10AX115H2F34E2SG vs 10AX115H2F34E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H2F34E2SG sa pamamagitan ng Intel at 10AX115H2F34E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115H2F34E2SG | 10AX115H2F34E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | Up to 24 channels, 17.4 Gbps (per Arria 10 GX family) |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | PCIe Gen3 x8 (per family datasheet) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | — |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Packhaging | 1152-ball FCBGA (F34) 35x35 mm | 1152-BBGA, FCBGA (F34) |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Intel Arria 10 |
| Logic Elements (LEs) | — | 1,150,000 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Embedded Memory (Bits) | — | 68,857,856 |
| Number of I/O | — | 504 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 20 nm |
| Temperature na Operasyon | — | -40C to +100C (E1 grade, industrial) |
| Configuration Type | — | SRAM-based, requires external boot flash |