XC7Z035-2FFG676I - Zynq-7000 SoC, 275K LC, 800MHz | AMD
부품 번호: XC7Z035-2FFG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $234.75 | $234.75 |
| 10 | $228.5 | $2,285.00 |
| 100 | $219.9 | $21,990.00 |
| 500 | $210.25 | $105,125.00 |
| 1,000 | $202.4 | $202,400.00 |
XC7Z035-2FFG676I 개요
A Zynq-7000 SoC is a class of programmable system-on-chip devices that integrate a hardwired processor system (PS) with programmable logic (PL) on a single die. Unlike a standalone FPGA or a standalone microprocessor, a SoC FPGA allows software running on the ARM cores and hardware accelerators in the fabric to communicate over high-bandwidth on-chip AXI interconnect, making the device family a cornerstone of modern embedded processing and adaptive computing hierarchies.
Key features of the XC7Z035 include the mid-range 275K logic cell fabric, a -2 speed grade, and industrial temperature screening (the I suffix, typically -40C to +100C junction), making it suitable for harsh-environment deployments. The hard processor system offloads control-plane software while the fabric absorbs data-plane acceleration, math, and custom I/O.
Architecturally, the device pairs the ARM Cortex-A9 NEON/FPU-enabled cores with CoreSight debug, caches, on-chip memory, and a rich set of PS peripherals, bonded to Kintex-7-based programmable logic with DSP slices, block RAM, and high-speed serial transceivers. AXI ports bridge the two domains with low latency.
Typical applications include industrial automation and motor control, aerospace and defense processing, software-defined radio, video and image processing pipelines, and network packet processing where a soft processor would be too slow and a discrete CPU+FPGA pair too costly.
When designing with this device, plan power sequencing between VCCINT, VCCAUX, and PS rails, and select a Vivado device name matching the industrial speed-grade variant to avoid implementation errors.
This page synthesizes distributor pricing, verified same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: XC7Z035-2FFG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7Z035-1FFG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-2FFG676E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-2FBG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-1FBG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-1FFG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-L2FFG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z035-2FFG676I 최대 정격 & 전기적 특성
| Family | Zynq-7000 SoC |
| Processing System | Dual ARM Cortex-A9 MPCore with CoreSight |
| PS Maximum Frequency | 800 MHz |
| Programmable Logic Series | Kintex-7 based |
| Logic Cells | 275K |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I suffix) |
| 패키지 | 676-FCBGA (27x27 mm) |
| 실장 유형 | Surface Mount |
| Number of Logic Cells | 275000 |
| RoHS 상태 | Compliant (RoHs Code Yes per Avaq) |
XC7Z035-2FFG676I 676-fcbga (27x27 mm) 핀 구성 가이드
XC7Z035-2FFG676I(676-fcbga (27x27 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7Z035-2FFG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7Z035-2FFG676I 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Aerospace and Defense Processing, Software-Defined Radio (SDR), Video and Image Processing, Network and Packet Processing, Test, Measurement and Scientific Instrumentation.
Industrial Automation and Motor Control
The XC7Z035-2FFG676I fits industrial automation because its dual-core 800 MHz ARM Cortex-A9 processing system runs deterministic real-time control stacks such as EtherCAT, PROFINET, or EtherNet/IP, while the 275K logic cell fabric simultaneously implements multi-axis PWM generation, encoder interfaces, and safety interlocks with nanosecond-level latency. The industrial temperature grade (I suffix) qualifies the device for factory-floor cabinets and drive enclosures. In a typical topology, the PS handles the protocol stack and HMI web server in Linux, and the PL closes current loops in hardware at switching frequencies unattainable in software. The single-chip integration removes the discrete CPU+FPGA bridge, cutting BOM cost and board area, while AXI interconnect keeps control-to-fabric latency in the low hundreds of nanoseconds.
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Aerospace and Defense Processing
Aerospace and defense payloads favor the XC7Z035-2FFG676I because the hardened dual-core ARM Cortex-A9 PS with CoreSight provides certified-toolchain-friendly processing at 800 MHz, while the Kintex-7 class fabric absorbs sensor front-end processing, FFT beams, and encryption engines in the 275K logic cell fabric. Distributors such as ICC Power specifically position this MPN for aviation and defense supply. Typical usage places radar or image sensor data through GTX transceivers into fabric DSP pipelines, with the PS running telemetry, mode control, and health monitoring. The industrial screening and ECCN 3A991.D classification fit export-controlled high-reliability programs. Single-chip integration reduces SWaP (size, weight, and power) compared to discrete processor-plus-FPGA two-chip solutions in constrained airframe volumes.
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Software-Defined Radio (SDR)
In software-defined radio, the XC7Z035-2FFG676I is a natural fit: the fabric's DSP48-class slices and block RAM implement digital down-conversion, filtering, and channelization at multi-hundred-MSps rates, while the PS runs the MAC layer, network stack, and control plane on the 800 MHz Cortex-A9 cores. High-speed ADC/DAC data streams enter through GTX transceivers using JESD204B, avoiding the bottleneck of parallel LVDS routing. The -2 speed grade provides transceiver and fabric timing headroom for wideband designs, and the industrial grade supports outdoor radio units. Compared with a discrete FPGA plus host CPU architecture, the integrated AXI fabric-to-PS ports move baseband samples to software with microsecond-class latency, enabling closed-loop cognitive-radio and SIGINT applications in a single FCBGA-676 device.
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Video and Image Processing
The XC7Z035-2FFG676I suits video pipelines because the 275K logic cell fabric sustains real-time image scaling, lens distortion correction, HDR merge, and H.264 motion-estimation preprocessing at broadcast resolutions, while the dual Cortex-A9 cores run the camera control, streaming server, and analytics software at 800 MHz. MIPI, SubLVDS, or parallel sensor interfaces land directly on PL I/O banks, and GTX transceivers carry HDMI/SDI-class serial streams. Typical deployments include smart cameras, medical endoscopes, and machine-vision inspection stations where the industrial temperature grade and single-chip integration matter. Memory bandwidth is delivered through the PS DDR controller shared by PS and PL via high-throughput AXI ports. This removes the PCIe hop a discrete CPU-based vision system would otherwise require, cutting latency to the millisecond class.
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Network and Packet Processing
For networking line cards and embedded appliances, the XC7Z035-2FFG676I provides GTX transceivers for SFP+ class serial links into the fabric, where 275K logic cells implement parsing, classification, and traffic management in hardware, and the 800 MHz dual-core PS runs routing daemons, management planes, and security software. The AXI-to-PS high-throughput ports sustain line-rate handoff between hardware forwarding and software control, which a discrete FPGA plus external CPU cannot achieve without a PCIe or SRIO hop. The industrial grade supports extended-temperature telecom outdoor equipment, and the single-device architecture shortens packet-processing latency to the microsecond class, benefiting industrial Ethernet switches, 5G fronthaul units, and protocol converters where deterministic forwarding is a design requirement.
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Test, Measurement and Scientific Instrumentation
Instrument makers use the XC7Z035-2FFG676I because the fabric timestamps and preprocesses high-speed digitizer data in the 275K logic cell fabric while the 800 MHz Cortex-A9 cores run instrument UIs, SCPI command stacks, and Linux-based data logging on one chip. Typical usage puts ADC arrays on PL I/O banks, implements real-time triggering and averaging in fabric block RAM, and streams results to the PS over AXI DMA for network export. The industrial temperature grade supports bench-to-field deployment in environmental monitoring systems and factory test stations. The integrated architecture removes a host PC from compact instruments, and the -2 speed grade gives timing closure margin for wide capture paths, sustaining multi-channel gigasample-class front ends within the 676-ball FCBGA footprint.
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추천 제품 요약
엔지니어링 참조 데이터: XC7Z035-2FFG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7Z035-1FFG676I | XC7Z035-2FFG676E | XC7Z035-2FBG676I | XC7Z035-L2FFG676I |
|---|---|---|---|---|---|
| Package | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) - same | 676-FCBGA (27x27 mm) - same | 676-FCBGA (27x27 mm) - same | 676-FCBGA (27x27 mm) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 275K | 275K | 275K | 275K | 275K |
| PS Core | Dual ARM Cortex-A9, 800 MHz | Dual ARM Cortex-A9 | Dual ARM Cortex-A9, 800 MHz | Dual ARM Cortex-A9, 800 MHz | Dual ARM Cortex-A9 |
| Speed Grade | -2 | -1 | -2 | -2 | -2L (low power) |
| Temperature Grade | Industrial (I) | Industrial (I) | Extended (E) | Industrial (I) | Industrial (I) |
| Ball Metallurgy / Lead-Free Suffix | FFG (lead-free) | FFG (lead-free) | FFG (lead-free) | FBG (standard) | FFG (lead-free) |
| Primary Trade-off | Balanced performance and industrial screening | Lower cost, less timing headroom | Widest temperature range | Standard ball metallurgy | Lower static power |
주요 차별점
- Highest readily available speed grade for timing-critical designs (vs XC7Z035-1FFG676I)
- Industrial screening for harsh environments (vs XC7Z035-1FFG676C)
- Lead-free ball metallurgy (vs XC7Z035-2FBG676I)
- Balanced static power (vs XC7Z035-L2FFG676I)
설계 노트
A Zynq-7000 SoC in a 676-ball FCBGA requires multiple rails including VCCINT, VCCAUX, VCCBRAM, and PS-related supplies with defined power-up sequencing between the PS and PL domains. Consult the Zynq-7000 SoC datasheet power section and use the Xilinx Power Estimator (XPE) spreadsheet with your actual resource utilization and toggle rates - a 275K logic cell fabric heavily loaded with DSP pipelines can draw multi-watt core power, so size DC-DC converters with margin and verify inrush during configuration.
The 27x27 mm FCBGA-676 uses a ~1.0 mm ball pitch requiring fine-line PCB technology; plan for via-in-pad or dog-bone fanout on inner rows and define stackup before routing the DDR interface. Follow the UG865 package file for ball coordinates and the Zynq-7000 PCB design guide for DDR3 length matching. Decouple each power domain with bulk plus high-frequency ceramic capacitors placed on the underside of the BGA footprint to minimize loop inductance.
Select the correct Vivado part when targeting this MPN. Per AMD's adaptive support forum, users of industrial XC7Z035 units found the closest Vivado device is xc7z035iffg676-2L (with an extra L suffix); choosing a mismatched speed grade or temperature option causes bitstream validation failures. Also note the XC7Z035-L2FFG676I low-power variant has different static power and timing characteristics - never substitute it silently into a -2 design without re-running timing analysis.
Estimated: at 5 W total power dissipation and a typical FCBGA-676 junction-to-ambient resistance in the 10-20 C/W range (with airflow and board copper), junction temperature rise can reach 50-100 C above ambient. Since the I suffix indicates industrial screening, verify your worst-case ambient plus dissipation stays within the grade limit. Use a heatsink or airflow for sustained fabric utilization above a few watts, and confirm with the AMD thermal datasheet values rather than these estimates.
규정 준수 정보
Per Avaq comparison data: RoHs Code Yes, REACH Compliance Code compliant, ECCN 3A991.D, HTS 8542.39.00.01. FFG suffix indicates lead-free ball metallurgy versus FBG alternatives. Halogen-free and conflict-minerals status not stated in provided data.
