — Ground |
| 핀 C1 | IO_L2P_T0 — User I/O bank 0 |
| 핀 C2 | IO_L2N_T0 — User I/O bank 0 |
| 핀 D1 | VCCAUX — Auxiliary supply 1.8V |
| 핀 D2 | GND — Ground |
| 핀 E1 | IO_L3P_T0 — User I/O bank 0 |
| 핀 E2 | IO_L3N_T0 — User I/O bank 0 |
| 핀 F1 | VCCBRAM — Block RAM supply 1.0V |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7A200T-2FGG484I 적합 용도: 6 애플리케이션s: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Video Processing, Aerospace and Defense, High-Speed Data Acquisition.
Software-Defined Radio
The XC7A200T-2FGG484I is ideal for software-defined radio (SDR) due to its 740 DSP slices and 13.4 Mb of block RAM, enabling complex digital down-conversion and filtering. The 285 I/O pins support high-speed ADC/DAC interfaces, while the 28nm process ensures low power for portable or remote radio units. The -2 speed grade provides a balanced performance point for real-time signal processing, and the industrial temperature range allows deployment in outdoor or harsh environments.
추천
Industrial Motor Control
In industrial motor control, the XC7A200T-2FGG484I excels with its 740 DSP slices for implementing field-oriented control (FOC) algorithms and PWM generation. The 285 I/O pins interface directly with gate drivers and current sensors, while the 10 clock management tiles ensure precise timing for encoder feedback. The device's low power consumption and -40°C to +100°C range make it suitable for factory automation and robotics, where reliability and real-time response are critical.
추천
Medical Imaging
The XC7A200T-2FGG484I is well-suited for medical imaging systems like ultrasound and CT scanners, where high-speed data acquisition and processing are essential. Its 13.4 Mb block RAM supports large image buffers, while the DSP slices handle beamforming and image enhancement algorithms. The 285 I/O pins connect to high-speed ADCs and display interfaces, and the industrial temperature range ensures reliable operation in clinical environments. The 28nm process provides the performance-per-watt needed for compact, portable devices.
추천
Video Processing
For video processing applications, the XC7A200T-2FGG484I offers 215,360 logic cells and 740 DSP slices, enabling real-time video scaling, color space conversion, and compression. The 285 I/O pins support multiple camera inputs and display outputs, while the block RAM provides line buffers for video streams. The -2 speed grade handles 1080p60 processing with headroom, and the low power consumption makes it suitable for embedded vision systems in security and surveillance.
추천
Aerospace and Defense
The XC7A200T-2FGG484I is designed for aerospace and defense applications requiring reconfigurable logic in harsh environments. Its industrial temperature range (-40°C to +100°C) and 28nm process ensure reliable operation in avionics and unmanned systems. The 285 I/O pins interface with sensors and communication links, while the DSP slices handle radar and signal processing. The device supports partial reconfiguration, allowing field updates to logic functions without full system downtime.
추천
High-Speed Data Acquisition
The XC7A200T-2FGG484I is excellent for high-speed data acquisition systems, offering 285 I/O pins to interface with multiple ADCs and DACs. The 13.4 Mb block RAM provides deep FIFO buffers for burst data capture, while the DSP slices perform real-time filtering and decimation. The -2 speed grade supports sampling rates up to several hundred MSPS, and the low power consumption enables portable or embedded instrumentation. The industrial temperature range ensures accuracy in test and measurement environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7A200T-2FGG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7A200T-2FBG484I | XC7A200T-2SBG484I | XC7A200T-2CSG484I |
|---|---|---|---|---|
| Package | 484-BBGA, FCBGA (FGG484) | 484-BBGA, FCBGA (FBG484) | 484-FBGA, FCBGA (SBG484) | 484-CSBGA (CSG484) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 215360 | 215360 | 215360 | 215360 |
| RAM Bits | 13455360 | 13455360 | 13455360 | 13455360 |
| Number of I/O | 285 | 285 | 285 | 285 |
| DSP Slices | 740 | 740 | 740 | 740 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| Core Supply Voltage | 0.95V to 1.05V | 0.95V to 1.05V | 0.95V to 1.05V | 0.95V to 1.05V |
주요 차별점
- Fine-pitch BGA package for higher routing density (vs XC7A200T-2FBG484I)
- Industrial temperature range (vs XC7A200T-2CSG484I)
- Higher logic capacity than smaller Artix-7 devices (vs XC7A100T-2CSG324I)
설계 노트
The XC7A200T-2FGG484I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O banks. Use low-impedance power planes and place decoupling capacitors (0.1uF and 1uF) close to each power pin. For high-speed designs, consider a dedicated power regulator for VCCINT to minimize noise.
The FGG484 package has a fine ball pitch (0.8mm), requiring precise PCB manufacturing. Ensure the land pattern matches the AMD recommended footprint from UG475. Use via-in-pad or microvias for routing to inner layers. Maintain controlled impedance for high-speed I/O traces and provide adequate ground vias around the device.
The XC7A200T-2FGG484I can dissipate significant power under heavy logic utilization. Use a thermal pad or heatsink on the package top if power exceeds 5W. Ensure adequate airflow in the enclosure. The industrial temperature range allows operation up to 100°C junction, but derating is recommended for long-term reliability.
규정 준수 정보
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive-grade device.
