XPC8255CZUIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP
부품 번호: XPC8255CZUIFBC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92.5 | $92,500.00 |
XPC8255CZUIFBC 개요
What is a PowerQUICC II communications processor? The PowerQUICC II (MPC82xx) is a family of integrated communications processors that combine a high-performance PowerPC embedded core with a CPM (Communications Processor Module). The CPM offloads peripheral handling from the core, allowing the CPU to focus on protocol processing, while the integrated SIU, memory controller, and serial interfaces handle DMA-driven I/O for telecom and datacom designs. This MPU belongs to the broader hierarchy: microcontroller -> embedded microprocessor -> communications processor -> SoC.
Key features include a 32-bit PowerPC G2 core at 200 MHz, integrated memory controller for SDRAM, ROM/Flash, and bus arbitration, a CPM supporting multiple Fast Ethernet, UART, HDLC, and ATM/PCI interfaces, 3.3V I/O tolerance with 1.8V core supply, and a 480-pin TBGA package that exposes a thermal pad for conduction-cooled designs. The 0.29 micrometer CMOS process balances power and integration density.
Architecturally, the device separates the G2 core from the CPM via an internal bus, enabling deterministic peripheral handling. The 32-bit address space supports up to 4 GB of physical memory. Integrated PCI and 10/100 Ethernet MACs make the part suitable for routers, DSLAMs, and mid-range switching platforms where deterministic throughput and low BOM cost matter more than raw clock speed.
Typical applications include enterprise routers, DSL access multiplexers, ATM switches, industrial control gateways, and legacy telecommunications backplane designs. The part remains in production through authorized distributors like Rochester Electronics for long-life-cycle programs.
When designing with this device, allocate a minimum 4-layer PCB stack-up with continuous power planes beneath the TBGA land pattern, use 0.1 uF ceramic bypass capacitors on every VDD/VCC pin within 5 mm of the package, and provide a 25-50 mm^2 copper thermal pad tied to the GND plane. Verify boot configuration and reset timing against the MPC8260A HiP4 hardware specifications before layout freeze.
드롭인 대체품: XPC8255CZUIFBC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8255CZUIFBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8255AZUIFBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8255CVRIFBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8255ACZUIFBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8260AVPIHFBC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XPC8255CZUIFBC 최대 정격 & 전기적 특성
| Core Architecture | PowerPC G2 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 200 MHz |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| Process Technology | 0.29 micrometer CMOS |
| 패키지 | 480-TBGA (37.5 x 37.5 mm) with exposed pad |
| Pin/Ball Count | 480 |
| Series | MPC82xx (PowerQUICC II) |
| Communications Processor Module | Yes (CPM with multi-channel serial) |
| Memory Controller | SDRAM, ROM/Flash, bus arbitration |
| Integrated Ethernet | 10/100 MAC (Fast Ethernet) |
| Integrated PCI | Yes |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
XPC8255CZUIFBC 480-tbga (37.5 x 37.5 mm) with exposed pad 핀 구성 가이드
XPC8255CZUIFBC(480-tbga (37.5 x 37.5 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XPC8255CZUIFBC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XPC8255CZUIFBC 적합 용도: 7 애플리케이션s: Enterprise Router and Gateway, DSL Access Multiplexer (DSLAM), Industrial Control Gateway, Telecom Backplane Switching Platform, VoIP Media Gateway, Legacy Network Attached Storage (NAS), ATM Switch Line Card.
Enterprise Router and Gateway
The XPC8255CZUIFBC is well-suited for enterprise router and gateway designs that demand deterministic CPM-driven packet handling at 200 MHz. Its integrated 10/100 Ethernet MAC and PCI 2.1 controller allow direct attachment of WAN PHY and expansion cards without external bridges, reducing BOM. Placed on a 4-layer PCB with continuous ground planes beneath the 480-TBGA, the part delivers 100 Mbps wire-speed routing with low latency. Compared to general-purpose microprocessors, the integrated CPM offloads HDLC and ATM framing, freeing the G2 core for routing-table and policy processing.
추천
DSL Access Multiplexer (DSLAM)
In DSLAM line-card designs, the XPC8255CZUIFBC's Communications Processor Module handles multi-channel HDLC and ATM AAL1/AAL2 segmentation. The 200 MHz G2 core runs routing and QoS classification while the CPM drives up to four T1/E1 ports via TDM channels. The 3.3 V I/O simplifies interface to legacy DSL PHY chips and reduces level shifters. The 480-TBGA exposed pad supports the 105C junction temperature needed at the bottom of stacked DSLAM shelves, while 1.8 V core keeps per-port power under 2 W.
추천
Industrial Control Gateway
For industrial control gateways bridging fieldbus to Ethernet, the XPC8255CZUIFBC offers deterministic serial-channel handling via the CPM and PCI expansion for industrial I/O cards. The 32-bit data bus and 1.8 V/3.3 V dual supply allow interfacing to SDRAM and legacy peripherals without external regulators. The 480-TBGA package provides mechanical robustness in vibration-prone factory environments when properly socketed or soldered. Designers use the integrated Ethernet MAC for PROFINET/EtherNet/IP gateway and the PCI bus for fieldbus master cards.
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Telecom Backplane Switching Platform
In mid-range telecom switching platforms, the XPC8255CZUIFBC functions as the central processor for system control and H.110/TDM backplane switching. The CPM's multi-channel serial ports aggregate T1/E1 and E1/T1 framers directly, while the PCI bus connects fabric switch ASICs. The 480-TBGA exposed thermal pad handles the 8-10 W typical dissipation when running full CPM load at 200 MHz. Compared to a CPU-plus-FPGA split design, this part reduces component count by 30% and simplifies firmware development using existing PowerQUICC II BSPs.
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VoIP Media Gateway
For VoIP media gateways converting TDM voice to SIP/RTP, the XPC8255CZUIFBC's CPM DSP-extension mode handles G.711/G.729 codecs while the G2 core runs signaling stacks. The integrated 10/100 Ethernet MAC connects directly to the network processor or PHY, and the PCI bus attaches DSP daughtercards for higher-channel-density variants. The 200 MHz clock rate supports up to 64 simultaneous VoIP channels with proper firmware optimization. Industrial temperature grades make this part suitable for carrier-grade equipment installed in uncontrolled central offices.
추천
Legacy Network Attached Storage (NAS)
In legacy NAS controllers, the XPC8255CZUIFBC acts as the system-on-chip with integrated Ethernet and PCI for SATA/RAID host bus adapters. The 32-bit memory bus addresses up to 4 GB of SDRAM for filesystem caching, while the G2 core runs embedded Linux or VxWorks. The 480-TBGA package supports the thermal envelope of a fully loaded RAID controller card. The 1.8 V core voltage keeps total board power under 15 W, suiting small-form-factor NAS appliances for small business and SOHO use cases.
추천
ATM Switch Line Card
In ATM switch line cards, the XPC8255CZUIFBC's CPM runs the AAL1/AAL2/AAL5 segmentation and reassembly in hardware, offloading the G2 core for cell routing and connection admission control. The integrated PCI 2.1 bus connects to fabric switch ASICs at up to 66 MHz, and the multi-channel serial ports aggregate DS1/E1/DS3 traffic. The 480-TBGA exposed pad supports the thermal load of 32-port line cards operating at 200 MHz full duty. Compared to ASIC-only designs, this part allows firmware upgrades for new traffic classes.
추천
추천 제품 요약
엔지니어링 참조 데이터: XPC8255CZUIFBC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8255CZUIFBC | MPC8255AZUIFBC | MPC8255CVRIFBC | MPC8255ACZUIFBC | MPC8260AVPIHFBC |
|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 266 MHz |
| Core Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Series | MPC82xx PowerQUICC II | MPC82xx PowerQUICC II | MPC82xx PowerQUICC II | MPC82xx PowerQUICC II | MPC82xx PowerQUICC II | MPC82xx PowerQUICC II |
| Process Technology | 0.29 micrometer | 0.29 micrometer | 0.29 micrometer | 0.29 micrometer | 0.29 micrometer | 0.29 micrometer |
| Integrated Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
| Integrated PCI | Yes (PCI 2.1) | Yes (PCI 2.1) | Yes (PCI 2.1) | Yes (PCI 2.1) | Yes (PCI 2.1) | Yes (PCI 2.1) |
주요 차별점
- Single-source 480-TBGA compatibility across the MPC8255 family (vs MPC8260AVPIHFBC)
- Integrated Communications Processor Module (CPM) with multi-channel serial (vs MPC8260AVPIHFBC)
- Long-term authorized supply through Rochester Electronics (vs MPC8255CZUIFBC (Freescale))
- Low-power 1.8 V core for fanless telecom designs (vs MPC8260AVPIHFBC)
설계 노트
The 480-TBGA exposed thermal pad must be soldered to a continuous ground plane with at least 25 mm^2 of copper area on the top layer and thermal vias (0.3 mm pitch, 0.5 mm drill) to inner ground planes. Estimated: at 1.8 V core, 200 MHz, full CPM load, total power is approximately 5-6 W; without adequate thermal relief the junction can exceed 105C. Use a 4-layer stack-up with 1 oz copper on outer layers for production designs.
Allocate a minimum 4-layer PCB stack-up with dedicated VDD (1.8 V) and VCC (3.3 V) power planes placed adjacent to a continuous ground plane for low inductance. Place 0.1 uF ceramic bypass capacitors within 5 mm of every VDD/VCC pin pair, plus bulk 10-22 uF tantalum or polymer capacitors near the package corners. Maintain 50 ohm controlled impedance on PCI bus traces and 60 ohm on the memory bus; the 480-BGA 1.27 mm pitch requires 0.1 mm trace/space design rules.
The dual-rail 1.8 V core and 3.3 V I/O supplies must be sequenced per the MPC8260A HiP4 hardware specifications to prevent latch-up. Power-on reset (PORESET) must remain asserted until both rails are stable within 5 percent of nominal, and the reset configuration words must be sampled within the specified setup window. Use a supervisory circuit such as the TPS3307 to monitor both rails and gate the reset. Estimated: ramp time of 10-50 ms with monotonic edges prevents core brown-out.
The 32-bit memory bus can operate at up to 100 MHz; route address, data, and control signals in matched-length groups (within 25 ps skew) on inner stripline layers. Use point-to-point topology where possible and source-series termination (22-33 ohm) at the driver for the address/command group. Keep PCI bus trace lengths under 50 mm and isolate from the memory bus with ground guard traces. Series termination on clocks is mandatory; do not use stubs longer than 6 mm on any high-speed net.
Common pitfalls when designing with this part include: (1) failing to solder the center thermal pad which causes overheating, (2) misconfiguring reset configuration words which prevents boot, (3) leaving unused CPM channels unterminated which couples noise into the PCI bus, and (4) violating the 1.8 V core supply tolerance which causes undefined CPM behavior. Always verify the configuration word source against the schematic and use pull-up resistors on HRESET and TRST as specified in the hardware specifications.
규정 준수 정보
RoHS and REACH compliant per manufacturer datasheet. Not AEC-Q100 qualified - this part targets communications infrastructure, not automotive. Conflict minerals compliance per NXP supplier declarations.
