XCZU3EG-1UBVA530E - Zynq UltraScale+ SoC FPGA | AMD
MPN: XCZU3EG-1UBVA530E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $149.99 | $149.99 |
| 10 | $135 | $1,350.00 |
| 100 | $120 | $12,000.00 |
| 500 | $110 | $55,000.00 |
| 1,000 | $100 | $100,000.00 |
Drop-in alternatives for XCZU3EG-1UBVA530E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU3EG-2UBVA530E
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-1UBVA530I
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EV-1UBVA530E
β Drop-Inπ Reference alternative (not in catalog)
XCZU3CG-1UBVA530E
β Drop-Inπ Reference alternative (not in catalog)
XCZU2EG-1UBVA530E
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-1UBVA530E Maximum Ratings & Electrical Characteristics
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 1.2 GHz (PS) |
| Programmable Logic Clock Speed | 500 MHz (PL) |
| Logic Cells | 154K+ |
| Package | 530-FCBGA (16x9.5 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage range] |
| Number of I/O | [DATA_NEEDED: number of I/O pins] |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] |
| RAM Size | [DATA_NEEDED: RAM size] |
| RoHS Status | Compliant |
| Series | Zynq UltraScale+ MPSoC |
| Speed Grade | -1 |
| Core Architecture | ARM Cortex-A53, ARM Cortex-R5 |
XCZU3EG-1UBVA530E Pin Configuration
| Pin A1 | VCCINT β Internal core supply voltage |
| Pin A2 | GND β Ground |
| Pin B1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin C1 | IO_L1P_T0 β Differential I/O pair, positive |
| Pin C2 | IO_L1N_T0 β Differential I/O pair, negative |
| Pin D1 | MIO[0] β Multiplexed I/O pin 0 |
| Pin E1 | PS_CLK β PS reference clock input |
| Pin F1 | PS_POR_B β PS power-on reset, active low |
| Pin G1 | PS_SRST_B β PS system reset, active low |
| Pin H1 | DDR_ACT_N β DDR4 activate command |
| Pin J1 | DDR_A[0] β DDR4 address bit 0 |
| Pin K1 | DDR_DQ[0] β DDR4 data bit 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU3EG-1UBVA530E is suitable for 6 applications: Software-Defined Radio, Machine Vision, Industrial Automation, Aerospace and Defense, Data Center Acceleration, Medical Imaging.
Software-Defined Radio
The XCZU3EG-1UBVA530E is ideal for software-defined radio (SDR) systems. The quad-core ARM Cortex-A53 can handle control and protocol processing, while the FPGA fabric implements high-speed digital down/up conversion, filtering, and modulation. The 154K+ logic cells provide ample resources for complex signal processing chains. The high-speed transceivers enable direct connection to RF front-ends, and the 1.2 GHz PS clock ensures real-time performance. This SoC allows for a flexible, reconfigurable SDR platform that can adapt to different waveforms and standards.
Recommended
Machine Vision
In machine vision applications, the XCZU3EG-1UBVA530E excels by combining ARM cores for algorithm control and FPGA fabric for high-speed image processing. The programmable logic can implement pixel-level operations, such as filtering and edge detection, at high throughput. The 500 MHz PL clock and 154K+ logic cells enable real-time video processing. The device supports multiple camera interfaces via its flexible I/O, and the Mali-400 GPU can accelerate image processing tasks. This makes it suitable for industrial inspection, robotics, and autonomous systems.
Recommended
Industrial Automation
The XCZU3EG-1UBVA530E is well-suited for industrial automation, where it can serve as a central controller for robotics, PLCs, and motion control. The dual-core ARM Cortex-R5 provides real-time processing for deterministic control loops, while the Cortex-A53 runs the main application and HMI. The FPGA fabric can implement custom communication protocols, such as EtherCAT or PROFINET, with low latency. The device's robust I/O and industrial temperature options make it reliable in harsh environments. This SoC enables a single-chip solution for complex automation tasks.
Recommended
Aerospace and Defense
For aerospace and defense applications, the XCZU3EG-1UBVA530E offers a secure and reliable processing platform. The ARM cores can run safety-critical software, while the FPGA fabric implements custom signal processing and encryption. The device supports secure boot and bitstream encryption, protecting intellectual property. The 530-FCBGA package is suitable for ruggedized boards, and the device can operate over extended temperature ranges. This SoC is used in radar, electronic warfare, and avionics systems where performance and security are paramount.
Recommended
Data Center Acceleration
The XCZU3EG-1UBVA530E can be used in data center applications for workload acceleration. The FPGA fabric can implement custom accelerators for networking, storage, and AI inference. The ARM cores handle control plane tasks, while the high-speed transceivers provide connectivity to the network. The device's power efficiency makes it suitable for edge computing and smart NICs. With 154K+ logic cells, it can accelerate a variety of algorithms, offloading the CPU and reducing latency.
Recommended
Medical Imaging
In medical imaging, the XCZU3EG-1UBVA530E provides the processing power needed for real-time image reconstruction and enhancement. The FPGA fabric can implement high-speed filtering and transformation algorithms, while the ARM cores manage the system and user interface. The Mali-400 GPU can accelerate 2D/3D rendering. The device's low latency and high throughput are critical for applications like ultrasound and CT scanning. The secure processing capabilities also help protect patient data.
Recommended
Recommended Products Summary
Engineering reference data for XCZU3EG-1UBVA530E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU3EG-2UBVA530E | XCZU3EG-1UBVA530I | XCZU3EV-1UBVA530E |
|---|---|---|---|---|
| Package | 530-FCBGA (16x9.5 mm) | 530-FCBGA (16x9.5 mm) - same | 530-FCBGA (16x9.5 mm) - same | 530-FCBGA (16x9.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -1 |
| Logic Cells | 154K+ | 154K+ | 154K+ | 154K+ |
| PS Clock Speed | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| PL Clock Speed | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| GPU | Mali-400 | Mali-400 | Mali-400 | Mali-400 |
| Temperature Grade | [DATA_NEEDED] | [DATA_NEEDED] | Industrial | [DATA_NEEDED] |
Key Differentiators
- Higher speed grade for performance (vs XCZU3EG-1UBVA530E)
- Industrial temperature grade for reliability (vs XCZU3EG-1UBVA530E)
- EV class for enhanced video processing (vs XCZU3EG-1UBVA530E)
Design Notes
The XCZU3EG-1UBVA530E requires multiple power rails (VCCINT, VCCAUX, VCCO, etc.) with specific sequencing. Power up VCCINT first, followed by VCCAUX, and then VCCO. Use a power management IC like the TPS650864 to ensure correct sequencing and monitoring. Refer to the Zynq UltraScale+ Technical Reference Manual (UG1085) for detailed power requirements.
For the 530-FCBGA package, use a high-layer-count PCB with controlled impedance for high-speed signals. Place decoupling capacitors close to the power pins, with a mix of 100nF and 10uF values. Ensure a solid ground plane and use via-in-pad for the BGA to improve thermal and electrical performance. Follow AMD's layout guidelines for DDR4 and transceiver routing.
The XCZU3EG-1UBVA530E can dissipate significant power, especially when using high-speed transceivers and heavy FPGA utilization. Use a heatsink or active cooling solution to keep the junction temperature within limits. The thermal resistance of the package is [DATA_NEEDED: thermal resistance]. Perform thermal simulation to ensure adequate cooling in your enclosure.
Compliance Information
RoHS compliant per distributor data. Other compliance information not specified in the provided data.
