10AX115U2F45E1SG vs 10AX115U4F45E3LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U2F45E1SG sa pamamagitan ng Intel at 10AX115U4F45E3LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115U4F45E3LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
10AX115U4F45E3LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115U2F45E1SG | 10AX115U4F45E3LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 (variable-precision) |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | — |
| Transceiver Channels | 24 | Up to 96 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | 17.4 Gbps |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | 20 nm TSMC |
| Core Voltage | 0.9 V | — |
| Packhaging | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-ball FCBGA |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,856 |
| User I/Os | — | 480 |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Speed Grade | — | E3 (fastest commercial) |
| Temperature Grade | — | L (extended commercial) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |