10AS032H1F35E1HG vs 10AS032H2F34E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H1F35E1HG disebabkan oleh Intel dan 10AS032H2F34E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032H1F35E1HG | 10AS032H2F34E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria 10 SX | — |
| Device Type | System on Chip (SoC) FPGA | — |
| Logic Elements | 320K | 320,000 |
| Hard Processor Subsystem (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Kemasan | 1152-FBGA, FC (Flip-Chip BGA), 35x35 mm | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| User I/O Count | 384 | — |
| Process Technology | 20nm TSMC | — |
| Embedded Memory | M20K blocks (variable, density per family) | — |
| DSP Blocks | Variable-precision DSP blocks | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | Multi-gigabit transceivers (up to 24 channels, family-wide) | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| External Memory Interfaces | DDR4, DDR3, RLDRAM3, QDRII+ | — |
| Hard Memory Controller | Yes | — |
| Hard PCIe | PCI Express Gen3 controllers (hard IP) | — |
| Partial Reconfiguration | Supported | — |
| Suhu Operasi | Industrial / Extended grade (per part suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria 10 SX |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |