XCZU7CG-L2FFVF1517E - Zynq UltraScale+ MPSoC CG | AMD
부품 번호: XCZU7CG-L2FFVF1517E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
XCZU7CG-L2FFVF1517E 개요
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processors with FPGA fabric on a single die. The CG variant is the cost-optimized family, offering a balanced mix of processing system (PS) and programmable logic (PL) resources. The device supports a wide range of operating systems including Linux, VxWorks, and bare-metal applications, making it a versatile choice for edge computing, industrial automation, and aerospace systems.
Key features of the XCZU7CG-L2FFVF1517E include 504K+ logic cells, 533 MHz maximum frequency for the Cortex-A53 cores, and 1.3 GHz for the Cortex-R5 cores. The device also includes 256 KB of on-chip memory, high-speed transceivers, and a comprehensive set of I/O interfaces. The 'L2' speed grade indicates a high-performance variant, and the 'E' suffix denotes an extended temperature range (-40°C to +100°C).
From an architectural perspective, the XCZU7CG integrates a quad-core ARM Cortex-A53 MPCore with CoreSight debug, a dual-core ARM Cortex-R5 with CoreSight, and a Mali-400 MP2 GPU. The programmable logic is based on the UltraScale+ architecture, featuring 6-input LUTs, block RAM, and DSP slices. The device supports PCIe Gen3, USB 3.0, DisplayPort, and Gigabit Ethernet, providing extensive connectivity options.
Typical applications include software-defined radio, machine vision, autonomous driving, and data center acceleration. The combination of high-performance processing and reconfigurable logic allows designers to implement complex algorithms with low latency and high throughput.
When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides comprehensive reference designs and documentation to facilitate development.
드롭인 대체품: XCZU7CG-L2FFVF1517E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XCZU7CG-2FFVF1517E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU7EG-L2FFVF1517E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU7EV-L2FFVF1517E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XCZU7CG-2FBVB900E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU7CG-L2FBVB900E
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XCZU7CG-L2FFVF1517E 최대 정격 & 전기적 특성
| Family | Zynq UltraScale+ MPSoC CG |
| Core Processor | Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 504K+ |
| Maximum Frequency (A53) | 533 MHz |
| Maximum Frequency (R5) | 1.3 GHz |
| 패키지 | 1517-FCBGA (40x40 mm) |
| Number of Terminals | 1517 |
| On-Chip Memory | 256 KB |
| 동작 온도 | -40°C to +100°C (E grade) |
| Speed Grade | L2 |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
XCZU7CG-L2FFVF1517E 핀 구성
| 핀 A1 | VCCINT — Internal core voltage supply |
| 핀 A2 | GND — Ground |
| 핀 B1 | VCCO_0 — I/O bank 0 supply |
| 핀 C1 | MIO[0] — Multiplexed I/O pin |
| 핀 D1 | PS_CLK — Processor system clock input |
| 핀 E1 | PS_POR_B — Power-on reset for PS |
| 핀 F1 | PS_SRST_B — System reset for PS |
| 핀 G1 | DDR_ADDR[0] — DDR memory address |
| 핀 H1 | DDR_BA[0] — DDR bank address |
| 핀 J1 | DDR_CK — DDR clock |
| 핀 K1 | DDR_DQ[0] — DDR data |
| 핀 L1 | DDR_DQS[0] — DDR data strobe |
일반적인 애플리케이션
XCZU7CG-L2FFVF1517E 적합 용도: 6 애플리케이션s: Software-Defined Radio, Machine Vision, Autonomous Driving, Data Center Acceleration, Aerospace and Defense, Industrial IoT Gateway.
Software-Defined Radio
The XCZU7CG-L2FFVF1517E is ideal for software-defined radio (SDR) systems due to its high-performance ARM cores and reconfigurable logic. The dual Cortex-A53 processors handle baseband processing and protocol stacks, while the FPGA fabric implements digital down/up conversion, filtering, and modulation. With 504K logic cells, it can support multiple channels and complex waveforms. The device's high-speed transceivers enable direct RF sampling and connectivity to RF front-ends. Its extended temperature range makes it suitable for field-deployed SDR units.
추천
Machine Vision
In machine vision systems, the XCZU7CG-L2FFVF1517E provides a powerful platform for real-time image processing. The programmable logic can implement image sensors interfaces, pixel preprocessing, and feature extraction, while the ARM cores run vision algorithms and control logic. The device's 504K logic cells and DSP slices enable high-throughput processing of 4K video streams. Its low-latency processing capability is critical for industrial inspection and robotics. The extended temperature range ensures reliable operation in factory environments.
추천
Autonomous Driving
The XCZU7CG-L2FFVF1517E is well-suited for autonomous driving applications, where it can fuse data from multiple sensors such as cameras, LiDAR, and radar. The FPGA fabric accelerates sensor preprocessing and fusion algorithms, while the ARM cores run decision-making software. With 504K logic cells, it can implement neural network accelerators for object detection. The device's automotive-grade variants (with 'A' suffix) are available for harsh environments. Its high-speed interfaces support GMSL2 and PCIe for sensor connectivity.
추천
Data Center Acceleration
The XCZU7CG-L2FFVF1517E can be used in data center applications for workload acceleration, such as network processing, storage, and AI inference. Its programmable logic allows custom accelerators to be implemented, offloading tasks from CPUs. The device supports PCIe Gen3, enabling high-speed host connectivity. With 504K logic cells, it can handle complex packet processing and encryption. The ARM cores manage control plane functions, while the FPGA handles data plane. This heterogeneous architecture provides flexibility and performance for cloud and edge data centers.
추천
Aerospace and Defense
The XCZU7CG-L2FFVF1517E is designed for aerospace and defense applications, offering high reliability and extended temperature range. It can be used in radar, electronic warfare, and secure communications systems. The FPGA fabric enables real-time signal processing, while the ARM cores handle mission management. The device's security features include AES and RSA encryption for secure boot. Its 1517-ball FCBGA package is suitable for ruggedized boards. The 'E' grade ensures operation from -40°C to +100°C, meeting military standards.
추천
Industrial IoT Gateway
The XCZU7CG-L2FFVF1517E serves as a powerful industrial IoT gateway, aggregating data from multiple sensors and protocols. The ARM cores run Linux and protocol stacks (e.g., OPC-UA, MQTT), while the FPGA implements custom interfaces for fieldbuses like EtherCAT and PROFINET. With 504K logic cells, it can handle protocol conversion and edge analytics. The device's multiple Gigabit Ethernet ports enable high-speed connectivity. Its extended temperature range and reliability make it suitable for factory floors and remote installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: XCZU7CG-L2FFVF1517E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XCZU7CG-2FFVF1517E | XCZU7EG-L2FFVF1517E | XCZU7EV-L2FFVF1517E |
|---|---|---|---|---|
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 504K+ | 504K+ | 504K+ | 504K+ |
| Core Processor | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 |
| Maximum Frequency (A53) | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Maximum Frequency (R5) | 1.3 GHz | 1.3 GHz | 1.3 GHz | 1.3 GHz |
| Speed Grade | L2 | 2 | L2 | L2 |
| Video Codec | No | No | Yes | Yes |
주요 차별점
- Cost-optimized CG variant (vs XCZU7EV-L2FFVF1517E)
- L2 speed grade for lower power (vs XCZU7CG-2FFVF1517E)
- Extended temperature range (vs XCZU7CG-2FFVF1517E)
설계 노트
The XCZU7CG-L2FFVF1517E requires multiple power rails: VCCINT (0.85V), VCCAUX (1.8V), VCCO (1.2V-3.3V), and VCCBRAM (0.85V). Use a dedicated power management IC with sequencing to ensure proper power-up order. AMD recommends using the PMIC like TPS65023 or similar. Decouple each rail with 100nF and 10uF capacitors close to the pins.
The FCBGA package can dissipate significant power, especially when the FPGA fabric is heavily utilized. Use a heatsink with thermal interface material and ensure adequate airflow. The maximum junction temperature is 100°C for the E grade. Perform thermal simulation using AMD's power estimator to determine cooling requirements.
For high-speed signals like DDR4 and transceivers, use controlled impedance traces and minimize via stubs. Follow AMD's PCB design guidelines (UG583) for layout. Place decoupling capacitors as close as possible to the power pins. Use a multi-layer board with dedicated ground and power planes.
규정 준수 정보
RoHS compliant per Jotrin Electronics. AEC-Q100 not applicable as this is not an automotive-grade part. Other compliance data not available in provided sources.