10AX115U2F45E1SG vs 10AX115U4F45E3LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115U2F45E1SG disebabkan oleh Intel dan 10AX115U4F45E3LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115U2F45E1SG | 10AX115U4F45E3LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 (variable-precision) |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | Up to 96 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | 17.4 Gbps |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | 20 nm TSMC |
| Core Voltage | 0.9 V | — |
| Kemasan | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,856 |
| User I/Os | — | 480 |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Speed Grade | — | E3 (fastest commercial) |
| Temperature Grade | — | L (extended commercial) |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |