10AS032H1F35E1HG vs 10AS032H2F34E2LG مقایسه
مقایسه دقیق کنار به کنار 10AS032H1F35E1HG توسط Intel و 10AS032H2F34E2LG توسط Intel. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
مقایسه مشخصات
| پارامتر | 10AS032H1F35E1HG | 10AS032H2F34E2LG |
|---|---|---|
| برند | Intel | Intel |
| دسته‌بندی | FPGA & CPLD | FPGA & CPLD |
| وضعیت چرخه عمر | فعال | فعال |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria 10 SX | — |
| Device Type | System on Chip (SoC) FPGA | — |
| Logic Elements | 320K | 320,000 |
| Hard Processor Subsystem (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| بسته‌بندی | 1152-FBGA, FC (Flip-Chip BGA), 35x35 mm | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| User I/O Count | 384 | — |
| Process Technology | 20nm TSMC | — |
| Embedded Memory | M20K blocks (variable, density per family) | — |
| DSP Blocks | Variable-precision DSP blocks | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | Multi-gigabit transceivers (up to 24 channels, family-wide) | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| External Memory Interfaces | DDR4, DDR3, RLDRAM3, QDRII+ | — |
| Hard Memory Controller | Yes | — |
| Hard PCIe | PCI Express Gen3 controllers (hard IP) | — |
| Partial Reconfiguration | Supported | — |
| دمای کاری | Industrial / Extended grade (per part suffix) | — |
| نوع نصب | Surface Mount (BGA) | Surface Mount (BGA) |
| وضعیت RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Arria 10 SX |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |