10CL010YM164I7G vs 10CL016YM164I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10CL010YM164I7G disebabkan oleh Intel dan 10CL016YM164I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10CL010YM164I7G | 10CL016YM164I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 15,408 |
| Embedded Memory | 423,936 bits (414 Kb) | 516,096 bits (56 M9K blocks of 9 Kbits) |
| Embedded 18 x 18 Multipliers | 23 | — |
| Maximum User I/O Pins | 101 | — |
| General-Purpose PLLs | 2 | 4 |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Gambaran Suhu Operasi | -40 °C to 100 °C (Industrial) | -40C to +100C (industrial) |
| Kemasan | 164-ball MBGA (8 mm x 8 mm) | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| I/O Signaling Standards | LVCMOS 1.2 V to 3.3 V, LVDS | — |
| Process Node | TSMC low-power process | — |
| Status RoHS | Compliant | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for BGA) | 3 (per JEDEC J-STD-020) |
| Adaptive Logic Modules (ALMs) | — | 9,630 |
| Embedded 18x18 Multipliers | — | 56 |
| User I/O Pins | — | 87 |
| Process Technology | — | 60 nm low-power CMOS |
| Supply Voltage (Core) | — | 1.0 V to 1.2 V (internal) |
| I/O Bank Count | — | 8 |
| Static Power (Typical) | — | [DATA_NEEDED: typical static power mW at VCCINT=1.2V] |
| Bitstream Encryption | — | AES-256 supported |