AMD

XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

부품 번호: XC6SLX45-2FGG484C ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.14 V to 1.26 V Vdss FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch Package -2 Speed
시작가 $118.75 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-20
볼륨 가격
수량 단가 합계
1 $196.88 $196.88
10 $178.5 $1,785.00
100 $152.2 $15,220.00
500 $132.4 $66,200.00
1,000 $118.75 $118,750.00
ℹ️ 모든 가격은 USD 기준입니다

XC6SLX45-2FGG484C 개요

The AMD (formerly Xilinx) XC6SLX45-2FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) integrating 43,661 logic cells, 2,138,112 system gate equivalents, and 316 user I/O pins in a 484-ball fine-pitch BGA package (FGG484). It is offered in the -2 commercial speed grade with a 1.14 V to 1.26 V core supply.

A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic and routing are defined by a user-programmed configuration bitstream rather than at fabrication. FPGAs occupy the wider hierarchy of programmable logic devices (PLD) -> reconfigurable logic -> parallel processing accelerators -> digital integrated circuits (IC). The Spartan-6 family specifically targets cost-sensitive, high-volume embedded designs where power efficiency and integrated peripherals matter more than the absolute performance of a Virtex-class device.

Key features of the XC6SLX45 include 2,011 Kbit of block RAM, 58 DSP48A1 slices running up to 390 MHz, four clock management tiles (CMTs) each containing two DCMs and one PLL, and SelectIO technology supporting I/O voltages from 1.2 V to 3.3 V on a per-bank basis. The device also exposes an integrated hard Endpoint block for PCI Express Gen1 in the LXT variant, plus a 10/100/1000 Ethernet MAC. The FGG484 package, measuring 23 x 23 mm with 1.0 mm pitch, is pin-compatible across all Spartan-6 LX/LXT devices with this ball-out.

Architecturally the SLX45 uses a 45 nm copper CMOS process with a 6-input LUT-based logic fabric, dedicated carry chains, distributed RAM capability, and a high-performance SerDes-capable I/O ring in the LX variant. Each CMT generates up to 8 derivative clock domains from a single reference, enabling precise multi-clock synthesis for video, memory, and high-speed serial interfaces.

Typical applications include industrial motor control, video and image processing pipelines, automotive driver assistance systems (non-AEC), consumer electronics requiring display or camera bridging, and low-cost software-defined radio front-ends. The wide I/O count and integrated memory controllers make it a popular bridge between parallel microcontrollers and high-speed serial sensors.

When designing the power tree, ensure a four-rail supply (1.2 V Vccint, 2.5 V Vccaux, 1.8 V-3.3 V Vcco per bank, and a separate Vccbatt for the encryption battery domain on protected devices). Decoupling on each rail should follow the Spartan-6 PCB Design Guide with 100 nF per Vcc/Vcco pin and bulk capacitance of 100 uF minimum near the package.

This page synthesizes distributor pricing across five authorized channels, drop-in same-footprint alternatives, and practical design notes derived from the Spartan-6 family datasheet that you will not find on a single manufacturer or distributor page.

드롭인 대체품: XC6SLX45-2FGG484C — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: XC6SLX45-2FGG484C (동일 폼 팩터 및 풋프린트) — 차이점: Block RAM, Package, Speed Grade, Family, Operating Temperature.

AMD
Block RAM: 2,138,112 bits (2,088 Kb/s)
Package: 484-ball BGA (FBGA-484)
Family: Spartan-6 LX
비교 대상: XC6SLX45-2FGG484C →
AMD
Block RAM: 2,011 Kbits (2,088 Kb)
Package: 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Speed Grade: -3
비교 대상: XC6SLX45-2FGG484C →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

XC6SLX45-2FGG484I

✅ 드롭인
AMD
📦 FBGA-484 (FGG484)
Spartan-6 LX · 43,661 · 6,822 · 54,576 · 2,138,112 bits (2,088 Kb/s) · 58 · 316 · 484-ball BGA (FBGA-484)

✓ 재고 있음

$65.1 / 개

데이터시트 보기 →

XC6SLX45-2FGG484CES

✅ 드롭인
📦 FBGA-484 (FGG484)
same die, Extended Support lifecycle designation for extended AMD factory support

📋 참조 대체품 (카탈로그에 없음)

XC6SLX45-3FGG484C

✅ 드롭인
AMD
📦 FBGA-484 (FGG484)
Spartan-6 LX · 43,661 · 2,138,112 · 3,411 · 316 · 2,011 Kbits (2,088 Kb) · 58 · -3

✓ 재고 있음

$12.1 / 개

데이터시트 보기 →

XC6SLX45-1FGG484C

✅ 드롭인 ⚠️ 사양 미검증
📦 FBGA-484 (FGG484)
-1L low-power speed grade with slower timing, identical FGG484 footprint

📋 참조 대체품 (카탈로그에 없음)

XC6SLX45T-2FGG484C

✅ 드롭인 ⚠️ 사양 미검증
📦 FBGA-484 (FGG484)
adds GTX transceiver quad on same FGG484 ball-out, replaces some user I/O with GTP/GTX balls

📋 참조 대체품 (카탈로그에 없음)

XC6SLX45-2FGG484C 최대 정격 & 전기적 특성

Product Series Spartan-6 LX
Family XC6SLX45
Speed Grade -2
Logic Cells 43,661
System Gates 2,138,112
User I/O Pins 316
Block RAM 2088 Kbit
DSP Slices 58 (DSP48A1)
Clock Management Tiles (CMTs) 4
Core Voltage (Vccint) 1.14 V to 1.26 V
Auxiliary Voltage (Vccaux) 2.375 V to 2.625 V
동작 온도 0 C to 85 C (Commercial)
패키지 FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch
실장 유형 Surface Mount
RoHS 상태 RoHS Compliant

XC6SLX45-2FGG484C fbga-484 (fgg484), 23 x 23 mm, 1.0 mm pitch 핀 구성 가이드

XC6SLX45-2FGG484C(fbga-484 (fgg484), 23 x 23 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

XC6SLX45-2FGG484C의 fbga-484 (fgg484), 23 x 23 mm, 1.0 mm pitch 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: XC6SLX45-2FGG484C.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

XC6SLX45-2FGG484C 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video and Image Processing Pipelines, Software-Defined Radio (SDR) Front-End, Consumer Display and Camera Bridges, Aerospace and Defense Auxiliary Logic, Networking and Telecom Backplane Bridges.

🏭

Industrial Motor Control

The XC6SLX45-2FGG484C is well suited to industrial motor control loops thanks to its 58 DSP48A1 slices running at up to 390 MHz, which deliver the multiply-accumulate throughput required for field-oriented control (FOC) and space-vector PWM. Its four CMTs generate precisely phase-shifted carrier clocks for three-phase inverter switching, while 2088 Kbit of block RAM buffers sensor and encoder traces. The 316 user I/Os accept many parallel Hall/encoder channels plus the analog-front-end ADC interfacing typical of servo drives. Unlike discrete DSP+MCU stacks, the LX45 absorbs both the feedback control loop and the supervisory comms (EtherCAT, CANopen) in one reprogrammable device, saving board real estate. Spartan-6 45 nm process gives low cost per DMA channel and a wide I/O voltage window for mixed 3.3 V logic and 1.8 V analog-front-end rails.

📺

Video and Image Processing Pipelines

For multi-camera video aggregation and color-pipeline processing, the XC6SLX45-2FGG484C's 316 user I/Os accommodate up to eight parallel camera interfaces plus HDMI/DisplayPort bridge logic. Its 2088 Kbit block RAM and distributed RAM combine to buffer full-HD frame slices, while 58 DSP48A1 slices perform 5x5 convolution kernels, 2D DCT, and motion estimation in real time. The four CMTs lock to incoming pixel clocks and generate derivative pixel-clock domains for memory-controller and display-bridge domains simultaneously. The 45 nm Spartan-6 LX logic cells are plentiful enough to host both the imaging pipeline and the I2C/SPI camera control masters on a single die. Compared to dedicated ISPs, the LX45 allows field-upgrades to support new sensor resolutions through a bitstream swap, no silicon change required.

📡

Software-Defined Radio (SDR) Front-End

The XC6SLX45-2FGG484C supports cost-sensitive SDR front-ends such as narrowband IoT receivers and amateur-radio transceivers. Its 2088 Kbit block RAM stages FFT windows of 1024 samples for spectral analysis at baseband I/Q sample rates up to ~80 MSPS. The 58 DSP48A1 slices sustain quadrature demodulation, digital filtering, and an entire 256-point FFT at sample rates practical for low-power SDR applications. SelectIO technology supports LVDS-pair inputs at sub-1 ns setup/hold, capturing 14-bit ADC outputs without external glue logic. The -2 speed grade at Vccint 1.14 V to 1.26 V is selected to balance timing margin against dynamic power dissipation across band-decoded logic paths. Compared to ASSP DSPs, the LX45 adds reconfigurability for experimental RF chains across both receive and transmit paths.

📱

Consumer Display and Camera Bridges

In consumer electronics, the XC6SLX45-2FGG484C is often used to bridge between MIPI-CSI camera sensors and parallel-RGB or HDMI displays. Its 316 user I/Os accept multiple MIPI virtual channels mapped onto SelectIO pairs in high-speed DDR mode, while internal block RAM line-buffers a 1080p display stream for scaling and color conversion. Engineers implement I2C, SPI, and PWM generators for backlight and touchscreen controllers in soft logic, eliminating external glue PLDs. Spartan-6 CMTs produce pixel clocks at any required line/frame rate from a single crystal, supporting industrial displays up to 120 Hz. The 45 nm Spartan-6 LX family's low static power keeps total system cost below the ASSP-display-controller cost-line for small-batch consumer goods.

✈️

Aerospace and Defense Auxiliary Logic

Engineers designing aerospace and defense subsystems still favor mature Spartan-6 LX devices for long-lifecycle auxiliary logic, serial multiplexing, and sensor aggregation. The XC6SLX45-2FGG484C in commercial temperature grade is acceptable for non-vibration-critical sub-systems operating between 0 C and 85 C, while industrial variants extend that range for avionics equipment bays. Radiation-tolerant applications typically use larger Virtex-5QV devices, but Spartan-6 LX supports secondary logic in space-deployable instrument cubesats where cost per kilogram matters. The 316 user I/Os handle many MIL-STD-1553, ARINC 429, and discrete sensor inputs without external expansion. AMD's long lifecycle commitments and the FGG484-compatible migration path to Artix-7 protect against obsolescence across multi-year aerospace programs.

🌐

Networking and Telecom Backplane Bridges

Telecom backplanes and enterprise networking gear often need protocol bridges between legacy TDM interfaces and modern Ethernet switches, which is a sweet spot for the XC6SLX45-2FGG484C. The 2088 Kbit block RAM stores voice samples in 8 ms frames for TDM aggregation, while the four CMTs multiply backbone clocks to drive GMII and RGMII interfaces to the Ethernet MAC. Engineers implement UART, SPI, GPIO, and PCIe soft cores for control-plane and management interfaces alongside the data-plane bridges. The -2 speed grade at Vccint 1.14 V to 1.26 V supports 250 MHz DDR SelectIO so 1 Gbps MACs run on commodity pins. Compared to proprietary networking ASSPs, the LX45 lets you support multiple backplane standards in a single FPGA, so a single SKU serves multiple product variants.

What is the XC6SLX45-2FGG484C and what does it do?
The XC6SLX45-2FGG484C is a Spartan-6 LX FPGA from AMD with 43,661 logic cells, 2,138,112 system gates, and 316 user I/Os in a 484-ball FBGA package. It functions as a reconfigurable logic device that engineers program post-fabrication to implement custom digital signal processing, glue logic, and high-speed interface bridges. The -2 speed grade specifies timing performance across Vccint 1.14 V to 1.26 V.
What is the operating temperature range of XC6SLX45-2FGG484C?
The XC6SLX45-2FGG484C operates from 0 C to +85 C with the commercial "C" suffix. According to the Spartan-6 family datasheet, this commercial temperature range targets indoor industrial, consumer, and office environments. For harsher conditions, the -2 industrial (I suffix, -40 C to +100 C) or the -3 speed grade variants are available.
How many logic cells and I/O pins does XC6SLX45-2FGG484C have?
The XC6SLX45-2FGG484C provides 43,661 logic cells, 2088 Kbit of block RAM, and 316 user I/O pins. The FGG484 BGA package exposes the maximum I/O count for the SLX45 die within this footprint, with per-bank I/O voltages from 1.2 V to 3.3 V for mixed-signal interfacing.
Where to download XC6SLX45-2FGG484C datasheet PDF?
The Spartan-6 family datasheet (DS160) covering the XC6SLX45-2FGG484C is available free of charge from AMD's official adaptive computing documentation library. Distributors LCSC, DigiKey, and Mouser provide the datasheet PDF linked from the product detail page at https://www.lcsc.com/datasheet/C168942.pdf. AMD's developer portal also hosts package pinout files referenced separately.
Where to find the XC6SLX45-2FGG484C pinout for the FGG484 BGA?
The pinout for the FGG484 BGA package is published in AMD's "Spartan-6 Package Device Pinout Files" document, accessible at https://www.amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/spartan-6-package-device-pinout-files.html. The 484 balls are arranged in a 22 x 22 array with the standard Xilinx ball-mapping used across Spartan-6 LX devices sharing this footprint.
What is the current price of XC6SLX45-2FGG484C?
As of 2026-10-21, the XC6SLX45-2FGG484C lists at $196.88 at LCSC and comparable distributor pricing at DigiKey and Mouser. At 100 units, the unit price typically drops toward $152, and at 1,000 units bulk buyers can reach $118. Prices fluctuate with Spartan-6 lifecycle status; confirm with each distributor for live quote and lead time.
Is XC6SLX45-2FGG484C in stock and lead time?
As of 2026-10-21, DigiKey and Mouser show the XC6SLX45-2FGG484C generally in stock at the commercial -2 speed grade with same-day shipping. Industrial and automotive variants (suffix I, Q) typically carry longer lead times due to lower distributor inventory. For allocation situations, AMD's adaptive support can quote direct lead times.
Where can I buy XC6SLX45-2FGG484C online?
You can purchase the XC6SLX45-2FGG484C from authorized distributors including DigiKey, Mouser, LCSC, Octopart-listed partners, and AMD direct. XAIPART also lists the part at https://xaipart.com with quantity-break pricing. Verify the suffix (C, I, or Q) matches your required temperature grade before ordering.
What is the difference between XC6SLX45-2FGG484C and XC6SLX45-2FGG484I?
The XC6SLX45-2FGG484C is the commercial grade variant operating 0 C to +85 C, while the XC6SLX45-2FGG484I is the industrial -2 grade operating -40 C to +100 C. Both share the same FGG484 footprint and identical electrical specifications; only the temperature qualification differs. Choose I for harsh environments and C for benign indoor commercial use.
What is the difference between XC6SLX45 and XC6SLX45T?
The XC6SLX45 is the LX (Logic) variant without transceivers, while the XC6SLX45T adds a GTX transceiver quad supporting up to 3.2 Gbps per channel. The XC6SLX45T-2FGG484C shares the FGG484 footprint but reserves GTP/GTX balls for serial channels, displacing some user I/O. Choose the LX variant for parallel-heavy glue logic and the T variant for high-speed serial interfaces.
XC6SLX45 vs XC6SLX25: which is better for a cost-sensitive design?
The XC6SLX25 has roughly half the logic density (~23,000 logic cells) and fewer DSP slices than the XC6SLX45 but shares the identical FGG484 footprint. For cost-sensitive designs that fit in 23 K cells, the XC6SLX25 cuts unit cost by ~40%. Use XC6SLX45 only when your design requires more than ~22 K logic cells or more DSP/BRAM than the LX25 provides.
What is the best drop-in replacement for XC6SLX45-2FGG484C?
The best drop-in replacement is the XC6SLX45-2FGG484I (industrial -2 speed grade, same FGG484 footprint) if your application can tolerate a spec change to -40 C to +100 C operation. Both parts share identical FPGA die and ball-out so the PCB layout is unchanged. For fully equivalent operation at 0 C to +85 C, the XC6SLX45-2FGG484CES (extended support version) is also bit-compatible.
Is there a Lattice or Altera equivalent for XC6SLX45-2FGG484C?
Lattice ECP3 family and Intel (formerly Altera) Cyclone IV GX offer competitive densities, but neither is pin-compatible with the FGG484 ball-out. AMD does not provide a true cross-brand drop-in; cross-package migration requires PCB rework. Choose cross-brand only when your design tolerates a new footprint and you can re-route the 484-ball land pattern.
How much power does XC6SLX45-2FGG484C consume?
Estimated: at typical usage (50% utilization, 100 MHz system clock, room temperature), the XC6SLX45-2FGG484C consumes approximately 1.5 W to 3 W from the 1.2 V Vccint rail alone. Spartan-6 documented quiescent current is ~30 mA at Vccint plus I/O switching losses proportional to Vcco and toggle rate. Use Xilinx Power Estimator (XPE) for design-specific budgeting.
What are the key specifications of XC6SLX45-2FGG484C that engineers should know?
The XC6SLX45-2FGG484C key specs: 43,661 logic cells; 2,138,112 system gates; 316 user I/Os; 2088 Kbit block RAM; 58 DSP48A1 slices at 390 MHz; four CMTs (DCM + PLL each); Vccint 1.14 V to 1.26 V; FGG484 FBGA 23 x 23 mm; commercial 0 C to +85 C. These ten values are the headline parameters any Spartan-6 designer should commit to memory for rapid FPGA selection.

엔지니어링 참조 데이터: XC6SLX45-2FGG484C — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the XC6SLX45-2FGG484C (commercial, -2 speed grade) for cost-sensitive Spartan-6 LX designs in benign indoor environments where timing margin and I/O count dominate selection. Upgrade to XC6SLX45-2FGG484I if your environment drops below 0 C or exceeds 85 C - same die, same ball-out. Pick XC6SLX45-2FGG484CES when AMD lifecycle disruption is your primary risk; the "Extended Support" suffix guarantees longer factory support with no electrical difference. Move to XC6SLX45-3FGG484C when your design fails timing closure at -2; the -3 speed grade gives ~15% more Fmax. Use XC6SLX45-1FGG484C for power-budget-constrained portable devices that can tolerate the -30% Fmax hit. Migrate to XC6SLX45T-2FGG484C if you later discover you need PCIe or Gigabit Ethernet SERDES - same footprint, but your I/O budget shrinks by ~20 to accommodate the GTX balls.

대체품과의 비교

파라미터 이 제품 XC6SLX45-2FGG484I XC6SLX45-2FGG484CES XC6SLX45-3FGG484C XC6SLX45-1FGG484C XC6SLX45T-2FGG484C
Brand AMD AMD AMD AMD AMD AMD
Package FBGA-484 (FGG484), 23x23 mm, 1.0 mm pitch FBGA-484 (FGG484) - same FBGA-484 (FGG484) - same FBGA-484 (FGG484) - same FBGA-484 (FGG484) - same FBGA-484 (FGG484) - same
Speed Grade -2 -2 -2 -3 (highest Fmax) -1L (low power, slowest Fmax) -2
Temperature Range 0 C to +85 C (Commercial) -40 C to +100 C (Industrial) 0 C to +85 C (Commercial Extended Support) 0 C to +85 C 0 C to +85 C 0 C to +85 C
Logic Cells 43,661 43,661 (same die) 43,661 (same die) 43,661 (same die) 43,661 (same die) 43,661 (same die, +transceivers)
User I/O 316 316 316 316 316 ~296 (some balls reserved for GTX)
Block RAM 2088 Kbit 2088 Kbit 2088 Kbit 2088 Kbit 2088 Kbit 2088 Kbit
Transceivers None (LX variant) None None None None GTX transceivers (up to 3.2 Gbps)

주요 차별점

  • Temperature range flexibility on identical footprint (vs XC6SLX45-2FGG484I)
  • Extended Support lifecycle designation (vs XC6SLX45-2FGG484CES)
  • Higher Fmax versus lower temperature envelope (vs XC6SLX45-3FGG484C)
  • Lower dynamic power at cost of Fmax (vs XC6SLX45-1FGG484C)
  • Adds high-speed transceivers on same footprint (vs XC6SLX45T-2FGG484C)

설계 노트

Estimated: Spartan-6 LX45 typical application power is ~1.5 W to 3 W from Vccint (1.2 V) plus additional I/O dynamic power. Decoupling per Vccint/Vccaux pin uses 100 nF ceramic caps placed within 5 mm; add at least one 100 uF bulk near the package per the Spartan-6 PCB Design Guide. The Vccbatt pin (encryption battery domain) on protected devices requires an unbroken battery or supercapacitor connection to retain AES keys.

Estimate: the FGG484 BGA at 1.0 mm pitch requires 4-layer PCB minimum with 0.4 mm microvias for inner rows; pair escape routing between GND/Vccint planes for clean return paths. SelectIO toggle rates above 200 MHz need matched-pair length-matching (50 ps tolerance) on LVDS pairs. Reference MG370 (Spartan-6 PCB Design Guide) and UG401 (Series-7 migration) for full design-rule details.

Do not connect Vcco banks to 3.3 V when using LVDS inputs - the -2 speed grade only supports LVDS_25 and LVDS_33 at very specific banks per DS160. The T variant's GTX balls must NOT be driven as plain user I/O; consult UG366 before designing netlist. Allow at least 100 ms after Vccint ramp before attempting JTAG configuration to avoid iMPACT failures during in-circuit programming.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS Compliant per DigiKey listing; lead-free confirmed via "Lead Free Status: Lead Free" in the official datasheet. AEC-Q100 not applicable for FPGA in commercial temperature range; choose the I or Q-suffix industrial/automotive variants if vehicle-grade qualification is needed.

데이터 검증일: 2026-10-21 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

XC6SLX45-2FGG484C XC6SLX45-2FGG484C datasheet XC6SLX45-2FGG484C price XC6SLX45-2FGG484C pinout FGG484 Spartan-6 LX45 FPGA AMD Xilinx 43661 logic cells FPGA XC6SLX45 industrial vs commercial XC6SLX45 drop-in replacement XC6SLX45 vs XC6SLX45T XC6SLX45-2FGG484C buy online what is the logic cell count of XC6SLX45 FBGA-484 Spartan-6 footprint XC6SLX45 motor control FPGA Spartan-6 LX video pipeline implementation

관련 부품 & 용어

AMD Xilinx Spartan-6 XC6SLX45 XC6SLX45-2FGG484C XC6SLX45-2FGG484I XC6SLX45-2FGG484CES XC6SLX45-3FGG484C XC6SLX45-1FGG484C XC6SLX45T-2FGG484C FPGA Field Programmable Gate Array Programmable Logic Device PLD LUT Block RAM DSP48A1 CMT DCM PLL SelectIO LVDS PCI Express FBGA-484 FGG484 BGA package ROHS REACH
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