XCKU035-2FBVA676I - Kintex UltraScale FPGA, 444K Logic Cells | AMD
부품 번호: XCKU035-2FBVA676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $73.62 | $73.62 |
| 10 | $71.5 | $715.00 |
| 100 | $65.2 | $6,520.00 |
| 500 | $58.75 | $29,375.00 |
| 1,000 | $52.4 | $52,400.00 |
XCKU035-2FBVA676I 개요
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed post-manufacture to implement arbitrary digital functions. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically under digital semiconductors and ICs. The Kintex UltraScale family from AMD (formerly Xilinx) addresses the spectrum between cost-optimized Artix and high-end Virtex devices, focusing on DSP, memory bandwidth, and transceiver integration.
Key features of the XCKU035 include 312 maximum user I/Os, integrated DSP slices for high-throughput signal processing, dedicated block RAM (BRAM) for on-chip data storage, and high-speed serial transceivers suitable for chip-to-chip and backplane links. The device supports multiple configuration modes including JTAG, SPI, and BPI, enabling flexible boot strategies in production systems.
The Kintex UltraScale architecture leverages a 20nm planar process with stacked-silicon interconnect (SSI) options in larger family members. The XCKU035 uses monolithic silicon, providing predictable performance and lower cost. The UltraScale architecture introduces enhanced routing, multi-die clocking, and improved DSP and BRAM utilization rates over prior 7-Series FPGAs.
Typical applications of the XCKU035-2FBVA676I include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, video broadcast equipment, industrial machine vision, 100G network interface cards, and aerospace telemetry. Its combination of logic density, memory bandwidth, and transceivers makes it well-suited for prototyping ASICs or low-volume production.
When designing with the FBVA676 BGA, plan for high-density PCB fabrication with microvia or via-in-pad stackups, controlled-impedance traces for transceivers, and robust power distribution with high-frequency decoupling to satisfy simultaneous switching noise (SSN) requirements.
This page synthesizes distributor pricing, FPGA drop-in alternatives within the same 676-BGA footprint, and practical design notes not typically presented in the manufacturer datasheet.
드롭인 대체품: XCKU035-2FBVA676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XCKU035-2FBVA676I (동일 폼 팩터 및 풋프린트) — 차이점: Logic Cells.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCKU035-2FBVA676E
✅ 드롭인✓ 재고 있음
$390 / 개
데이터시트 보기 →XCKU035-1FBVA676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU035-3FBVA676E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU035-L1FBVA676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCKU035-2FBVA676I 최대 정격 & 전기적 특성
| Family | Kintex UltraScale |
| Logic Cells | 444,343 |
| Block RAM (bits) | 19,456,000 |
| Maximum User I/Os | 312 |
| 패키지 | 676-ball FCBGA (FBVA676) |
| Process Node | 20 nm |
| Speed Grade | -2 (mid) |
| Temperature Grade | Industrial |
| Configuration Interface | JTAG, SPI, BPI |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
XCKU035-2FBVA676I 676-ball fcbga (fbva676) 핀 구성 가이드
XCKU035-2FBVA676I(676-ball fcbga (fbva676) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XCKU035-2FBVA676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XCKU035-2FBVA676I 적합 용도: 7 애플리케이션s: Software Defined Radio (SDR) Baseband, High-Speed Data Acquisition Systems, Video Broadcast and Image Processing, Industrial Machine Vision, 100G Network Interface Cards, Aerospace Telemetry and Avionics, ASIC Prototyping and Emulation.
Software Defined Radio (SDR) Baseband
The XCKU035-2FBVA676I's 444,343 logic cells and 19,456,000 bits of block RAM make it well-suited for software defined radio baseband processing, including wideband digital downconversion, channelization, and modem PHY. Its integrated high-speed serial transceivers support chip-to-chip links to RF data converters and front-end modules. Compared with smaller FPGAs, the XCKU035-2LB3 provides headroom for multi-antenna MIMO and adaptive filtering algorithms without compromising real-time latency budgets.
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High-Speed Data Acquisition Systems
For data acquisition systems sampling multi-GSPS ADCs, the XCKU035-2FBVA676I provides the LUT count and DSP slice count needed for parallel FIR filtering, digital downconversion, and trigger logic. Its block RAM sustains wide capture bursts without dropping samples, while the 312 user I/Os can sink LVDS or DDR interfaces from multiple ADC banks. Industrial temperature rating allows deployment in factory-floor or outdoor instrumentation without additional thermal conditioning.
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Video Broadcast and Image Processing
The XCKU035-2FBVA676I's high block RAM bandwidth and abundant DSP slices are advantageous for video broadcast equipment, including 4K/UHD up/down/cross-conversion, motion-adaptive deinterlacing, and real-time image processing pipelines. Its 312 user I/Os accept parallel video buses or high-speed serial links to video codecs. Industrial temperature rating supports broadcast hardware deployed in unconditioned head-end enclosures.
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Industrial Machine Vision
For industrial machine vision, the XCKU035-2FBVA676I hosts multi-camera ISP pipelines, defect-detection inference accelerators, and high-bandwidth sensor aggregation. Its logic density supports simultaneous pipelines at line-scan rates of multiple CoaXPress or GigE Vision feeds, while the block RAM acts as frame-buffer memory to smooth throughput to downstream processors. Industrial temperature rating ensures reliable operation on factory floors with wide thermal swings.
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100G Network Interface Cards
Network interface cards targeting 100G Ethernet and OTN applications leverage the XCKU035-2FBVA676I's high-speed transceivers and logic density to implement MAC, PCS, and traffic management at line rate. The 676-ball BGA provides the pin count required for multiple QSFP28 cages plus host PCIe Gen3 x8 interfaces. Industrial temperature grade extends the card's reach to outdoor and edge-computing installations.
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Aerospace Telemetry and Avionics
Aerospace telemetry and avionics benefit from the XCKU035-2FBVA676I's industrial temperature range, abundant logic and DSP slices for telemetry encoders, and high-speed serial links for ARINC 818 or SpaceWire bridging. The device's maturity in the AMD Kintex UltraScale family, combined with documented available pin assignments for the FBVA676 package, simplifies radiation-tolerant board design when paired with appropriate power and watchdog circuitry.
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ASIC Prototyping and Emulation
ASIC prototyping and emulation systems use the XCKU035-2FBVA676I's 444K logic cells as building blocks for multi-FPGA partition-and-route of large SoC designs. Its block RAM and DSP count enable fair benchmarking of memory subsystems and DSP-heavy IPs, while the FBGA676 footprint allows homogeneous multi-FPGA boards with shared power and clock trees. Compared with smaller FPGAs, the XCKU035-2FBVA676I offers a compelling cost-per-logic-cell for prototype volume builds.
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추천 제품 요약
엔지니어링 참조 데이터: XCKU035-2FBVA676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCKU035-2FBVA676E | XCKU035-1FBVA676I | XCKU035-3FBVA676E | XCKU035-L1FBVA676I |
|---|---|---|---|---|---|
| Package | 676-ball FCBGA (FBVA676) | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same | 676-ball FCBGA (FBVA676) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 444,343 | 444,343 | 444,343 | 444,343 | 444,343 |
| Block RAM (bits) | 19,456,000 | 19,456,000 | 19,456,000 | 19,456,000 | 19,456,000 |
| Maximum User I/Os | 312 | 312 | 312 | 312 | 312 |
| Speed Grade | -2 (mid) | -2 (mid) | -1 (low) | -3 (high) | -1 (low) |
| Temperature Grade | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| Static Power Tier | Standard | Standard | Standard | Standard | Low static (L1) |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
주요 차별점
- Industrial temperature grade in the same FBVA676 footprint (vs XCKU035-2FBVA676E)
- Mid-range speed grade balances Fmax and dynamic power (vs XCKU035-3FBVA676E)
- Standard static-power profile for predictable thermal planning (vs XCKU035-L1FBVA676I)
설계 노트
The FBVA676 676-ball FCBGA package requires high-density PCB fabrication with microvia or stacked-via stackups, since the 1.0 mm ball pitch exceeds the reach of standard through-hole vias from outer layers. Plan for via-in-pad with epoxy-filled, planarized pad surfaces to prevent solder joint voids and to enable clean ball-attach rework. Reference AMD's Kintex UltraScale packaging and PCB design guidelines UG575 for escape routing and layer stackup recommendations.
Estimated: at full utilization (444K logic cells, 100% toggle rate, -2 speed grade), the XCKU035-2FBVA676I can dissipate 8-15 W depending on clock frequency and activity factor. The FCBGA package is rated for theta_JA in the range of 8-15 C/W with a properly designed thermal pad array and 4-layer PCB with inner copper planes. Provide a thermal via array under the package center thermal pad and consider a small heatsink or heat spreader for sustained workloads above 70% utilization in industrial-temperature environments.
The XCKU035-2FBVA676I requires multiple supply rails: VCCINT (core), VCCAUX, VCCO (I/O banks), VCCBRAM, and MGTAVCC for transceivers. Each rail must ramp in a manufacturer-mandated sequence; use a dedicated supervisor or FPGA power sequencer such as the TPS3808 family to enforce monotonic power-up. Add bulk decoupling (typically 220 uF low-ESR polymer) at each supply pin group and high-frequency 0.1 uF + 0.01 uF ceramic decoupling at every VCC pin to mitigate simultaneous switching noise (SSN).
High-speed serial transceiver lanes require controlled-impedance differential routing (typically 85 ohm / 100 ohm differential) with continuous reference planes and minimal via transitions. Keep AC-coupling capacitors close to the FPGA transmit pins, and verify length matching within the transceiver's lane-to-lane skew budget. Reference AMD's transceiver user guide UG576 for eye-mask compliance and PCB stackup recommendations before final layout.
Common pitfalls when designing with the XCKU035-2FBVA676I include: (1) failing to allocate sufficient configuration time in the system boot sequence (SPI flash with correct density and Quad SPI mode is recommended), (2) ignoring bank voltage compatibility when mixing 1.8 V and 3.3 V I/O standards on the same bank, and (3) under-sizing the parallel configuration flash, which causes bitstream compression failures during partial reconfiguration. Always verify the final bitstream size against the configuration memory capacity before taping out the PCB.
규정 준수 정보
RoHS and REACH compliance inferred from AMD Kintex UltraScale family product page statements. AEC-Q100 not applicable to FPGAs. Lead-free BGA confirmed per AMD packaging specifications.
