XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD
MPN: XC7VH870T-2FLG1155I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $11000 | $1,100,000.00 |
| 500 | $10500 | $5,250,000.00 |
| 1,000 | $10000 | $10,000,000.00 |
Drop-in alternatives for XC7VH870T-2FLG1155I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7VH870T-1HCG1155C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7VH870T-2FLG1155I Maximum Ratings & Electrical Characteristics
| Family | Virtex-7 HT |
| Logic Cells | 876160 |
| Block RAM | 51982080 bits |
| User I/O | 300 |
| Package | FLG1155 (1155-ball Flip-Chip BGA) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) |
| Combinatorial CLB Delay | 0.740 ns (max) |
| Transceiver Speed | 28.05 Gbps (max) |
| Process Technology | 28nm |
| Supply Voltage | 1.0V (core) |
| Configuration | SRAM-based |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C to +100°C |
XC7VH870T-2FLG1155I Pin Configuration
| Pin A1 | GND — Ground |
| Pin A2 | VCCINT — Core supply voltage (1.0V) |
| Pin B1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin B2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Pin C2 | IO_L2P_T1 — User I/O bank 1, differential pair P |
| Pin D1 | IO_L2N_T1 — User I/O bank 1, differential pair N |
| Pin D2 | GND — Ground |
| Pin E1 | VCCBRAM — Block RAM supply voltage (1.0V) |
| Pin E2 | IO_L3P_T2 — User I/O bank 2, differential pair P |
| Pin F1 | IO_L3N_T2 — User I/O bank 2, differential pair N |
| Pin F2 | GND — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7VH870T-2FLG1155I is suitable for 6 applications: 100G/400G Optical Transport, High-Performance Computing, Radar and Signal Processing, Aerospace and Defense, Data Center Networking, Test and Measurement.
100G/400G Optical Transport
The XC7VH870T-2FLG1155I is ideal for 100G/400G optical transport systems, providing high logic density and high-speed transceivers up to 28.05 Gbps. It can handle complex packet processing and forward error correction (FEC) algorithms, enabling efficient data transmission over optical networks. The device's 876,160 logic cells and 51,982,080 block RAM bits support large lookup tables and buffering, while the 300 user I/Os interface with optical modules and host processors. Its industrial temperature range ensures reliable operation in central office environments.
Recommended
High-Performance Computing
In high-performance computing (HPC), the XC7VH870T-2FLG1155I accelerates compute-intensive workloads such as scientific simulations and financial modeling. Its 876,160 logic cells and DSP slices enable parallel processing of floating-point operations, while the high-speed transceivers facilitate low-latency interconnects between FPGAs and CPUs. The device's 51,982,080 block RAM bits provide on-chip storage for intermediate results, reducing external memory bandwidth requirements. The industrial temperature grade supports deployment in data center environments with demanding thermal conditions.
Recommended
Radar and Signal Processing
The XC7VH870T-2FLG1155I excels in radar and signal processing applications, offering high logic density and DSP capabilities for beamforming, pulse compression, and target detection. Its 876,160 logic cells implement complex filter banks and FFT engines, while the 51,982,080 block RAM bits store coefficient tables and intermediate data. The device's high-speed transceivers interface with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), enabling real-time processing of wideband signals. The industrial temperature range ensures reliable operation in military and aerospace environments.
Recommended
Aerospace and Defense
The XC7VH870T-2FLG1155I is well-suited for aerospace and defense systems, providing high reliability and performance in harsh environments. Its industrial temperature range (-40°C to +100°C) and robust package make it suitable for avionics, electronic warfare, and secure communications. The device's 876,160 logic cells implement encryption, signal intelligence, and sensor fusion algorithms, while the 300 user I/Os interface with various sensors and actuators. The high-speed transceivers support data links for radar and communication systems, ensuring secure and reliable data transfer.
Recommended
Data Center Networking
In data center networking, the XC7VH870T-2FLG1155I enables high-throughput packet processing and switching. Its 876,160 logic cells implement forwarding tables, access control lists (ACLs), and traffic shaping, while the 51,982,080 block RAM bits store packet buffers and flow state. The device's high-speed transceivers support 100G/400G Ethernet, providing low-latency connectivity between servers and switches. The 300 user I/Os interface with host processors and management controllers, enabling flexible system integration. The industrial temperature grade ensures reliable operation in data center environments.
Recommended
Test and Measurement
The XC7VH870T-2FLG1155I is used in advanced test and measurement equipment, such as high-speed oscilloscopes and logic analyzers. Its 876,160 logic cells implement acquisition, triggering, and analysis functions, while the 51,982,080 block RAM bits store waveform data. The device's high-speed transceivers interface with high-speed ADCs and DACs, enabling capture and generation of wideband signals. The 300 user I/Os connect to probes and external triggers, providing flexible system control. The industrial temperature range supports operation in laboratory and field environments.
Recommended
Recommended Products Summary
Engineering reference data for XC7VH870T-2FLG1155I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7VH870T-1HCG1155C | XC7VH870T-2FLG1932C | XC7VH870T-G2FLG1932E |
|---|---|---|---|---|
| Package | FLG1155 (1155-ball Flip-Chip BGA) | FLG1155 (1155-ball Flip-Chip BGA) - same | FLG1932 (1932-ball Flip-Chip BGA) - different | FLG1932 (1932-ball Flip-Chip BGA) - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 876160 | 876160 | 876160 | 876160 |
| Block RAM | 51982080 bits | 51982080 bits | 51982080 bits | 51982080 bits |
| User I/O | 300 | 300 | [DATA_NEEDED: User I/O] | [DATA_NEEDED: User I/O] |
| Speed Grade | -2 | -1 | -2 | -G2 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +85°C) | Commercial (0°C to +85°C) | Extended ([DATA_NEEDED: Temperature range]) |
| Combinatorial CLB Delay | 0.740 ns (max) | 0.740 ns (max) | [DATA_NEEDED: Combinatorial CLB Delay] | [DATA_NEEDED: Combinatorial CLB Delay] |
Key Differentiators
- Industrial temperature grade (vs XC7VH870T-1HCG1155C)
- Faster speed grade (vs XC7VH870T-1HCG1155C)
- Smaller package with fewer I/Os (vs XC7VH870T-2FLG1932C)
Design Notes
The XC7VH870T-2FLG1155I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCBRAM (1.0V). Proper power sequencing is critical to avoid latch-up or damage. Use a dedicated power management IC to sequence the rails, and ensure each rail has adequate decoupling capacitors (100nF and 10uF) placed close to the FPGA pins. Refer to the AMD Virtex-7 HT power supply design guidelines for detailed recommendations.
The FLG1155 package has a large thermal pad that must be connected to a solid ground plane for effective heat dissipation. For high-power designs, consider using a heatsink or active cooling to keep the junction temperature within the specified range. The industrial temperature grade allows operation up to +100°C, but thermal analysis is essential to ensure reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Place the FPGA close to the connectors or optical modules to reduce signal path length. Follow the AMD PCB design guidelines for the FLG1155 package, including proper ground plane partitioning and decoupling. Ensure all power and ground pins are connected to the respective planes with low inductance paths.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified (FPGA, not automotive). Halogen-free status not specified in available data.
