10AX115N2F40E1SG vs 10AX115N2F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115N2F40E1SG disebabkan oleh Intel dan 10AX115N2F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115N2F40E1SG | 10AX115N2F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,600 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Hardened floating-point, up to 1.5 TFLOPs |
| Maximum User I/O Pins | 600 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum Transceiver Data Rate | 17.4 Gbps (chip-to-chip) | — |
| Hard PCIe IP Blocks | PCIe Gen3 | — |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V (SmartVID) |
| Kemasan | 1517-BBGA, FCBGA (F40) | 1517-ball FC-BGA (F40) |
| Package Dimensions | 40 mm x 40 mm | 45 x 45 mm |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | N2 | -2 |
| Temperature Grade | E1 (commercial) | — |
| Suhu Hubungan Operasi | -40C to +100C | — |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| Adaptive Logic Modules (ALMs) | — | 42,720 |
| Embedded Memory | — | 68,857,856 bits (28.05 Mbits) |
| Maximum User I/O | — | 600 |
| High-Speed Transceivers | — | 24 (up to 17.4 Gbps) |
| Hardened PCIe | — | Gen3 x8, Gen2 x8 |
| Suhu Operasi | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2400 Mbps, DDR3, QDR IV, RLDRAM III |
| Configuration Interface | — | JTAG, Active Serial, Fast Passive Parallel |