XCZU3EG-1UBVA530E - Zynq UltraScale+ SoC FPGA | AMD
부품 번호: XCZU3EG-1UBVA530E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $149.99 | $149.99 |
| 10 | $135 | $1,350.00 |
| 100 | $120 | $12,000.00 |
| 500 | $110 | $55,000.00 |
| 1,000 | $100 | $100,000.00 |
XCZU3EG-1UBVA530E 개요
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a multi-core ARM processing system (PS) with FPGA programmable logic (PL) on a single die. This architecture allows designers to implement complex algorithms in hardware for high throughput and low latency while running operating systems and control software on the ARM cores. The PS and PL are connected via high-bandwidth AXI interfaces, enabling efficient data movement between software and hardware.
Key features of the XCZU3EG-1UBVA530E include 154K+ logic cells, a 500 MHz maximum PL clock frequency, and a 1.2 GHz maximum PS clock frequency. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The UltraScale+ architecture provides advanced power management and security features, making it suitable for a variety of applications.
The XCZU3EG-1UBVA530E is part of the Zynq UltraScale+ family, which offers scalability from the ZU2 to ZU19 devices. This specific variant, the EG (embedded graphics) class, includes a Mali-400 GPU for graphics and video processing. The device is manufactured using a 16nm process, providing a balance of performance and power efficiency.
Typical applications for the XCZU3EG-1UBVA530E include software-defined radio, machine vision, industrial automation, and aerospace and defense systems. The combination of ARM cores and FPGA fabric makes it ideal for applications that require real-time processing, high-speed data acquisition, and flexible I/O.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO, etc.) must be powered up in the correct order to prevent damage. Use the AMD power management reference design and follow the guidelines in the Zynq UltraScale+ Technical Reference Manual (UG1085) for reliable operation.
드롭인 대체품: XCZU3EG-1UBVA530E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU3EG-2UBVA530E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU3EG-1UBVA530I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU3EV-1UBVA530E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU3CG-1UBVA530E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU2EG-1UBVA530E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU3EG-1UBVA530E 최대 정격 & 전기적 특성
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 1.2 GHz (PS) |
| Programmable Logic Clock Speed | 500 MHz (PL) |
| Logic Cells | 154K+ |
| 패키지 | 530-FCBGA (16x9.5 mm) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Series | Zynq UltraScale+ MPSoC |
| Speed Grade | -1 |
| Core Architecture | ARM Cortex-A53, ARM Cortex-R5 |
XCZU3EG-1UBVA530E 핀 구성
| 핀 A1 | VCCINT — Internal core supply voltage |
| 핀 A2 | GND — Ground |
| 핀 B1 | VCCO_0 — I/O bank 0 supply voltage |
| 핀 C1 | IO_L1P_T0 — Differential I/O pair, positive |
| 핀 C2 | IO_L1N_T0 — Differential I/O pair, negative |
| 핀 D1 | MIO[0] — Multiplexed I/O pin 0 |
| 핀 E1 | PS_CLK — PS reference clock input |
| 핀 F1 | PS_POR_B — PS power-on reset, active low |
| 핀 G1 | PS_SRST_B — PS system reset, active low |
| 핀 H1 | DDR_ACT_N — DDR4 activate command |
| 핀 J1 | DDR_A[0] — DDR4 address bit 0 |
| 핀 K1 | DDR_DQ[0] — DDR4 data bit 0 |
일반적인 애플리케이션
XCZU3EG-1UBVA530E 적합 용도: 6 애플리케이션s: Software-Defined Radio, Machine Vision, Industrial Automation, Aerospace and Defense, Data Center Acceleration, Medical Imaging.
Software-Defined Radio
The XCZU3EG-1UBVA530E is ideal for software-defined radio (SDR) systems. The quad-core ARM Cortex-A53 can handle control and protocol processing, while the FPGA fabric implements high-speed digital down/up conversion, filtering, and modulation. The 154K+ logic cells provide ample resources for complex signal processing chains. The high-speed transceivers enable direct connection to RF front-ends, and the 1.2 GHz PS clock ensures real-time performance. This SoC allows for a flexible, reconfigurable SDR platform that can adapt to different waveforms and standards.
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Machine Vision
In machine vision applications, the XCZU3EG-1UBVA530E excels by combining ARM cores for algorithm control and FPGA fabric for high-speed image processing. The programmable logic can implement pixel-level operations, such as filtering and edge detection, at high throughput. The 500 MHz PL clock and 154K+ logic cells enable real-time video processing. The device supports multiple camera interfaces via its flexible I/O, and the Mali-400 GPU can accelerate image processing tasks. This makes it suitable for industrial inspection, robotics, and autonomous systems.
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Industrial Automation
The XCZU3EG-1UBVA530E is well-suited for industrial automation, where it can serve as a central controller for robotics, PLCs, and motion control. The dual-core ARM Cortex-R5 provides real-time processing for deterministic control loops, while the Cortex-A53 runs the main application and HMI. The FPGA fabric can implement custom communication protocols, such as EtherCAT or PROFINET, with low latency. The device's robust I/O and industrial temperature options make it reliable in harsh environments. This SoC enables a single-chip solution for complex automation tasks.
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Aerospace and Defense
For aerospace and defense applications, the XCZU3EG-1UBVA530E offers a secure and reliable processing platform. The ARM cores can run safety-critical software, while the FPGA fabric implements custom signal processing and encryption. The device supports secure boot and bitstream encryption, protecting intellectual property. The 530-FCBGA package is suitable for ruggedized boards, and the device can operate over extended temperature ranges. This SoC is used in radar, electronic warfare, and avionics systems where performance and security are paramount.
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Data Center Acceleration
The XCZU3EG-1UBVA530E can be used in data center applications for workload acceleration. The FPGA fabric can implement custom accelerators for networking, storage, and AI inference. The ARM cores handle control plane tasks, while the high-speed transceivers provide connectivity to the network. The device's power efficiency makes it suitable for edge computing and smart NICs. With 154K+ logic cells, it can accelerate a variety of algorithms, offloading the CPU and reducing latency.
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Medical Imaging
In medical imaging, the XCZU3EG-1UBVA530E provides the processing power needed for real-time image reconstruction and enhancement. The FPGA fabric can implement high-speed filtering and transformation algorithms, while the ARM cores manage the system and user interface. The Mali-400 GPU can accelerate 2D/3D rendering. The device's low latency and high throughput are critical for applications like ultrasound and CT scanning. The secure processing capabilities also help protect patient data.
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추천 제품 요약
엔지니어링 참조 데이터: XCZU3EG-1UBVA530E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU3EG-2UBVA530E | XCZU3EG-1UBVA530I | XCZU3EV-1UBVA530E |
|---|---|---|---|---|
| Package | 530-FCBGA (16x9.5 mm) | 530-FCBGA (16x9.5 mm) - same | 530-FCBGA (16x9.5 mm) - same | 530-FCBGA (16x9.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -1 |
| Logic Cells | 154K+ | 154K+ | 154K+ | 154K+ |
| PS Clock Speed | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| PL Clock Speed | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| GPU | Mali-400 | Mali-400 | Mali-400 | Mali-400 |
주요 차별점
- Higher speed grade for performance (vs XCZU3EG-1UBVA530E)
- Industrial temperature grade for reliability (vs XCZU3EG-1UBVA530E)
- EV class for enhanced video processing (vs XCZU3EG-1UBVA530E)
설계 노트
The XCZU3EG-1UBVA530E requires multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with specific sequencing. Power up VCCINT first, followed by VCCAUX, and then VCCO. Use a power management IC like the TPS650864 to ensure correct sequencing and monitoring. Refer to the Zynq UltraScale+ Technical Reference Manual (UG1085) for detailed power requirements.
For the 530-FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Place decoupling capacitors close to the power pins, with a mix of 100nF and 10uF values. Ensure a solid ground plane and use via-in-pad for the BGA to improve thermal and electrical performance. Follow AMD's layout guidelines for DDR4 and transceiver routing.
The XCZU3EG-1UBVA530E can dissipate significant power, especially when using high-speed transceivers and heavy FPGA utilization. Use a heatsink or active cooling solution to keep the junction temperature within limits. The thermal resistance of the package is [DATA_NEEDED: thermal resistance]. Perform thermal simulation to ensure adequate cooling in your enclosure.
규정 준수 정보
RoHS compliant per distributor data. Other compliance information not specified in the provided data.
