10AX115H2F34E2SG vs 10AX115H3F34E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115H2F34E2SG disebabkan oleh Intel dan 10AX115H3F34E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115H2F34E2SG | 10AX115H3F34E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | 10AX115 |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | Up to 17.4 Gbps (per Arria 10 datasheet) |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | Variable-precision DSP (per Arria 10 datasheet) |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Kemasan | 1152-ball FCBGA (F34) 35x35 mm | 1152-ball FCBGA (F34), 1.0 mm pitch |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA, reflow) |
| Status RoHS | Compliant | Compliant |
| Family | — | Arria 10 GX |
| Embedded Memory | — | 68,857,856 bits (67.7 Mbit) |
| User I/O Count | — | 504 |
| Hard IP | — | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller |
| Process Technology | — | 20 nm TSMC |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | E2 (commercial, mid-speed) |
| Suhu Operasi | — | 0C to +100C (commercial) |
| Aras MSL | — | MSL3 (per JEDEC J-STD-020) |