10AX090N2F45E2LG vs 10AX090N2F45I1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX090N2F45E2LG disebabkan oleh Intel dan 10AX090N2F45I1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX090N2F45E2LG | 10AX090N2F45I1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | 24 channels, up to 17.4 Gbps |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 3,456 |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | TSMC 20nm |
| Kemasan | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA (F45) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Status Lingkungan Hidup | Active | — |
| Embedded Memory | — | 59,234,304 bits |
| Maximum User I/Os | — | 768 |
| Transceiver Protocols | — | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 |
| Hard Memory Controllers | — | DDR3/DDR4 with ECC |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Status RoHS | — | Compliant |
| Configuration Scheme | — | JTAG, Active Serial, Passive Serial |