XCZU7CG-L2FFVF1517E - Zynq UltraScale+ MPSoC CG | AMD
MPN: XCZU7CG-L2FFVF1517E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1100 | $110,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $990 | $990,000.00 |
Drop-in alternatives for XCZU7CG-L2FFVF1517E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU7CG-2FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7EG-L2FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7EV-L2FFVF1517E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7CG-2FBVB900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7CG-L2FBVB900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU7CG-L2FFVF1517E Maximum Ratings & Electrical Characteristics
| Family | Zynq UltraScale+ MPSoC CG |
| Core Processor | Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Logic Cells | 504K+ |
| Maximum Frequency (A53) | 533 MHz |
| Maximum Frequency (R5) | 1.3 GHz |
| Package | 1517-FCBGA (40x40 mm) |
| Number of Terminals | 1517 |
| On-Chip Memory | 256 KB |
| Operating Temperature | -40Β°C to +100Β°C (E grade) |
| Speed Grade | L2 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
XCZU7CG-L2FFVF1517E Pin Configuration
| Pin A1 | VCCINT β Internal core voltage supply |
| Pin A2 | GND β Ground |
| Pin B1 | VCCO_0 β I/O bank 0 supply |
| Pin C1 | MIO[0] β Multiplexed I/O pin |
| Pin D1 | PS_CLK β Processor system clock input |
| Pin E1 | PS_POR_B β Power-on reset for PS |
| Pin F1 | PS_SRST_B β System reset for PS |
| Pin G1 | DDR_ADDR[0] β DDR memory address |
| Pin H1 | DDR_BA[0] β DDR bank address |
| Pin J1 | DDR_CK β DDR clock |
| Pin K1 | DDR_DQ[0] β DDR data |
| Pin L1 | DDR_DQS[0] β DDR data strobe |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU7CG-L2FFVF1517E is suitable for 6 applications: Software-Defined Radio, Machine Vision, Autonomous Driving, Data Center Acceleration, Aerospace and Defense, Industrial IoT Gateway.
Software-Defined Radio
The XCZU7CG-L2FFVF1517E is ideal for software-defined radio (SDR) systems due to its high-performance ARM cores and reconfigurable logic. The dual Cortex-A53 processors handle baseband processing and protocol stacks, while the FPGA fabric implements digital down/up conversion, filtering, and modulation. With 504K logic cells, it can support multiple channels and complex waveforms. The device's high-speed transceivers enable direct RF sampling and connectivity to RF front-ends. Its extended temperature range makes it suitable for field-deployed SDR units.
Recommended
Machine Vision
In machine vision systems, the XCZU7CG-L2FFVF1517E provides a powerful platform for real-time image processing. The programmable logic can implement image sensors interfaces, pixel preprocessing, and feature extraction, while the ARM cores run vision algorithms and control logic. The device's 504K logic cells and DSP slices enable high-throughput processing of 4K video streams. Its low-latency processing capability is critical for industrial inspection and robotics. The extended temperature range ensures reliable operation in factory environments.
Recommended
Autonomous Driving
The XCZU7CG-L2FFVF1517E is well-suited for autonomous driving applications, where it can fuse data from multiple sensors such as cameras, LiDAR, and radar. The FPGA fabric accelerates sensor preprocessing and fusion algorithms, while the ARM cores run decision-making software. With 504K logic cells, it can implement neural network accelerators for object detection. The device's automotive-grade variants (with 'A' suffix) are available for harsh environments. Its high-speed interfaces support GMSL2 and PCIe for sensor connectivity.
Recommended
Data Center Acceleration
The XCZU7CG-L2FFVF1517E can be used in data center applications for workload acceleration, such as network processing, storage, and AI inference. Its programmable logic allows custom accelerators to be implemented, offloading tasks from CPUs. The device supports PCIe Gen3, enabling high-speed host connectivity. With 504K logic cells, it can handle complex packet processing and encryption. The ARM cores manage control plane functions, while the FPGA handles data plane. This heterogeneous architecture provides flexibility and performance for cloud and edge data centers.
Recommended
Aerospace and Defense
The XCZU7CG-L2FFVF1517E is designed for aerospace and defense applications, offering high reliability and extended temperature range. It can be used in radar, electronic warfare, and secure communications systems. The FPGA fabric enables real-time signal processing, while the ARM cores handle mission management. The device's security features include AES and RSA encryption for secure boot. Its 1517-ball FCBGA package is suitable for ruggedized boards. The 'E' grade ensures operation from -40Β°C to +100Β°C, meeting military standards.
Recommended
Industrial IoT Gateway
The XCZU7CG-L2FFVF1517E serves as a powerful industrial IoT gateway, aggregating data from multiple sensors and protocols. The ARM cores run Linux and protocol stacks (e.g., OPC-UA, MQTT), while the FPGA implements custom interfaces for fieldbuses like EtherCAT and PROFINET. With 504K logic cells, it can handle protocol conversion and edge analytics. The device's multiple Gigabit Ethernet ports enable high-speed connectivity. Its extended temperature range and reliability make it suitable for factory floors and remote installations.
Recommended
Recommended Products Summary
Engineering reference data for XCZU7CG-L2FFVF1517E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU7CG-2FFVF1517E | XCZU7EG-L2FFVF1517E | XCZU7EV-L2FFVF1517E |
|---|---|---|---|---|
| Package | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) | 1517-FCBGA (40x40 mm) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 504K+ | 504K+ | 504K+ | 504K+ |
| Core Processor | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 | Dual ARM Cortex-A53, Dual Cortex-R5 |
| Maximum Frequency (A53) | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Maximum Frequency (R5) | 1.3 GHz | 1.3 GHz | 1.3 GHz | 1.3 GHz |
| Speed Grade | L2 | 2 | L2 | L2 |
| Video Codec | No | No | Yes | Yes |
Key Differentiators
- Cost-optimized CG variant (vs XCZU7EV-L2FFVF1517E)
- L2 speed grade for lower power (vs XCZU7CG-2FFVF1517E)
- Extended temperature range (vs XCZU7CG-2FFVF1517E)
Design Notes
The XCZU7CG-L2FFVF1517E requires multiple power rails: VCCINT (0.85V), VCCAUX (1.8V), VCCO (1.2V-3.3V), and VCCBRAM (0.85V). Use a dedicated power management IC with sequencing to ensure proper power-up order. AMD recommends using the PMIC like TPS65023 or similar. Decouple each rail with 100nF and 10uF capacitors close to the pins.
The FCBGA package can dissipate significant power, especially when the FPGA fabric is heavily utilized. Use a heatsink with thermal interface material and ensure adequate airflow. The maximum junction temperature is 100Β°C for the E grade. Perform thermal simulation using AMD's power estimator to determine cooling requirements.
For high-speed signals like DDR4 and transceivers, use controlled impedance traces and minimize via stubs. Follow AMD's PCB design guidelines (UG583) for layout. Place decoupling capacitors as close as possible to the power pins. Use a multi-layer board with dedicated ground and power planes.
Compliance Information
RoHS compliant per Jotrin Electronics. AEC-Q100 not applicable as this is not an automotive-grade part. Other compliance data not available in provided sources.
