XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD
부품 번호: XC7VH870T-2FLG1155I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $11000 | $1,100,000.00 |
| 500 | $10500 | $5,250,000.00 |
| 1,000 | $10000 | $10,000,000.00 |
XC7VH870T-2FLG1155I 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the broader category of programmable logic devices, which sit between application-specific integrated circuits (ASICs) and general-purpose processors. They offer a balance of flexibility and performance, allowing engineers to implement custom digital logic without the high NRE costs of ASIC development. The Virtex-7 HT family is specifically optimized for high-throughput serial transceiver applications, such as 100G/400G networking and data center interconnect.
Key features of the XC7VH870T-2FLG1155I include 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and board-to-board communication. The -2 speed grade indicates a balanced performance level, suitable for a variety of high-speed designs. The industrial temperature grade ensures reliable operation in harsh environments.
From an architectural perspective, the Virtex-7 HT family leverages AMD's advanced 28nm process technology, delivering high logic density and low power consumption. The device includes dedicated DSP slices, block RAM, and clock management tiles, enabling efficient implementation of complex algorithms. The high-speed transceivers support data rates up to 28.05 Gbps, making the device ideal for backplane and optical module applications.
Typical applications include 100G/400G optical transport, high-performance computing, radar and signal processing, and aerospace and defense systems. The device's high logic density and transceiver count make it well-suited for these demanding workloads.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails, and proper sequencing is essential. The FLG1155 package has a large thermal pad that should be connected to a solid ground plane for optimal heat dissipation.
드롭인 대체품: XC7VH870T-2FLG1155I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7VH870T-1HCG1155C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VH870T-2FLG1155I 최대 정격 & 전기적 특성
| Family | Virtex-7 HT |
| Logic Cells | 876160 |
| Block RAM | 51982080 bits |
| User I/O | 300 |
| 패키지 | FLG1155 (1155-ball Flip-Chip BGA) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) |
| Combinatorial CLB Delay | 0.740 ns (max) |
| Transceiver Speed | 28.05 Gbps (max) |
| Process Technology | 28nm |
| 공급 전압 | 1.0V (core) |
| Configuration | SRAM-based |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40°C to +100°C |
XC7VH870T-2FLG1155I 핀 구성
| 핀 A1 | GND — Ground |
| 핀 A2 | VCCINT — Core supply voltage (1.0V) |
| 핀 B1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 핀 B2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 핀 C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| 핀 C2 | IO_L2P_T1 — User I/O bank 1, differential pair P |
| 핀 D1 | IO_L2N_T1 — User I/O bank 1, differential pair N |
| 핀 D2 | GND — Ground |
| 핀 E1 | VCCBRAM — Block RAM supply voltage (1.0V) |
| 핀 E2 | IO_L3P_T2 — User I/O bank 2, differential pair P |
| 핀 F1 | IO_L3N_T2 — User I/O bank 2, differential pair N |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7VH870T-2FLG1155I 적합 용도: 6 애플리케이션s: 100G/400G Optical Transport, High-Performance Computing, Radar and Signal Processing, Aerospace and Defense, Data Center Networking, Test and Measurement.
100G/400G Optical Transport
The XC7VH870T-2FLG1155I is ideal for 100G/400G optical transport systems, providing high logic density and high-speed transceivers up to 28.05 Gbps. It can handle complex packet processing and forward error correction (FEC) algorithms, enabling efficient data transmission over optical networks. The device's 876,160 logic cells and 51,982,080 block RAM bits support large lookup tables and buffering, while the 300 user I/Os interface with optical modules and host processors. Its industrial temperature range ensures reliable operation in central office environments.
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High-Performance Computing
In high-performance computing (HPC), the XC7VH870T-2FLG1155I accelerates compute-intensive workloads such as scientific simulations and financial modeling. Its 876,160 logic cells and DSP slices enable parallel processing of floating-point operations, while the high-speed transceivers facilitate low-latency interconnects between FPGAs and CPUs. The device's 51,982,080 block RAM bits provide on-chip storage for intermediate results, reducing external memory bandwidth requirements. The industrial temperature grade supports deployment in data center environments with demanding thermal conditions.
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Radar and Signal Processing
The XC7VH870T-2FLG1155I excels in radar and signal processing applications, offering high logic density and DSP capabilities for beamforming, pulse compression, and target detection. Its 876,160 logic cells implement complex filter banks and FFT engines, while the 51,982,080 block RAM bits store coefficient tables and intermediate data. The device's high-speed transceivers interface with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), enabling real-time processing of wideband signals. The industrial temperature range ensures reliable operation in military and aerospace environments.
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Aerospace and Defense
The XC7VH870T-2FLG1155I is well-suited for aerospace and defense systems, providing high reliability and performance in harsh environments. Its industrial temperature range (-40°C to +100°C) and robust package make it suitable for avionics, electronic warfare, and secure communications. The device's 876,160 logic cells implement encryption, signal intelligence, and sensor fusion algorithms, while the 300 user I/Os interface with various sensors and actuators. The high-speed transceivers support data links for radar and communication systems, ensuring secure and reliable data transfer.
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Data Center Networking
In data center networking, the XC7VH870T-2FLG1155I enables high-throughput packet processing and switching. Its 876,160 logic cells implement forwarding tables, access control lists (ACLs), and traffic shaping, while the 51,982,080 block RAM bits store packet buffers and flow state. The device's high-speed transceivers support 100G/400G Ethernet, providing low-latency connectivity between servers and switches. The 300 user I/Os interface with host processors and management controllers, enabling flexible system integration. The industrial temperature grade ensures reliable operation in data center environments.
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Test and Measurement
The XC7VH870T-2FLG1155I is used in advanced test and measurement equipment, such as high-speed oscilloscopes and logic analyzers. Its 876,160 logic cells implement acquisition, triggering, and analysis functions, while the 51,982,080 block RAM bits store waveform data. The device's high-speed transceivers interface with high-speed ADCs and DACs, enabling capture and generation of wideband signals. The 300 user I/Os connect to probes and external triggers, providing flexible system control. The industrial temperature range supports operation in laboratory and field environments.
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추천 제품 요약
엔지니어링 참조 데이터: XC7VH870T-2FLG1155I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7VH870T-1HCG1155C | XC7VH870T-2FLG1932C | XC7VH870T-G2FLG1932E |
|---|---|---|---|---|
| Package | FLG1155 (1155-ball Flip-Chip BGA) | FLG1155 (1155-ball Flip-Chip BGA) - same | FLG1932 (1932-ball Flip-Chip BGA) - different | FLG1932 (1932-ball Flip-Chip BGA) - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 876160 | 876160 | 876160 | 876160 |
| Block RAM | 51982080 bits | 51982080 bits | 51982080 bits | 51982080 bits |
| Speed Grade | -2 | -1 | -2 | -G2 |
주요 차별점
- Industrial temperature grade (vs XC7VH870T-1HCG1155C)
- Faster speed grade (vs XC7VH870T-1HCG1155C)
- Smaller package with fewer I/Os (vs XC7VH870T-2FLG1932C)
설계 노트
The XC7VH870T-2FLG1155I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCBRAM (1.0V). Proper power sequencing is critical to avoid latch-up or damage. Use a dedicated power management IC to sequence the rails, and ensure each rail has adequate decoupling capacitors (100nF and 10uF) placed close to the FPGA pins. Refer to the AMD Virtex-7 HT power supply design guidelines for detailed recommendations.
The FLG1155 package has a large thermal pad that must be connected to a solid ground plane for effective heat dissipation. For high-power designs, consider using a heatsink or active cooling to keep the junction temperature within the specified range. The industrial temperature grade allows operation up to +100°C, but thermal analysis is essential to ensure reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Place the FPGA close to the connectors or optical modules to reduce signal path length. Follow the AMD PCB design guidelines for the FLG1155 package, including proper ground plane partitioning and decoupling. Ensure all power and ground pins are connected to the respective planes with low inductance paths.
규정 준수 정보
RoHS compliant per AMD product page. Not AEC-Q100 qualified (FPGA, not automotive). Halogen-free status not specified in available data.
