10AX115H2F34E2SG vs 10AX115H2F34E1SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115H2F34E2SG disebabkan oleh Intel dan 10AX115H2F34E1SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115H2F34E2SG | 10AX115H2F34E1SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | Up to 24 channels, 17.4 Gbps (per Arria 10 GX family) |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCIe Gen3 x8 (per family datasheet) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | — |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Kemasan | 1152-ball FCBGA (F34) 35x35 mm | 1152-BBGA, FCBGA (F34) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | Intel Arria 10 |
| Logic Elements (LEs) | — | 1,150,000 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Embedded Memory (Bits) | — | 68,857,856 |
| Number of I/O | — | 504 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 20 nm |
| Suhu Operasi | — | -40C to +100C (E1 grade, industrial) |
| Configuration Type | — | SRAM-based, requires external boot flash |