10AX115N2F40I2SG vs 10AX115N2F40E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115N2F40I2SG disebabkan oleh Intel dan 10AX115N2F40E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115N2F40I2SG | 10AX115N2F40E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | — |
| Adaptive Logic Modules (ALMs) | 427,200 | 42,720 |
| Registers | 1,708,800 | — |
| User I/O | 600 | — |
| Transceiver Protocol | GX (up to 14.1 Gbps) | — |
| Transceiver Count | [DATA_NEEDED: transceiver count exact value] | — |
| DSP Blocks | Variable-precision, hard floating-point | Hardened floating-point, up to 1.5 TFLOPs |
| Kemasan | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch | 1517-ball FC-BGA (F40) |
| Suhu Operasi | -40C to +100C (Industrial) | 0C to 100C (E2 commercial) |
| Speed Grade | 2 | -2 |
| Process Technology | TSMC 20 nm | 20 nm |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | — |
| Embedded Memory | — | 68,857,856 bits (28.05 Mbits) |
| Maximum User I/O | — | 600 |
| High-Speed Transceivers | — | 24 (up to 17.4 Gbps) |
| Hardened PCIe | — | Gen3 x8, Gen2 x8 |
| Core Voltage | — | 0.9 V (SmartVID) |
| Package Dimensions | — | 45 x 45 mm |
| Memory Interfaces | — | DDR4 up to 2400 Mbps, DDR3, QDR IV, RLDRAM III |
| Configuration Interface | — | JTAG, Active Serial, Fast Passive Parallel |