10AX115R2F40E2SG vs 10AX115R3F40E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40E2SG disebabkan oleh Intel dan 10AX115R3F40E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40E2SG | 10AX115R3F40E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | 427,200 |
| Embedded Memory Bits | 68,857,856 | — |
| M20K Memory Blocks | 2,128 | 2,738 |
| MLAB Memory Bits | 8,812,800 | — |
| Variable-Precision DSP Blocks | 1,518 | — |
| 18 x 19 Multipliers | 3,036 | — |
| PLLs | 16 | — |
| User I/O Pins | 342 | — |
| Transceiver Count | 48 (max 96 for the family) | — |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) | — |
| Hard Memory Controllers | Yes | DDR4/DDR3/QDR IV |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 | — |
| Process Technology | 20 nm TSMC | TSMC 20 nm |
| Speed Grade | -2 (E2, mid) | -2 |
| Suhu Operasi | 0C to +100C (commercial) | — |
| Kemasan | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS | Compliant | — |
| Embedded Memory | — | 68,857,856 bits (8,557 Kbit) |
| DSP Blocks | — | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | — | 342 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Temperature Grade | — | E2 (0C to +100C) |
| Configuration Memory | — | Embedded (no external flash required for typical use) |
| Status RoHS | — | Compliant |