XC7VH870T-1FLG1155C - Virtex-7 HT FPGA | AMD | 1155-Ball
부품 번호: XC7VH870T-1FLG1155C ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $10500 | $1,050,000.00 |
| 500 | $9800 | $4,900,000.00 |
| 1,000 | $9200 | $9,200,000.00 |
XC7VH870T-1FLG1155C 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs are a type of programmable logic device, which falls under the broader category of semiconductor devices. They are distinct from fixed-function ASICs because their logic blocks and interconnects can be reprogrammed, allowing for rapid prototyping and field upgrades. The Virtex-7 HT family specifically targets high-speed serial connectivity and high-bandwidth applications, integrating up to 32 high-speed transceivers.
Key features of the XC7VH870T-1FLG1155C include a large logic density with 580,480 logic cells, 34,652,160 bits of block RAM, and 400 user I/O pins. The device supports a maximum combinatorial CLB delay of 0.740 ns, enabling high-speed logic operations. It also includes 32 GTZ transceivers capable of data rates up to 28.05 Gb/s, making it suitable for 100G and 400G optical networking applications. The -1 speed grade indicates a balanced performance level, while the C suffix denotes the commercial temperature range.
From a technical depth perspective, the Virtex-7 HT FPGA architecture includes configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers. The device is supported by AMD's Vivado Design Suite, which provides a comprehensive environment for synthesis, implementation, and verification. The FLG1155 package offers a high pin count for routing flexibility, and the flip-chip construction improves thermal and electrical performance.
Typical applications for the XC7VH870T-1FLG1155C include high-end networking equipment, data center switches, and test and measurement instruments. Its high transceiver count and logic density make it ideal for implementing complex protocols like 100GbE and OTN. The device is also used in aerospace and defense systems requiring high-bandwidth signal processing.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential to maintain junction temperature within the specified range, especially when operating at high utilization and transceiver speeds.
드롭인 대체품: XC7VH870T-1FLG1155C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7VH870T-1HCG1155C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VH580T-1FLG1155C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VH870T-1FLG1155C 최대 정격 & 전기적 특성
| Family | Virtex-7 HT |
| Logic Cells | 580,480 |
| Block RAM | 34,652,160 bits |
| User I/O | 400 |
| GTZ Transceivers | 32 |
| Max Transceiver Speed | 28.05 Gb/s |
| Combinatorial CLB Delay | 0.740 ns max |
| 동작 온도 | 0°C to 85°C |
| 패키지 | FLG1155 (Flip-Chip Land Grid Array) |
| Number of Terminals | 1155 |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | SQUARE |
| Speed Grade | -1 |
| Process Technology | 28nm HKMG |
| 실장 유형 | Surface Mount |
XC7VH870T-1FLG1155C 핀 구성
| 핀 A1 | GND — Ground |
| 핀 A2 | VCCINT — Core logic power supply |
| 핀 B1 | IO_L1P_T0 — User I/O bank 0 |
| 핀 B2 | IO_L1N_T0 — User I/O bank 0 |
| 핀 C1 | VCCAUX — Auxiliary power supply |
| 핀 C2 | GND — Ground |
| 핀 D1 | GTZ_TX_P — GTZ transceiver transmit positive |
| 핀 D2 | GTZ_TX_N — GTZ transceiver transmit negative |
| 핀 E1 | GTZ_RX_P — GTZ transceiver receive positive |
| 핀 E2 | GTZ_RX_N — GTZ transceiver receive negative |
| 핀 F1 | VCCO — I/O bank power supply |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7VH870T-1FLG1155C 적합 용도: 6 애플리케이션s: High-Speed Networking, Data Center Acceleration, Test and Measurement, Aerospace and Defense, Broadcast and Video, Scientific Computing.
High-Speed Networking
The XC7VH870T-1FLG1155C is ideal for high-speed networking equipment like switches and routers. Its 32 GTZ transceivers support data rates up to 28.05 Gb/s, enabling 100GbE and 400GbE line cards. The high logic density allows implementation of complex packet processing and forwarding engines. According to AMD, Virtex-7 HT FPGAs achieve 100% electrical conformance to 10GBASE-KR, ensuring reliable backplane operation. The device's 400 user I/O pins provide ample connectivity for external PHYs and memory interfaces.
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Data Center Acceleration
In data centers, the XC7VH870T-1FLG1155C accelerates workloads like encryption, compression, and AI inference. Its 580,480 logic cells and 34,652,160 bits of block RAM enable large-scale parallel processing. The high-speed transceivers connect to host servers via PCIe or Ethernet, offloading CPU tasks. The device's 0.740 ns CLB delay ensures low-latency operation, critical for real-time analytics. Designers can use the Vivado Design Suite to implement custom accelerators, reducing time-to-market for new algorithms.
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Test and Measurement
The XC7VH870T-1FLG1155C is used in high-end test equipment like oscilloscopes and logic analyzers. Its high-speed transceivers capture signals up to 28 Gb/s, while the logic cells implement triggering and analysis algorithms. The 400 I/O pins interface with ADCs and DACs for signal acquisition and generation. The device's commercial temperature range (0°C to 85°C) suits benchtop instruments. AMD's Vivado tools support rapid prototyping of measurement features, enabling flexible product development.
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Aerospace and Defense
In aerospace and defense, the XC7VH870T-1FLG1155C supports radar, electronic warfare, and secure communications. Its high logic density processes wideband signals, while the transceivers handle high-speed data links. The device's 0.740 ns CLB delay enables real-time signal processing. Although not AEC-Q100 qualified, it meets commercial standards for ground-based systems. Designers can implement custom encryption and beamforming algorithms, leveraging the FPGA's reconfigurability for mission adaptability.
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Broadcast and Video
The XC7VH870T-1FLG1155C is used in broadcast video routers and production switchers. Its high-speed transceivers transport uncompressed 4K/8K video over IP, while the logic cells handle format conversion and scaling. The 400 I/O pins connect to video codecs and frame buffers. The device's 34,652,160 bits of block RAM store video lines for processing. AMD's Vivado tools support SMPTE standards, ensuring interoperability with broadcast equipment.
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Scientific Computing
The XC7VH870T-1FLG1155C accelerates scientific simulations and data analysis in research labs. Its 580,480 logic cells implement custom floating-point units, while the transceivers connect to high-performance computing clusters. The device's 34,652,160 bits of block RAM enable on-chip data caching, reducing memory latency. The 0.740 ns CLB delay supports high clock frequencies for compute-intensive tasks. Researchers can use Vivado High-Level Synthesis to design accelerators from C/C++ code, speeding up algorithm development.
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추천 제품 요약
엔지니어링 참조 데이터: XC7VH870T-1FLG1155C — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7VH870T-1HCG1155C | XC7VH870T-2FLG1932C | XC7VH580T-1FLG1155C |
|---|---|---|---|---|
| Package | FLG1155 | CBGA-1155 | FLG1932 | FLG1155 |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 580,480 | 580,480 | 580,480 | 580,480 |
| Block RAM | 34,652,160 bits | 34,652,160 bits | 34,652,160 bits | 34,652,160 bits |
| GTZ Transceivers | 32 | 32 | 32 | 32 |
| Max Transceiver Speed | 28.05 Gb/s | 28.05 Gb/s | 28.05 Gb/s | 28.05 Gb/s |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
주요 차별점
- Higher logic density than XC7VH580T (vs XC7VH580T-1FLG1155C)
- Flip-chip package for better thermal performance (vs XC7VH870T-1HCG1155C)
- Higher speed grade option (vs XC7VH870T-2FLG1932C)
설계 노트
The XC7VH870T-1FLG1155C requires multiple power rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use a dedicated power management IC to sequence these rails properly. According to AMD's 7 Series FPGAs PCB Design Guide (UG483), decouple each rail with a combination of bulk and ceramic capacitors placed close to the FPGA pins to minimize voltage droop during high-speed switching.
The FLG1155 package has a flip-chip construction that aids heat dissipation, but a heatsink is still recommended for high-utilization designs. The device's commercial temperature range is 0°C to 85°C, so ensure adequate airflow or liquid cooling in dense systems. Calculate the power dissipation based on logic utilization and transceiver activity, and verify junction temperature stays within limits.
For high-speed transceivers, follow AMD's layout guidelines for impedance-controlled traces and differential pairs. Keep trace lengths matched and avoid vias in critical signal paths. The PCB design guide (UG483) provides detailed stack-up recommendations. Also, ensure the 1155-ball BGA has proper solder mask and pad design to avoid manufacturing defects.
규정 준수 정보
Compliance data not provided in verified web data. Check AMD's product page for RoHS/REACH status.
