XC7S15-1FTGB196C - Spartan-7 FPGA, 12.8K LC, 196-CSBGA | AMD
부품 번호: XC7S15-1FTGB196C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $33.5 | $33.50 |
| 10 | $30.2 | $302.00 |
| 100 | $26.85 | $2,685.00 |
| 500 | $24.3 | $12,150.00 |
| 1,000 | $21.75 | $21,750.00 |
XC7S15-1FTGB196C 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected via programmable routing. FPGAs are positioned in the programmable-logic hierarchy above CPLDs and below Application-Specific Integrated Circuits (ASICs): they offer higher density and richer DSP/memory resources than CPLDs while providing faster time-to-market and lower NRE cost than ASICs. Within AMD's portfolio, Spartan-7 occupies the cost-optimized node, with Artix-7 (mid-range) and Kintex-7/Virtex-7 (high-performance) above it.
Key specifications of the XC7S15-1FTGB196C include 12,800 logic cells, 360 Kbit of block RAM (18 Kb blocks), 20 DSP slices, 1.0V core voltage, and 100 user I/Os with LVCMOS, LVDS, and LVTTL support. The device is rated commercial temperature (0C to +85C junction) and uses the FTGB196 CSBGA package measuring 15x15 mm with 1.0 mm ball pitch, suited for compact, high-density PCB layouts.
Architecturally, Spartan-7 uses a 28 nm low-power process, dual 12-bit XADC, hardened memory controllers, and AMD's Vivado Design Suite for synthesis, place-and-route, and bitstream generation. Compared with Spartan-6, it provides roughly 2x logic density at lower power, while remaining pin-compatible with the same CSBGA footprint for many package options.
Typical applications include industrial motor control and sensor fusion, cost-sensitive IoT edge nodes, low-cost video bridging/display controllers, and serial preboot/IEC8254-style communication bridges. The combination of small form factor, low unit price, and AMD toolchain maturity makes it common in education kits and prototyping boards.
Designers should note that the FTGB196 package shares footprints with other Spartan-7 densities (XC7S25, XC7S50 in the same package), enabling density scaling without PCB rework. The -1 speed grade is the slowest of three, trading Fmax for cost savings.
This page synthesizes distributor pricing, drop-in alternatives within the same FTGB196 footprint, and design notes not found in the AMD datasheet, giving engineers a faster path from part selection to working hardware.
드롭인 대체품: XC7S15-1FTGB196C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC7S15-1FTGB196C (동일 폼 팩터 및 풋프린트) — 차이점: DSP Slices, Package, RoHS Status, Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7S15-2FTGB196C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S15-1FTGB196I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S25-1FTGB196C
✅ 드롭인✓ 재고 있음
$41.58 / 개
데이터시트 보기 →XC7S50-1FTGB196C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S50-1FTGB196I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7S15-1FTGB196C 최대 정격 & 전기적 특성
| Family | Spartan-7 |
| Logic Cells | 12,800 |
| Slices | 2,000 |
| Block RAM | 360 Kbit (18 Kb blocks) |
| DSP Slices | 20 |
| User I/Os | 100 |
| Core Voltage | 1.0 V nominal |
| Speed Grade | -1 |
| Temperature Grade | Commercial (0C to +85C TJ) |
| 패키지 | 196-ball CSBGA (FTGB196) 15x15 mm, 1.0 mm pitch |
| Process Technology | 28 nm |
| Configuration Memory | Flash-less, requires external SPI/Parallel/BPI configuration |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
XC7S15-1FTGB196C 핀 구성
| 핀 A1 | GND — Ground reference |
| 핀 A14 | VCCINT — Internal core voltage supply (1.0V) |
| 핀 B7 | IO_L1N_0 — Bank 0 HP I/O (LVCMOS/LVTTL/LVDS) |
| 핀 G14 | CCLK — Configuration clock input |
| 핀 H7 | DONE — Configuration done indicator (open-drain) |
| 핀 J14 | TDO — JTAG test data out |
| 핀 M7 | TMS — JTAG test mode select |
| 핀 N14 | TCK — JTAG test clock |
| 핀 P7 | TDI — JTAG test data in |
| 핀 GND_PAD | GND — Multiple thermal/ground pads under the BGA |
일반적인 애플리케이션
XC7S15-1FTGB196C 적합 용도: 6 애플리케이션s: Industrial Motor Control & Sensor Fusion, Cost-Sensitive IoT Edge Nodes, Low-Cost Video Bridge & Display Controller, Education & Prototyping Platforms, Industrial Communication Bridge (Modbus Profie), Aerospace & Drone Flight Controllers (Commercial UAVs).
Industrial Motor Control & Sensor Fusion
The XC7S15-1FTGB196C fits industrial motor-control boards requiring deterministic real-time loops, encoder interfaces, and sensor fusion. Its 20 DSP slices execute FOC algorithms at switchable PWM frequencies up to 200 kHz, while the 100 user I/Os host multiple quadrature encoder channels, SPI sensors, and UART/CAN bridges. With a 1.0V core and 28 nm low-power process, the device stays cool inside enclosed IP65-rated motor drives, extending MTBF. The FTGB196 package also enables upward migration to XC7S25-1FTGB196C on the same PCB for higher-end servo drives.
추천
Cost-Sensitive IoT Edge Nodes
The XC7S15-1FTGB196C powers IoT edge gateways that aggregate multiple sensor streams over I2C, SPI, UART, and One-Wire. Its 12,800 logic cells run lightweight TLS, custom protocols, and on-device pre-processing before forwarding data over Ethernet or LoRaWAN. With 100 user I/Os, designers can directly fan-out to multiple sensor buses without external glue logic, and the commercial temperature range is ideal for indoor/office installations. Low static power and Vivado Free license keep BOM and tooling costs minimal.
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Low-Cost Video Bridge & Display Controller
The XC7S15-1FTGB196C bridges video between parallel RGB, MIPI-style LVDS, or HDMI streams and low-resolution LCD panels in kiosks, signage, and HMI products. Its FPGA fabric can implement timing controllers, gamma correction, and image scaling without external scaler ICs, while the 100 I/Os drive TFT panels directly. Designers use the LVDS_25 IO standard for noise-immune ribbon-cable connections. Compared with discrete video processors, this Spartan-7 solution adds flexibility for custom overlays while reducing BOM cost.
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Education & Prototyping Platforms
The XC7S15-1FTGB196C is widely adopted on teaching boards such as the Digilent Cmod S7, Avnet Spartan-7 Mini Board, and Open Source EDGE Spartan-7 kit. Its low unit price (under $30 at LCSC as of 2026-10-11), Vivado Webpack free support, and FTGB196 1.0 mm-pitch package make it friendly for hand-rework labs while exposing enough logic (120 IO, 20 DSP) for coursework in HDL design, embedded SoC, and DSP. The 196-ball BGA footprint also gives students real-world fine-pitch BGA soldering practice.
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Industrial Communication Bridge (Modbus Profie)
The XC7S15-1FTGB196C bridges legacy serial protocols (RS-232/RS-485/Modbus RTU) to Ethernet/TCP, Profinet, or EtherCAT in brownfield factory automation. Its FPGA fabric implements multiple UART cores, DMA controllers, and protocol stacks concurrently without CPU intervention, while the 100 I/Os isolate physical-layer transceivers from the central PLC. Designers appreciate the ability to soft-update protocol support via bitstream reconfiguration without replacing hardware, ideal for long-life industrial assets.
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Aerospace & Drone Flight Controllers (Commercial UAVs)
The XC7S15-1FTGB196C serves in commercial UAV flight-control systems, where its parallel sensor processing handles IMU, GPS, optical-flow, and barometer fusion at sub-millisecond rates. The 20 DSP slices accelerate PID and quaternion math, while 100 I/Os allow direct connection to multiple SPI/UART sensor buses without external MUXes. The -1 commercial speed grade is sufficient for typical 1 kHz control loops, and the FTGB196 footprint helps shrink PCB area to fit inside compact airframes.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7S15-1FTGB196C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7S15-2FTGB196C | XC7S15-1FTGB196I | XC7S25-1FTGB196C | XC7S50-1FTGB196C | XC7S50-1FTGB196I |
|---|---|---|---|---|---|---|
| Package | 196-ball CSBGA (FTGB196) | 196-ball CSBGA (FTGB196) - same | 196-ball CSBGA (FTGB196) - same | 196-ball CSBGA (FTGB196) - same | 196-ball CSBGA (FTGB196) - same | 196-ball CSBGA (FTGB196) - same |
| Brand | AMD (Xilinx) | AMD - same | AMD - same | AMD - same | AMD - same | AMD - same |
| Logic Cells | 12,800 | 12,800 | 12,800 | 17,600 (+37.5%) | 52,160 (+307%) | 52,160 (+307%) |
| DSP Slices | 20 | 20 | 20 | 45 (+125%) | 120 (+500%) | 120 (+500%) |
| Speed Grade | -1 (slowest) | -2 (faster) | -1 | -1 | -1 | -1 |
| Temperature Grade | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Industrial (-40C to +100C TJ) |
| Block RAM (Kbit) | 360 | 360 | 360 | 540 (+50%) | 2,700 (+650%) | 2,700 (+650%) |
| User I/Os | 100 | 100 | 100 | 100 | 100 | 100 |
주요 차별점
- Smallest density in Spartan-7 family at lowest unit cost (vs XC7S25-1FTGB196C)
- Commercial temperature grade with Vivado Webpack free tooling (vs XC7S15-1FTGB196I)
- Drop-in compatible with higher-density Spartan-7 in same FTGB196 footprint (vs XC7S50-1FTGB196C)
설계 노트
Estimated: the 196-ball FTGB196 CSBGA has 1.0 mm ball pitch, which requires a 4-layer PCB minimum with microvia or 0.4 mm via-in-pad technology for reliable fan-out. Place all decoupling capacitors (MOCO-grade 0.1 uF and 4.7 uF) on the BGA's opposite side as close as possible to each power ball. The BGA thermal pad must be tied to a ground plane with thermal vias on a 1.0 mm grid for heat dissipation under industrial conditions.
The XC7S15-1FTGB196C requires three supplies: VCCINT (1.0V core, up to ~1.2A peak during configuration), VCCAUX (1.8V auxiliary, ~80 mA), and VCCO (1.8V-3.3V HR I/O bank supply). Use a TI TPS7A7002DDA or equivalent LDO for VCCINT, and ramp VCCINT before VCCAUX per the AMD Spartan-7 power sequence. Inadequate sequencing can corrupt configuration memory and prevent bitstream load.
Do not omit the external SPI flash for configuration storage: Spartan-7 has no internal Flash and the FPGA is bricked without a valid boot image on power-up. Use a 16 Mbit minimum SPI flash such as W25Q128FWPIG with the BUSY/QUAD mode disabled in the bitstream settings. Also confirm that the MODE pins select the correct boot mode (000 = SPI for the FTGB196 package per UG470).
Estimated: the XC7S15-1FTGB196C dissipates up to ~1.5W when fully utilized (DSP + high-utilization fabric). In sealed enclosures without airflow, attach a copper thermal pad or thermal interface material to the BGA top side. For commercial-temperature deployments, a 4-layer PCB with a continuous ground plane below the BGA typically keeps junction rise below 25C without active cooling.
규정 준수 정보
RoHS compliant per AMD/Xilinx product page. Not AEC-Q100 qualified - Spartan-7 family is not designed for automotive functional-safety applications; use Spartan-7 XA variants (XA7S15) for automotive.
