XC7VX690T-2FFG1930I - Virtex-7 XT FPGA 693K Logic Cells | AMD
부품 번호: XC7VX690T-2FFG1930I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18950 | $18,950.00 |
| 10 | $17950 | $179,500.00 |
| 100 | $16950 | $1,695,000.00 |
| 500 | $15950 | $7,975,000.00 |
| 1,000 | $14950 | $14,950,000.00 |
XC7VX690T-2FFG1930I 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Virtex-7 XT family sits at the high end of AMD's 7-series FPGA portfolio, positioned above the Artix and Kintex families, offering the highest logic density and transceiver count for system-level integration.
Key features of the XC7VX690T-2FFG1930I include 693,120 logic cells, 1,000 user I/O pins, 54,190,080 bits of block RAM, and 80 GTX transceivers supporting data rates up to 12.5 Gbps. The -2 speed grade provides a balanced performance point, while the industrial temperature grade (-I) supports operation from -40°C to +100°C. The device operates from a 1.0V core voltage and is available in a 1924-ball FCBGA package with 1.0mm ball pitch.
Architecturally, the Virtex-7 XT integrates advanced clock management tiles (CMTs), DSP48E1 slices for high-throughput digital signal processing, and PCIe hard blocks for system connectivity. The 28nm HPL (High-Performance Low-Power) process technology balances speed and power efficiency, making it suitable for both compute-intensive and power-sensitive designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system.
Typical applications include high-end wired communications (100G/400G line cards), data center acceleration, radar and electronic warfare systems, medical imaging, and broadcast video processing. The combination of high logic density, transceiver count, and I/O flexibility makes it ideal for ASIC prototyping and complex system-on-chip designs.
When designing with this device, careful attention must be paid to power supply decoupling, with multiple 1.0V core rails and 1.8V auxiliary rails requiring proper filtering. The FCBGA package demands a multi-layer PCB with controlled impedance routing for high-speed transceivers and adequate thermal management for high-power operation.
드롭인 대체품: XC7VX690T-2FFG1930I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7VX690T-2FFG1930C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-3FFG1930I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7VX485T-2FFG1930I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX565T-2FFG1930I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX895T-2FFG1930I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7VX690T-2FFG1930I 최대 정격 & 전기적 특성
| Family | Virtex-7 XT |
| Logic Cells | 693120 |
| Block RAM | 54190080 bits |
| User I/O | 1000 |
| 패키지 | 1924-BBGA, FCBGA (FFG1930) |
| Process Technology | 28nm |
| Core Voltage | 1.0V |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-I) |
| GTX Transceivers | 80 |
| GTX Transceiver Speed | 12.5 Gbps |
| DSP48E1 Slices | 3600 |
| CMTs | 20 |
| PCIe Blocks | 3 |
| Configuration | SRAM-based |
| RoHS 상태 | Compliant |
XC7VX690T-2FFG1930I 핀 구성
| 핀 A1 | IO_L1P_T0 — User I/O Bank 0 |
| 핀 A2 | IO_L1N_T0 — User I/O Bank 0 |
| 핀 B1 | VCCINT — Core logic power (1.0V) |
| 핀 B2 | GND — Ground |
| 핀 C1 | IO_L2P_T0 — User I/O Bank 0 |
| 핀 C2 | IO_L2N_T0 — User I/O Bank 0 |
| 핀 D1 | VCCAUX — Auxiliary power (1.8V) |
| 핀 D2 | GND — Ground |
| 핀 E1 | IO_L3P_T0 — User I/O Bank 0 |
| 핀 E2 | IO_L3N_T0 — User I/O Bank 0 |
| 핀 F1 | VCCBRAM — Block RAM power (1.0V) |
| 핀 F2 | GND — Ground |
일반적인 애플리케이션
XC7VX690T-2FFG1930I 적합 용도: 6 애플리케이션s: Wired Communications, Data Center Acceleration, Radar and Electronic Warfare, Medical Imaging, Broadcast Video Processing, ASIC Prototyping.
Wired Communications
The XC7VX690T-2FFG1930I excels in wired communications infrastructure, particularly for 100G/400G line cards and network processors. Its 80 GTX transceivers operating at up to 12.5 Gbps provide the high-speed serial I/O needed for backplane and front-panel connectivity. The 693,120 logic cells enable complex packet processing, traffic management, and protocol acceleration. The device's 54,190,080 block RAM bits support large lookup tables and packet buffers, while the 3,600 DSP48E1 slices handle sophisticated signal processing for equalization and error correction. This combination makes it ideal for core routers, switches, and optical transport systems where high throughput and low latency are critical.
추천
Data Center Acceleration
In data center applications, the XC7VX690T-2FFG1930I provides massive parallel processing for workload acceleration, including database analytics, video transcoding, and AI inference. Its 693,120 logic cells and 3,600 DSP48E1 slices enable custom compute pipelines that offload intensive tasks from CPUs. The 80 GTX transceivers support high-bandwidth connectivity to host servers via PCIe and Ethernet. The device's partial reconfiguration capability allows dynamic updates to acceleration functions without downtime. With 1,000 user I/O pins, it can interface with multiple memory channels and custom accelerators. The 28nm HPL process balances performance and power, making it suitable for power-constrained data center environments.
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Radar and Electronic Warfare
The XC7VX690T-2FFG1930I is well-suited for radar and electronic warfare systems requiring real-time signal processing. Its 3,600 DSP48E1 slices deliver the multiply-accumulate throughput needed for beamforming, pulse compression, and Doppler processing. The 693,120 logic cells implement complex digital filters and FFT engines, while the 54,190,080 block RAM bits store large coefficient tables and intermediate results. The industrial temperature grade (-I) ensures reliable operation in harsh military environments. The device's 80 GTX transceivers support high-speed data links to sensor arrays and processing nodes. The 1,000 user I/O pins provide flexibility for interfacing with ADCs, DACs, and custom front-end electronics.
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Medical Imaging
The XC7VX690T-2FFG1930I enables advanced medical imaging systems such as CT scanners, MRI, and ultrasound. Its 693,120 logic cells and 3,600 DSP48E1 slices handle complex image reconstruction algorithms, including filtered back-projection and iterative reconstruction. The 54,190,080 block RAM bits support large image frame buffers and processing pipelines. The device's high I/O count (1,000 pins) interfaces with multiple high-speed ADCs and sensor arrays. The 80 GTX transceivers enable high-bandwidth data transfer to host workstations. The industrial temperature grade ensures reliable operation in clinical environments. The 28nm process provides the performance needed for real-time imaging while managing power dissipation in compact medical equipment.
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Broadcast Video Processing
The XC7VX690T-2FFG1930I is ideal for broadcast video processing, including 4K/8K format conversion, frame synchronization, and video compression. Its 693,120 logic cells implement complex video processing algorithms, while the 3,600 DSP48E1 slices handle color space conversion and filtering. The 54,190,080 block RAM bits provide ample storage for video line buffers and frame stores. The device's 80 GTX transceivers support SDI, HDMI, and IP video interfaces at high data rates. The 1,000 user I/O pins enable flexible interfacing with video codecs and external memory. The 28nm process delivers the performance required for real-time 8K processing while maintaining reasonable power consumption for broadcast equipment.
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ASIC Prototyping
The XC7VX690T-2FFG1930I serves as an excellent platform for ASIC prototyping, allowing designers to validate complex digital designs before committing to silicon. Its 693,120 logic cells provide sufficient capacity for prototyping large SoCs, while the 1,000 user I/O pins enable connection to external interfaces and test equipment. The 54,190,080 block RAM bits model on-chip memory hierarchies, and the 3,600 DSP48E1 slices emulate arithmetic units. The device supports multiple configuration modes and partial reconfiguration, enabling iterative design refinement. The 80 GTX transceivers allow prototyping of high-speed serial interfaces. The industrial temperature grade ensures reliable operation during extended verification sessions.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7VX690T-2FFG1930I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7VX690T-2FFG1930C | XC7VX690T-3FFG1930I | XC7VX485T-2FFG1930I | XC7VX565T-2FFG1930I | XC7VX895T-2FFG1930I |
|---|---|---|---|---|---|---|
| Package | 1924-BBGA, FCBGA (FFG1930) | 1924-BBGA, FCBGA (FFG1930) | 1924-BBGA, FCBGA (FFG1930) | 1924-BBGA, FCBGA (FFG1930) | 1924-BBGA, FCBGA (FFG1930) | 1924-BBGA, FCBGA (FFG1930) |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 693120 | 693120 | 693120 | 485760 | 566080 | 895040 |
| Block RAM (bits) | 54190080 | 54190080 | 54190080 | 37044096 | 43352064 | 69120000 |
| DSP48E1 Slices | 3600 | 3600 | 3600 | 2800 | 3200 | 3900 |
| User I/O | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| GTX Transceivers | 80 | 80 | 80 | 56 | 64 | 80 |
| Temperature Grade | Industrial (-40 to +100C) | Commercial (0 to +85C) | Industrial (-40 to +100C) | Industrial (-40 to +100C) | Industrial (-40 to +100C) | Industrial (-40 to +100C) |
주요 차별점
- Higher logic density than XC7VX485T (vs XC7VX485T-2FFG1930I)
- More DSP resources than XC7VX565T (vs XC7VX565T-2FFG1930I)
- Industrial temperature grade vs commercial (vs XC7VX690T-2FFG1930C)
설계 노트
The XC7VX690T-2FFG1930I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCBRAM at 1.0V. Use dedicated power planes with low impedance and place decoupling capacitors (100nF and 10uF) close to each power pin. The core current can exceed 10A under heavy utilization, so use a power supply with sufficient headroom and consider using multiple regulators in parallel for redundancy.
With 693,120 logic cells operating at high frequency, the XC7VX690T-2FFG1930I can dissipate significant power, potentially exceeding 30W. The FCBGA package requires a heatsink or active cooling solution. Ensure adequate airflow and consider using a thermal interface material with low thermal resistance. The industrial temperature grade allows operation up to +100C junction, but derating is recommended for long-term reliability.
The 1924-ball FCBGA package with 1.0mm pitch requires a high-layer-count PCB (16+ layers) for proper routing. Use controlled impedance traces for GTX transceivers (85 ohm differential) and ensure adequate ground vias for return current paths. Place the FPGA away from noisy components and use proper stack-up design to minimize crosstalk. Refer to AMD's PCB design guidelines (UG483) for detailed recommendations.
규정 준수 정보
RoHS compliant per distributor data. DRC Conflict Free status noted by Abacus Technologies.
