10AX115U3F45E2LG vs 10AX115U4F45E3LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115U3F45E2LG disebabkan oleh Intel dan 10AX115U4F45E3LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115U3F45E2LG | 10AX115U4F45E3LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | E3 (fastest commercial) |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 (variable-precision) |
| PCIe Hard IP | Gen3 x8/x16 | — |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | — |
| Suhu Operasi | 0C to +100C (Industrial, E2 grade) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| User I/Os | — | 480 |
| Kemasan | — | 1932-ball FCBGA |
| Process Node | — | 20 nm TSMC |
| Transceiver Channels | — | Up to 96 |
| Max Transceiver Data Rate | — | 17.4 Gbps |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Hard Memory Controllers | — | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| Temperature Grade | — | L (extended commercial) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |